the data sheet

GaAs INTEGRATED CIRCUIT
PG2150T5L
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SP3T SWITCH FOR BluetoothTM AND 802.11b/g
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DESCRIPTION
The PG2150T5L is a GaAs MMIC SP3T switch which was developed for Bluetooth and wireless LAN.
This device can operate frequency from 0.5 to 2.5 GHz, having the low insertion loss and high isolation.
This device is housed in a 12-pin plastic TSQFN (Thin Small Quad Flat Non-leaded) package. And this package
is able to high-density surface mounting.
FEATURES
• Operation frequency
: fopt = 0.5 to 2.5 GHz
• Control voltage
: Vcont (H) = 2.3 to 3.6 V (2.85 V TYP.)
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: Vcont (L) = 0.2 to 0.2 V (0 V TYP.)
• Low insertion loss
V
: Lins3 = 0.50 dB TYP. @ f = 2.5 GHz, ANT to RF1, 2, Vcont (H) = 2.85 V, Vcont (L) = 0
: Lins6 = 0.60 dB TYP. @ f = 2.5 GHz, ANT to RF3, Vcont (H) = 2.85 V, Vcont (L) = 0 V
• High isolation
: ISL3 = 35 dB TYP. @ f = 2.5 GHz, ANT to RF3, On port ANT to RF1, 2, RF1 to
RF3, On port ANT to RF1, Vcont (H) = 2.85 V, Vcont (L) = 0 V
: ISL6 = 18 dB TYP. @ f = 2.5 GHz, ANT to RF1, On port ANT to RF2, 3, ANT to
RF2, On port ANT to RF1, 3, Vcont (H) = 2.85 V, Vcont (L) = 0 V
• Handling power
: Pin (1 dB) = +31.0 dBm TYP. @ f = 2.5 GHz, ANT to RF1, 2, Vcont (H) = 2.85 V,
Vcont (L) = 0 V
: Pin (1 dB) = +25.0 dBm TYP. @ f = 2.5 GHz, ANT to RF3, Vcont (H) = 2.85 V,
Vcont (L) = 0 V
• High-density surface mounting
APPLICATIONS
: 12-pin plastic TSQFN package (2.0  2.0  0.37 mm)
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• Antenna switch for Bluetooth and 802.11b/g
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
PG2150T5L-E2
PG2150T5L-E2-A
12-pin plastic TSQFN
2150
(Pb-Free)
Supplying Form
 Embossed tape 8 mm wide
 Pin 10, 11, 12 face the perforation side of the tape
 Qty 3 kpcs/reel
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Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: PG2150T5L-A
Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
Document No. PG10653EJ02V0DS (2nd edition)
Date Published April 2007 NS CP(N)
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
PG2150T5L
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin Name
1
ANT
2
GND
3
Vcont2
4
RF2
5
GND
6
RF3
7
Vcont3
8
GND
9
Vcont1
10
RF1
11
N.C.
12
N.C.
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Pin No.
Remark Exposed pad : GND
TRUTH TABLE
Vcont1
High
Low
Low
Vcont2
Vcont3
ANTRF1
ANTRF2
ANTRF3
Low
Low
ON
OFF
OFF
High
Low
OFF
ON
OFF
Low
High
OFF
OFF
ON
ABSOLUTE MAXIMUM RATINGS (T A = +25C, unless otherwise specified)
Parameter
Symbol
Ratings
6.0 to +6.0
Unit
Note
Vcont
Input Power1 (ANTRF1, ANTRF2)
Pin1
+31.5
dBm
Input Power2 (ANTRF3)
Pin2
+25.5
dBm
Operating Ambient Temperature
TA
45 to +85
C
Storage Temperature
Tstg
55 to +150
C
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Switch Control Voltage
V
Note Vcont (H)  Vcont (L)  6.0 V
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RECOMMENDED OPERATING RANGE (T A = +25C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
fopt
0.5

2.5
GHz
Switch Control Voltage (H)
Vcont (H)
2.3
2.85
3.6
V
Switch Control Voltage (L)
Vcont (L)
0.2
0
0.2
V
Operating Frequency
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Data Sheet PG10653EJ02V0DS
PG2150T5L
ELECTRICAL CHARACTERISTICS
(T A = +25C, Vcont (H) = 2.85 V, Vcont
specified)
Parameter
(L)
= 0 V, DC blocking capacitors = 56 pF, unless otherwise
Symbol
Pass
MIN.
TYP.
MAX.
Unit
f = 0.5 to 1.0 GHz

0.40
0.55
dB
Lins1
Insertion Loss 2
Lins2
f = 1.0 to 2.0 GHz

Insertion Loss 3
Lins3
f = 2.0 to 2.5 GHz

Insertion Loss 4
Lins4
f = 0.5 to 1.0 GHz

Insertion Loss 5
Lins5
f = 1.0 to 2.0 GHz

0.55
0.70
dB
Insertion Loss 6
Lins6
f = 2.0 to 2.5 GHz

0.60
0.75
dB
Isolation 1
ISL1
f = 0.5 to 1.0 GHz
29
32

dB
f = 1.0 to 2.0 GHz
29
32

dB
ANT to RF3
ANT to RF3
On port ANT to
Isolation 2
ISL2
RF1, 2
Isolation 3
ISL3
On port ANT to
0.45
0.60
dB
0.50
0.65
dB
0.45
0.60
dB
f = 2.0 to 2.5 GHz
30
35

dB
f = 0.5 to 1.0 GHz
23
26

dB
f = 1.0 to 2.0 GHz
17
20

dB
f = 2.0 to 2.5 GHz
15
18

dB
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RF1 to RF3
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Insertion Loss 1
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ANT to RF1, 2
Test Conditions
RF1
Isolation 4
ISL4
ANT to RF1
On port ANT to
Isolation 5
ISL5
RF2, 3
ANT to RF2
Isolation 6
ISL6
On port ANT to
RF1, 3
Input Return Loss
Output Return Loss
1 dB Loss Compression
Input Power
Note
RLin
ANT to RF1, 2, 3
f = 0.5 to 2.5 GHz
15
20

dB
RLout
ANT to RF1, 2, 3
f = 0.5 to 2.5 GHz
15
20

dB
ANT to RF1, 2
f = 1.0 GHz
+28.0
+31.0

dBm
f = 2.0 GHz
+28.0
+31.0

dBm
f = 2.5 GHz
+28.0
+31.0

dBm
f = 1.0 GHz
+22.0
+25.0

dBm
f = 2.0 GHz
+22.0
+25.0

dBm
f = 2.5 GHz
+22.0
+25.0

dBm
Pin (1 dB)
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ANT to RF3
Switch Control Current
Icont
ANT to RF1, 2, 3
RF None

0.05
1.0
A
Switch Control Speed
tSW
ANT to RF1, 2, 3
50% CTL to

50

ns
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90/10% RF
Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
Data Sheet PG10653EJ02V0DS
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PG2150T5L
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EVALUATION CIRCUIT
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The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
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Data Sheet PG10653EJ02V0DS
PG2150T5L
MOUNTING PAD AND SOLDER PAD LAYOUT DIMENSIONS
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12-PIN PLASTIC TSQFN (UNIT: mm)
Remark The mounting pad and solder pad layouts in this document are for reference only.
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Data Sheet PG10653EJ02V0DS
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PG2150T5L
PACKAGE DIMENSIONS
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12-PIN PLASTIC TSQFN (UNIT: mm)
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Remark ( ) : Reference value
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Data Sheet PG10653EJ02V0DS
PG2150T5L
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Wave Soldering
: 260C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220C or higher
: 60 seconds or less
Preheating time at 120 to 180C
: 12030 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260C or below
WS260
: 10 seconds or less
Preheating temperature (package surface temperature)
: 120C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350C or below
HS350
: 3 seconds or less
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Soldering time (per side of device)
IR260
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Peak temperature (package surface temperature)
Time at peak temperature
Partial Heating
Condition Symbol
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Infrared Reflow
Soldering Conditions
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
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Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10653EJ02V0DS
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PG2150T5L
Caution GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the
following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
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1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
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• Do not lick the product or in any way allow it to enter the mouth.
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Data Sheet PG10653EJ02V0DS