NEC UPG2009TB

DATA SHEET
GaAs INTEGRATED CIRCUIT
µPG2009TB
L-BAND HIGH POWER SPDT SWITCH
DESCRIPTION
The µPG2009TB is an L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital
cellular or cordless telephone application. The device can operate from 500 MHz to 2.5 GHz, having the low insertion
loss and high isolation by 2.8 V control voltage.
FEATURES
• Low insertion loss
: LINS = 0.25 dB TYP. @ Vcont1/2 = 2.8 V/0 V, f = 1.0 GHz
LINS = 0.30 dB TYP. @ Vcont1/2 = 2.8 V/0 V, f = 2.0 GHz
• High isolation
: ISL = 28 dB TYP. @ Vcont1/2 = 2.8 V/0 V, f = 2.0 GHz
• High power
: Pin (0.1dB) = 34 dBm TYP. @ Vcont1/2 = 2.8 V/0 V, f = 1.0 GHz
• 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
APPLICATION
• L-band digital cellular or cordless telephone
• BuletoothTM, W-LAN and WLL applications
ORDERING INFORMATION
Part Number
µPG2009TB-E3
Package
6-pin super minimold
Marking
G2U
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 2, 3 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: µPG2009TB
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PG10191EJ02V0DS (2nd edition)
Date Published July 2004 CP(K)
Printed in Japan
The mark  shows major revised points.
 NEC Compound Semiconductor Devices, Ltd. 2002, 2004
µPG2009TB
PIN CONNECTIONS
3
2
1
G2U
(Top View)
Pin No.
Pin Name
1
OUT1
2
GND
3
OUT2
4
Vcont2
5
IN
6
Vcont1
(Bottom View)
4
4
3
5
5
2
6
6
1
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Control Voltage 1, 2
Symbol
Ratings
−6.0 to +6.0
Vcont1, 2
Unit
Note
V
Input Power
Pin
+36
dBm
Total Power Dissipation
Ptot
0.15
W
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Note Vcont1-Vcont2 ≤ 6.0 V
RECOMMENDED OPERATING RENGE (TA = +25°C)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Control Voltage (High)
Vcont(H)
+2.7
+2.8
+3.0
V
Control Voltage (Low)
Vcont(L)
−0.2
0
+0.2
V
2
Data Sheet PG10191EJ02V0DS
µPG2009TB
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont1 = 2.8 V, Vcont2 = 0 V or Vcont1 = 0 V, Vcont2 = 2.8 V, ZO = 50 Ω, Off chip DC blocking
capacitors value; 56 pF, unless otherwise specified)
Parameter
Insertion Loss
Symbol
LINS
Isolation
ISL
Test Conditions
MIN.
TYP.
MAX.
Unit
f = 0.5 to 1.0 GHz
−
0.25
0.45
dB
f = 2.0 GHz
−
0.30
0.50
dB
f = 2.5 GHz
−
0.40
−
dB
f = 0.5 to 2.0 GHz
24
28
−
dB
f = 2.5 GHz
−
25
−
dB
Input Return Loss
RLin
f = 0.5 to 2.5 GHz
15
20
−
dB
Output Return Loss
RLout
f = 0.5 to 2.5 GHz
15
20
−
dB
32.5
34
−
dBm
65
75
−
dBc
65
75
−
dBc
−
150
−
ns
−
1
50
µA
Input Power at 0.1 dB
Compression Point
Pin(0.1 dB)
Note
2nd Harmonics
f = 1.0 GHz,
Vcont = 2.8 V/0 V
2f0
f = 1.0 GHz, Vcont = 2.8 V/0 V,
Pin = 30.5 dBm
3rd Harmonics
3f0
f = 1.0 GHz, Vcont = 2.8 V/0 V,
Pin = 30.5 dBm
Switching Speed
tSW
Control Current
Icont
Vcont = 2.8 V/0 V, RF Non
Note Pin(0.1 dB) are measured the input power level when the insertion loss increase more 0.1 than that of linear
range. All other characteristics are measured in linear range.
Caution When the µPG2009TB is used it is necessary to use DC blocking capacitors for No.1 (OUT1), No.3
(OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to accommodate the
frequency of operation, bandwidth, switching speed and the condition with actual board of your
system.
The range of recommended DC blocking capacitor value is less than 100 pF.
Data Sheet PG10191EJ02V0DS
3
µPG2009TB
EVALUATION CIRCUIT
Vcont1 = 2.8 V, Vcont2 = 0 V or Vcont2 = 0 V, Vcont1 = 2.8 V, off chip DC blocking capacitors value C1 = 56 pF, C2
= 1 000 pF (Bypass), using NEC standard evaluation board.
C2
C1
5
IN
C1
4
Vcont2
G2U
6
Vcont1
1
OUT1
2
3
OUT2
C1
C2
EVALUATION BOARD
Vcont1
6pin SMM SPDT SW
OUT1
C2
C1
G2U
IN
C1
C1
C2
OUT2
NEC
Vcont2
TRUTH TABLE
4
Vcont1
Vcont2
IN−OUT1
IN−OUT2
Low
High
OFF
ON
High
Low
ON
OFF
Data Sheet PG10191EJ02V0DS
µPG2009TB
TYPICAL CHARACTERISTICS (TA = +25°C, Vcont1/2 = 2.8 V/0 V, Pin = 0 dBm, OUT2 side is 50 Ω
termination, unless otherwise specified)
ISOLATION vs. FEQUENCY
INPUT RETURN LOSS vs. FREQUENCY
log MAG
CH1 S21
10 dB/ REF 0 dB
1: –25.43 dB
1.0 GHz
2: –30.339 dB
1.5 GHz
3: –30.025 dB
2.0 GHz
4: –23.812 dB
2.5 GHz
5: –17.85 dB
3.0 GHz
0
Isolation ISL (dB)
Input Return Loss RLin (dB)
CH1 S11
1
–20
log MAG
1: –28.787 dB
1.0 GHz
2: –28.871 dB
1.5 GHz
3: –27.75 dB
2.0 GHz
4: –24.902 dB
2.5 GHz
5: –21.582 dB
3.0 GHz
0
–20
1
5
4
2
–40
START 0.500 000 000 GHz
3
2
–40
START 0.500 000 000 GHz
STOP 3.000 000 000 GHz
INSERTION LOSS vs. FREQUENCY
–2.0
CH1 S22
1: –0.620 dB
1.0 GHz
2: –0.744 dB
1.5 GHz
3: –0.881 dB
2.0 GHz
4: –1.057 dB
2.5 GHz
5: –1.302 dB
3.0 GHz
1
2
3
4
5
–4.0
START 0.500 000 000 GHz
4
5
STOP 3.000 000 000 GHz
OUTPUT RETERN LOSS vs. FREQUENCY
1 dB/ REF 0 dB
STOP 3.000 000 000 GHz
Output Return Loss RLout (dB)
Insertion Loss LINS (dB)
0
log MAG
3
Frequency f (GHz)
Frequency f (GHz)
CH1 S21
10 dB/ REF 0 dB
log MAG
10 dB/ REF 0 dB
1: –25.992 dB
1.0 GHz
2: –31.882 dB
1.5 GHz
3: –32.46 dB
2.0 GHz
4: –25.087 dB
2.5 GHz
5: –18.145 dB
3.0 GHz
0
1
–20
5
4
2
–40
START 0.500 000 000 GHz
Frequency f (GHz)
3
STOP 3.000 000 000 GHz
Frequency f (GHz)
Caution These characteristics values include the losses of the NEC evaluation board.
Remark The graphs indicate nominal characteristics.
Data Sheet PG10191EJ02V0DS
5
µPG2009TB
TYPICAL CHARACTERISTICS
(f = 2 GHz, OUT2 side is 50 Ω termination, unless otherwise specified)
RELATION BETWEEN CONTROL
VOLTAGE OF INSERSION LOSS
0
Insersion Loss LINS (dB)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Vcont = 2.4 V
Vcont = 2.8 V
Vcont = 3.2 V
0.9
25 26 27 28 29 30 31 32 33 34 35 36 37
0.8
Input Power Pin (dBm)
RELATION BETWEEN CONTROL
VOLTAGE OF 2nd HARMONICS
Vcont = 2.4 V
Vcont = 2.8 V
Vcont = 3.2 V
2nd Harmonics 2f0 (dBc)
10
20
30
40
50
60
70
0
10
3rd Harmonics 3f0 (dBc)
0
RELATION BETWEEN CONTROL
VOLTAGE OF 3rd HARMONICS
20
30
40
50
60
70
80
80
90
25 26 27 28 29 30 31 32 33 34 35 36 37
90
25 26 27 28 29 30 31 32 33 34 35 36 37
Input Power Pin (dBm)
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
6
Vcont = 2.4 V
Vcont = 2.8 V
Vcont = 3.2 V
Data Sheet PG10191EJ02V0DS
µPG2009TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1±0.1
0.2+0.1
–0.05
0.65
0.65
1.3
Data Sheet PG10191EJ02V0DS
0.15+0.1
–0.05
0 to 0.1
0.7
0.1 MIN.
0.9±0.1
2.0±0.2
1.25±0.1
7
µPG2009TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
VPS
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (package surface temperature)
: 215°C or below
Time at temperature of 200°C or higher
: 25 to 40 seconds
Preheating time at 120 to 150°C
: 30 to 60 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
IR260
VP215
WS260
Preheating temperature (package surface temperature) : 120°C or below
Partial Heating
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (pin temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Caution Do not use different soldering methods together (except for partial heating).
8
Data Sheet PG10191EJ02V0DS
HS350
µPG2009TB
Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A.
• The information in this document is current as of July, 2004. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
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(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
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M8E 00. 4 - 0110
Data Sheet PG10191EJ02V0DS
9
µPG2009TB
SAFETY INFORMATION ON THIS PRODUCT
Caution
GaAs Products
The product contains gallium arsenide, GaAs.
GaAs vapor and powder are hazardous to human health if inhaled or ingested.
• Do not destroy or burn the product.
• Do not cut or cleave off any part of the product.
• Do not crush or chemically dissolve the product.
• Do not put the product in the mouth.
Follow related laws and ordinances for disposal. The product should be excluded from general
industrial waste or household garbage.
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: [email protected] (sales and general)
[email protected] (technical)
Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: [email protected] (sales, technical and general)
FAX: +852-3107-7309
TEL: +852-3107-7303
Hong Kong Head Office
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
Taipei Branch Office
FAX: +82-2-558-5209
TEL: +82-2-558-2120
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
0406