POWER TRANSISTOR DRIVING BASE AMPLIFIER BUILT-IN TYPE OPTOCOUPLER PS9634 PS9634L FEATURES DESCRIPTION • HIGH INSTANTANEOUS COMMON MODE REJECTION VOLTAGE CMH = -1000 V/µs MIN, CML = 1000 V/µs MIN The PS9634 is an optical linkage device mounting a GaAs infrared LED on the light emitting side (input side), and a photodiode and a signal processing circuit on the light receiving side (output side) on one chip. The device can directly drive a power transistor of 15 A to 20 A class and may be used for an inverter control air conditioner or general purpose inverter. The PS9634L has formed leads for surface mounting. • HIGH POWER SUPPLY VOLTAGE (VCC) VCC = 18 V • HIGH RESPONSE SPEED tPHL, tPLH = 5 µs MAX • HIGH OUTPUT CURRENT IO1 = 0.5 A (DC), 1.0 A (pulse) MAX ESD SENSITIVE • CAN BE SOLDERED BY INFRARED REFLOW SOLDERING ELECTRICAL CHARACTERISTICS (TA = -20 °C to +80 °C, unless otherwise specified) PART NUMBER Input Characteristic SYMBOLS Output Characteristics PS9634, PS9634L UNITS VF Forward Voltage, IF = 5 mA, TA = 25 °C V IR Reverse Current, VR = 5 V, TA = 25 °C µA Ct Capacitance Between Terminals V = 0, f = 1.0 MHz, TA = 25 °C pF VCC MIN TYP MAX 1.1 1.4 5 30 Supply Voltage V VO1L* Low Level Output Voltage (O1) Vcc = 6 V, IO1 = 0.4 A, RL2 = 10 Ω, IF = 5 mA V VO2H* High Level Output Voltage (O2) Vcc = 6 V, IO2 = -0.4 A, IF = 5 mA V VO2L Low Level Output Voltage (O2) Vcc = 6 V, IO2 = 0.5 A, IF = 0 V IO1L* Leak Current (O1), Vcc = 13 V, IF = 0 µA 100 IO2L Leak Current (O2), Vcc = 13 V, IF = 5 mA µA 100 ICCH High Level Supply Current VCC = 6 V, IF = 5 mA, TA = 25 °C VCC = 6 V, IF = 5 mA mA mA 8 12 16 Low Level Supply Current VCC = 6 V, IF = 0, TA = 25 °C VCC = 6 V, IF = 0 mA mA 15 18 22 Input ON Current, Low ♦ High Vcc = 6 V, RL1 = 5 Ω, RL2 = 10 Ω, TA = 25 °C Vcc = 6 V, RL1 = 5 Ω, RL2 = 10 Ω mA mA 0.3 0.2 1.5 3.0 5.0 1011 ICCL IFLH* Propagation Characteristics PARAMETERS 5.4 15 0.25 4.5 0.4 5.0 0.25 0.4 RI-O Insulation Resistance, RH = 40% to 60%, TA = 25 °C Ω tPLH* Propagation Delay Time, Low ♦ High Vcc = 6 V, IF = 5 mA, RL1 = 5 Ω, RL2 = 10 Ω, TA = 25 °C µs 3 5 tPHL* Propagation Delay Time, High ♦ Low Vcc = 6 V, IF = 5 mA, RL1 = 5 Ω, RL2 = 10 Ω, TA = 25 °C µs 3 5 CMH* Instantaneous Common Mode Rejection Voltage (Output "High"), TA = 25°C, VCM = 600 V (peak), IF = 5 mA RL1 = 470 Ω, RL2 = 1 kΩ, ∆VO2H = 0.5 V V/µs -1000 CML* Instantaneous Common Mode Rejection Voltage (Output "Low"), TA = 25°C, VCM = 600 V (peak), IF = 0 mA RL1 = 470 Ω, RL2 = 1 kΩ, ∆VO2L = 0.5 V V/µs 1000 *Note: See Figures 1-7 for test schematic. California Eastern Laboratories PS9634, PS9634L ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) SYMBOLS Input VR IF/IFM Output VCC IO1 IO1P IO2 IO2P VO1 PO PT BV TOP TSTG PARAMETERS UNITS RATINGS Reverse Voltage Forward Current2 V mA/A 6 30/1 Power Voltage Output Current (O1) Peak Output Current (O1) Output Current (O2) Peak Output Current (O2) Output Voltage (O1) Power Dissipation Total Power Dissipation Insulation Withstand Voltage3 Operating Temperature Storage Temperature V A A A A V mW mW Vr.m.s. °C °C 18 0.5 1.0 0.8 2.0 18 500 550 5000 -20 to +80 -55 to +150 RECOMMENDED OPERATING CONDITIONS (TA = 25°C) PART NUMBER SYMBOLS PARAMETERS IFLH Input ON Current VCC Supply Voltage IO1 Output Current (O1) IO2 Output Current (O2) TOP Operating Temperature PS9634,PS9634L UNITS MIN TYP MAX mA V A A °C 6 5.4 0.1 0.1 0 8 0.2 0.2 25 10 15 0.3 0.3 50 TRUTH TABLE LED ON OFF Tr. 1 ON OFF Tr. 2 OFF ON Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Peak forward current IFM: Pulse width = 100 µs; Duty Ratio = 1%. 3. When all input pins are connected to all output pins at TA = 25 °C and RH = 60 %. OUTLINE DIMENSIONS (Units in mm) PS9634 PS9634L 10.16 MAX 10.16 MAX 8 5 1 4 7.62 6.5 3.8 MAX 8 5 1 4 7.62 6.5 3.8 MAX 0.05 to 0.2 4.55 MAX 2.8 MIN 1.27 MAX 2.54 0.65 1.34±0.10 1.27 MAX 1.34 0 to 15˚ 0.50±0.10 PIN CONNECTION (Top View) PS9634 Signal processing circuit 1 2 8 Tr. 1 3 7 6 Tr. 2 4 5 1. 2. 3. 4. 5. 6. 7. 8. Anode Cathode NC NC Output (O1) Output (O2) GND VCC 0.9±0.25 9.60±0.4 PS9634, PS9634L MEASUREMENT CIRCUITS FOR ELECTRICAL CHARACTERISTICS FIG. 2 (VO2H) FIG. 1 (VO1L) IF IF 8 1 8 1 VCC VCC 2 7 3 6 4 5 RL2 = 10 Ω V VO1L + 2 7 3 6 4 5 V VO2H + IO2 IO1 FIG. 3 (IO1L) FIG. 4 (IO2L) IF IF 1 8 1 8 2 7 3 6 4 5 VCC 2 7 3 6 4 5 A VCC IO1L FIG. 5 (IFLH) IO2L FIG. 6 (tPLH, tPHL) IF variable 1 8 2 7 3 6 4 5 (tr, tf = 0.01µs) VIN 1 VCC VCC - V VO2 RL2 + = 10 Ω 8 6V 51 Ω RL1 = 5 Ω 2 7 3 6 4 5 RL2 = 10 Ω VOUT VIN RL1 = 5 Ω 50 % VOUT 50 % FIG. 7 (CMH, CML) tPLH IF SW A 1 8 2 7 3 6 tPHL VCC 4 – + 5 RL2 =1KΩ VO2 100 V VCM GND RL1 = 470 Ω CMH (IF = 5 mA) 2V VO2 VCM 0.5 V CML (IF = 0) PS9634, PS9634L TYPICAL PERFORMANCE CURVES (TA = 25 °C) POWER DISSIPATION vs. AMBIENT TEMPERATURE MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE 600 Power Dissipation, PD (mW) Maximum Forward Current, IF (mA) 40 30 20 10 0 25 50 75 100 450 300 150 0 25 50 75 100 Ambient Temperature, TA (°C) Ambient Temperature, TA (°C) TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE FORWARD CURRENT vs. FORWARD VOLTAGE 100 600 TA = 100 ˚C 75 ˚C 50 ˚C (550) Forward Current, IF (mA) Total Power Dissipation, PT (mW) (500) 450 300 150 0 25 50 75 1 0.1 0.01 0.6 100 25 ˚C 0 ˚C -25 ˚C -55 ˚C 10 0.8 1.0 1.2 1.4 Ambient Temperature, TA (°C) Forward Voltage, VF (V) NORMALIZED IFLH vs. SUPPLY VOLTAGE NORMALIZED IFLH vs. AMBIENT TEMPERATURE 1.5 1.6 1.3 Normalized to 1.0 at VCC = 6 V TA = 25 ˚C Normalized to 1.0 at TA = 25 ˚C VCC = 6 V Normalized IFLH, ∆IFLH Normalized IFLH, ∆IFLH 1.2 1 0.5 1.1 1.0 0.9 0 4 6 8 10 12 14 Supply Voltage, VCC (V) 16 18 0.8 -20 0 20 40 60 Ambient Temperature, TA (°C) 80 PS9634, PS9634L TYPICAL PERFORMANCE CURVES (TA = 25 °C) LOW LEVEL SUPPLY CURRENT vs. SUPPLY VOLTAGE HIGH LEVEL SUPPLY CURRENT vs. SUPPLY VOLTAGE 22.5 Low Level Supply Current, ICCL (mA) High Level Supply Current, ICCH (mA) 15 TA = -20 ˚C 25 ˚C 10 80 ˚C 5 4 6 8 10 12 14 16 80 ˚C 15 12.5 10 8 10 12 14 16 Supply Voltage, VCC (V) LOW LEVEL OUTPUT VOLTAGE vs. OUTPUT CURRENT LOW LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE Low Level Output Voltage (O1), VO1L (V) 10 -1 10 -2 VCC = 6 V TA = 25 ˚C 10 -2 10-1 10 0 0.3 0.25 0.3 mA 0.2 0.15 0.1 0.1 mA 0.05 VCC = 6 V 0 -20 0 20 40 60 Ambient Temperature, TA (°C) LOW LEVEL OUTPUT VOLTAGE vs. OUTPUT CURRENT LOW LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE 10 -1 10 -2 VCC = 6 V TA = 25 ˚C 10-2 10-1 Output Current (O2), IO2 (A) 100 18 IO1 = 0.5 mA Output Current (O1), IO1 (A) 10 0 10 -3 6 Supply Voltage, VCC (V) 10 0 10 -3 4 18 Low Level Output Voltage (O2), VO2L (V) Low Level Output Voltage (O1), VO1L (V) 25 ˚C 17.5 7.5 0 Low Level Output Voltage (O2), VO2L (V) TA = -20 ˚C 20 80 0.5 VCC = 6 V IO2 = 0.6 A 0.4 0.3 0.4 A 0.2 0.1 0.1 A 0 -20 0 20 40 60 Ambient Temperature, TA (°C) 80 PS9634, PS9634L TYPICAL PERFORMANCE CURVES (TA = 25 °C) HIGH LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE 5.5 High Level Output Voltage (O2), VO2H (V) High Level Output Voltage (O2), VO2H (V) HIGH LEVEL OUTPUT VOLTAGE vs. OUTPUT CURRENT VCC = 6 V TA = 25 ˚C 5 4.5 4 0 -0.1 -0.2 -0.3 -0.4 -0.5 -0.6 -0.6 A 5.0 4.9 4.8 4.7 4.6 VCC = 6 V 4.5 -20 0 20 40 60 PROPAGATION DELAY TIME vs. AMBIENT TEMPERATURE 25 ˚C tPHL 4 -20 ˚C 3 80 ˚C 25 ˚C -20 ˚C tPLH 5 10 15 20 25 30 SAFE OPERATING AREA (Tr1) *1) One Pulse *2) On the epoxy board 5 1 IO2 MAX. (Pulse) s m ) *1 10 m s 0 10 1 ) *1 s m C s VCC MAX. 1 D ) *1 IO2 MAX. (DC) 0.5 *1 ) DC (T A = 0.2 80 *2 ) ˚C )* 2) 0.5 1 2 5 VCC = 6 V RL1 = 5 Ω RL2 = 10 Ω IF = 5 mA 4.5 4 tPHL 3.5 tPLH 3 2.5 2 -20 0 20 40 60 Ambient Temperature, TA (°C) Forward Current, IF (mA) 10 10 Output Voltage (O2), VO2 (V) 80 5 VCC = 6 V RL1 = 5 Ω RL2 = 10 Ω Propagation Delay Time, tPHL, tPLH (µs) Propagation Delay Time, tPHL, tPLH (µs) -0.4 A PROPAGATION DELAY TIME vs. FORWARD CURRENT 2 Output Current (O2), IO2 (A) IO2 = -0.1 A 5.1 Ambient Temperature, TA (°C) TA = 80 ˚C 0.1 0.3 5.2 Output Current (O2), IO2 (A) 5 2 5.3 20 30 80 PS9634, PS9634L TAPING SPECIFICATIONS (Units in mm) 7.5 ± 0.1 1.55 ± 0.1 10.4 ± 0.1 4.3 ± 0.2 10.3 ± 0.1 1.55 ± 0.1 16.0 ± 0.3 2.0 ± 0.1 4.0 ± 0.1 1.75 ± 0.1 Tape Outline and Dimensions 0.3 12.0 ± 0.1 Tape Direction Reel Outline and Dimensions 1.5 2.0 ± 0.5 R1.0 φ80.0 ± 5.0 φ330 φ13.0 ± 1.0 φ21.0 ± 0.8 +2.0 16.4 -0.0 PS9634, PS9634L RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature • Time of temperature higher than 210 °C • Number of reflows • Flux 235 °C or below (plastic surface) 30 seconds or less Three Rosin flux containing a small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) Package Surface Temperature T (˚C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 235 ˚C (peak temperature) 210 ˚C to 30 s 120 to 160 ˚C 60 to 90 s (preheating) Time (s) CAUTION: Avoid removing the residual flux with water after the first reflow process. Peak temperature 235˚ C or below (2) Dip soldering • Temperature • Time • Number of times • Flux 260 °C or below (molten solder temperature) 10 seconds or less One Rosin flux containing a small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM 12/04/2001 DATA SUBJECT TO CHANGE WITHOUT NOTICE