NEC UPG2185T6R-E2-A

DATA SHEET
GaAs INTEGRATED CIRCUIT
μPG2185T6R
SPDT SWITCH FOR 2 GHz TO 6 GHz
<R>
DESCRIPTION
The μPG2185T6R is a GaAs MMIC SPDT (Single Pole Double Throw) switch which was designed for 2 GHz to 6
GHz applications, including dual-band wireless LAN. This device can operate frequency from 2 GHz to 6 GHz, having
the low insertion loss and high isolation.
This device is housed in a 6-pin plastic TSSON (Thin Shrink Small Out-line Non-leaded) package. And this
package is able to high-density surface mounting.
<R>
FEATURES
• Operating frequency
• Switch control voltage
: f = 2.0 to 6.0 GHz
: Vcont (H) = 2.8 to 3.3 V (3.0 V TYP.)
: Vcont (L) = −0.2 to 0.2 V (0 V TYP.)
• Low insertion loss
: Lins1 = 0.40 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Lins2 = 0.50 dB TYP. @ f = 2.5 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• High isolation
: ISL1 = 26 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: ISL2 = 25 dB TYP. @ f = 2.5 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• Handling power
: Pin (1 dB) = +30.5 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Pin (1 dB) = +30.5 dBm TYP. @ f = 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• High-density surface mounting : 6-pin plastic TSSON package (1.0 × 1.0 × 0.37 mm)
APPLICATIONS
• Wireless LAN (IEEE802.11a/b/g/n)
<R>
• UWB, near field communications
ORDERING INFORMATION
Part Number
Order Number
μPG2185T6R-E2
μPG2185T6R-E2-A
Package
Marking
6-pin plastic TSSON
G8
(Pb-Free)
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 5 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: μPG2185T6R
Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can
damage this device. This device must be protected at all times from ESD. Static charges may
easily produce potentials of several kilovolts on the human body or equipment, which can
discharge without detection. Industry-standard ESD precautions must be employed at all times.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PG10719EJ02V0DS (2nd edition)
Date Published August 2008 NS
Printed in Japan
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
2008
μPG2185T6R
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
1
G8
2
6
1
6
6
1
5
2
5
5
2
4
3
(Bottom View)
(Top View)
4
3
4
3
Pin No.
Pin Name
1
OUTPUT1
2
GND
3
OUTPUT2
4
Vcont2
5
INPUT
6
Vcont1
Remark Exposed pad : GND
TRUTH TABLE
Vcont1
Vcont2
INPUT−OUTPUT1
INPUT−OUTPUT2
High
Low
OFF
ON
Low
High
ON
OFF
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Switch Control Voltage
Symbol
Ratings
6.0
Vcont
Unit
Note
V
Input Power
Pin
+31
dBm
Power Dissipation
PD
150
mW
Operating Ambient Temperature
TA
−40 to +90
°C
Storage Temperature
Tstg
−55 to +150
°C
Note ⏐Vcont1 − Vcont2⏐ ≤ 6.0 V
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
<R>
Symbol
MIN.
TYP.
MAX.
Unit
Switch Control Voltage (H)
Vcont (H)
2.8
3.0
3.3
V
Switch Control Voltage (L)
Vcont (L)
−0.2
0
+0.2
V
f
2.0
−
6.0
GHz
Operating Frequency
2
Data Sheet PG10719EJ02V0DS
μPG2185T6R
<R>
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont
otherwise specified)
Parameter
(L)
= 0 V, Z0 = 50 Ω, DC blocking capacitors = 6 pF, unless
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Insertion Loss 1
Lins1
f = 2.0 to 2.5 GHz
−
0.40
0.60
dB
Insertion Loss 2
Lins2
f = 2.5 to 6.0 GHz
−
0.50
0.80
dB
Isolation 1 (INPUT−OFF Port)
ISL1
f = 2.0 to 2.5 GHz
23
26
−
dB
Isolation 2 (INPUT−OFF Port)
ISL2
f = 2.5 to 6.0 GHz
22
25
−
dB
Isolation 3 (OUTPUT1−OUTPUT2)
ISL3
f = 2.0 to 2.5 GHz
24
27
−
dB
Isolation 4 (OUTPUT1−OUTPUT2)
ISL4
f = 2.5 to 6.0 GHz
24
27
−
dB
Input Return Loss 1
RLin1
f = 2.0 to 2.5 GHz
15
20
−
dB
Input Return Loss 2
RLin2
f = 4.9 to 6.0 GHz
15
20
−
dB
Input Return Loss 3
RLin3
f = 2.5 to 4.9 GHz
12
17
−
dB
Output Return Loss 1
RLout1
f = 2.0 to 2.5 GHz
15
20
−
dB
Output Return Loss 2
RLout2
f = 4.9 to 6.0 GHz
15
20
−
dB
Output Return Loss 3
RLout3
f = 2.5 to 4.9 GHz
12
17
−
dB
f = 2.5 GHz
+26
+29
−
dBm
f = 6.0 GHz
+26
+29
−
dBm
f = 2.5 GHz
−
+30.5
−
dBm
f = 6.0 GHz
−
+30.5
−
dBm
0.1 dB Loss Compression
Note
Input Power
Pin (0.1 dB)
1 dB Loss Compression
Note
Input Power
Pin (1 dB)
Input 3rd Order Intercept Point
IIP3
f = 2.5 GHz
−
+50
−
dBm
Switch Control Current
Icont
RF None
−
0.1
1.0
μA
Switch Control Speed
tSW
50% CTL to 90/10%
−
20
100
ns
Note Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear
range.
Pin
(1 dB)
is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
Caution This device is used it is necessary to use DC blocking capacitors.
Data Sheet PG10719EJ02V0DS
3
μPG2185T6R
EVALUATION CIRCUIT
Vcont1
INPUT
Vcont2
1 000 pF
1 000 pF
6 pF
6
5
4
1
2
3
6 pF
6 pF
OUTPUT1
OUTPUT2
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
4
Data Sheet PG10719EJ02V0DS
μPG2185T6R
MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS
6-PIN PLASTIC TSSON (UNIT: mm)
MOUNTING PAD
0.15
0.225
0.15
0.125
0.15
0.65
1.2
0.15
0.45
0.35
0.35
1.2
SOLDER MASK
0.13
0.15
0.225
0.75
1.15
0.13
0.6
0.13
0.45
0.35
0.35
0.75
1.15
Solder thickness : 0.08 mm
Remark The mounting pad and solder mask layouts in this document are for reference only.
Data Sheet PG10719EJ02V0DS
5
μPG2185T6R
PACKAGE DIMENSIONS
6-PIN PLASTIC TSSON (T6R) (UNIT: mm)
(Top View)
1.0±0.1
1.0±0.1
(Bottom View)
0.15+0.07
–0.05
A
0.08 MIN.
A
0.15+0.07
–0.05
A
A
0.45 ±0.1
0.35±0.06
0.35±0.06
1.0±0.1
0.08 MIN.
1.0±0.1
0.13±0.07
0.175±0.075
0.23±0.07
Remark A > 0
6
Data Sheet PG10719EJ02V0DS
0.37+0.03
–0.05
μPG2185T6R
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120°C or below
Partial Heating
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10719EJ02V0DS
7
μPG2185T6R
• The information in this document is current as of August, 2008. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
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property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
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customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
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redundancy, fire-containment and anti-failure features.
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The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
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(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
8
Data Sheet PG10719EJ02V0DS
μPG2185T6R
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.