ROHM BD95242MUV

Hi-performance Regurator IC Series for PCs
2ch Switching Regurators
for Desktop PC
No.09030EBT14
BD95242MUV
●Description
BD95242MUV is a switching regulator controller with high output current which can achieve low output voltage (2.0V~5.5V)
from a wide input voltage range (7V~25V). High efficiency for the switching regulator can be realized by utilizing an external
3
TM
N-MOSFET power transistor. A new technology called H Reg is a Rohm proprietary control method to realize ultra high
transient response against load change. SLLM (Simple Light Load Mode) technology is also integrated to improve efficiency
in light load mode, providing high efficiency over a wide load range. For protection and ease of use, the soft start function,
variable frequency function, short circuit protection function with timer latch, over voltage protection with timer latch, and
Power good function are all built in. This switching regulator is specially designed for Main Power Supply.
●Features
3
TM
1) 2ch H Reg Switching Regulator Controller
2) Adjustable Simple Light Load Mode (SLLM), Quiet Light Load Mode (QLLM) and Forced continuous Mode
3) Thermal Shut Down (TSD), Under Voltage LockOut (UVLO), Over Current Protection (OCP),
Over Voltage Protection (OVP), Short circuit protection with timer-latch (SCP)
4) Soft start function to minimize rush current during startup
5) Switching Frequency Variable (f=200KHz~500KHz)
6) Power good circuit
7) 2ch Linear regulator
8) VQFN032V5050 package
●Applications
Laptop PC, Desktop PC, LCD-TV, Digital Components
●Maximum Absolute Ratings (Ta=25℃)
Parameter
Terminal voltage
Power dissipation 1
Power dissipation 2
Power dissipation 3
Power dissipation 4
Operating temperature range
Storage temperature range
Junction Temperature
Symbol
VIN, CTL
EXTVCC, PGOOD1, PGOOD2FB1, FB2, Is+1, Is+2, MCTL
FS1, FS2, REF1, REF2, SS1, SS2, LG1, LG2
BOOT1, BOOT2
BOOT1-SW1, BOOT2-SW2, HG1-SW1, HG2-SW2
HG1
HG2
EN1, EN2
DGND, PGND1, PGND2
Pd1
Pd2
Pd3
Pd4
Topr
Tstg
Tjmax
Limits
30 *1*2
7 *1*2
REG1+0.3*1*2
35 *1*2
7 *1*2
BOOT1+0.3 *1*2
BOOT2+0.3 *1*2
6 *1*2
1 2
AGND±0.3 * *
0.38 *3
0.88 *4
2.06 *5
4.56 *6
-10~+100
-55~+150
+150
Unit
V
V
V
V
V
V
V
V
V
W
W
W
W
℃
℃
℃
*1 Do not however exceed Pd.
*2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle.
*3 Reduced by 3.0mW for each increase in Ta of 1℃ over 25℃ (when don’t mounted on a heat radiation board )
*4 Reduced by 7.0mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB
which has 1 layer. (Copper foil area : 0mm2))
*5 Reduced by 16.5mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB
which has 4 layers. (1st and 4th copper foil area : 20.2mm2, 2nd and 3rd copper foil area : 5505mm2))
*6 Reduced by 36.5mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB
which has 4 layers. (All copper foil area : 5505mm2))
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© 2009 ROHM Co., Ltd. All rights reserved.
1/20
2009.04 - Rev.B
Technical Note
●Operating Conditions (Ta=25℃)
Parameter
Terminal voltage
Symbol
VIN
EXTVCC
CTL
EN1, EN2
BOOT1, BOOT2
BOOT1-SW1, BOOT2-SW2, HG1-SW1, HG2-SW2
PGOOD1, PGOOD2
FS1, FS2
REF1, REF2
Is+1, Is+ 2, FB1, FB2
MCTL
MIN.
7
4.5
-0.3
-0.3
4.5
-0.3
-0.3
0.09
1
1.9
-0.3
MAX.
25
5.5
25
5.5
30
5.5
5.5
1.25
2.75
5.6
REG1+0.3
Unit
V
V
V
V
V
V
V
V
V
V
V
*This product should not be used in a radioactive environment.
●Electrical characteristics
(unless otherwise noted, Ta=25℃ VIN=12V, CTL=5V, EN1=EN2=5V, REF1=2.5V, REF2=1.65V, FS1=FS2=0.582V)
Standard Value
Parameter
Symbol
Unit
Conditions
MIN.
TYP.
MAX.
VIN standby current
ISTB
70
150
250
μA
CTL=5V, EN1=EN2=0V
μA
VIN bias current
IIN
0
45
130
EXTVCC=5V
Shut down mode current
ISHD
-10
0
10
μA
CTL=0V
CTL Low voltage
VCTLL
-0.3
0.8
V
CTL High voltage
VCTLH
2.3
25
V
CTL bias current
ICTL
1
3
μA
VCTL=5V
EN Low voltage
VENL
-0.3
0.8
V
EN High voltage
VENH
2.3
5.5
V
EN bias current
IEN
1
3
μA
VEN=3V
[5V linear regulator]
REG1 output voltage
VREG1
4.90
5.00
5.10
V
IREG1=1mA
Maximum current
IREG1
200
mA
IREG2=0mA
Line Regulation
REG1I
90
180
mV
VIN=7.5 to 25V
Load Regulation
REG1L
30
50
mV
IREG1=0 to 30mA
[3.3V linear regulator]
REG2 output voltage
VREG2
3.27
3.30
3.33
V
IREG2=1mA
Maximum current
IREG2
100
mA
Line regulation
REG2I
20
mV
VIN=7.5 to 25V
Load regulation
REG2L
30
mV
IREG2=0 to 100mA
[5V switch block]
EXTVCC input threshold
VCC_UVLO
4.2
4.4
4.6
V
EXTVCC: Sweep up
voltage
EXTVCC input delay time
TVCC
2
4
8
ms
Switch Resistance
RVCC
1.0
2.0
Ω
[Under voltage lock out block for DC/DC]
REG1 threshold voltage
REG1_UVLO
4.0
4.2
4.4
V
REG1: Sweep up
REG2 threshold voltage
REG2_UVLO
2.45
2.65
2.85
V
REG2: Sweep up
Hysteresis voltage
dV_UVLO
50
100
200
mV
REG1, REG2: Sweep down
[Error amplifier block]
REF1×2
REF1×2
Feed back voltage 1
VFB1
REF1×2
V
-25m
+25m
FB1 bias current
IFB1
20
45
90
μA
FB1=5V
Output discharge resistance 1 RDISOUT1
0.5
1
3
kΩ
REF2×2
REF2×2
Feed back voltage 2
VFB2
REF2×2
V
-25m
+25m
FB2 bias current
IFB2
10
30
60
μA
FB2=3.3V
Output discharge resistance 2 RDISOUT2
0.5
1
3
kΩ
REF1, REF2 bias current
IREF1, IREF2
-10
10
μA
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2/20
2009.04 - Rev.B
Technical Note
●Electrical characteristics – Continued
(unless otherwise noted, Ta=25℃ VIN=12V, CTL=5V, EN1=EN2=5V, REF1=2.5V, REF2=1.65V, FS1=FS2=0.582V)
Standard Value
Parameter
Symbol
Unit
Conditions
MIN.
TYP.
MAX.
[H3REG block]
On Time 1
TON1
0.810
0.960
1.110
μs
REF=2.5V
On Time 2
TON2
0.520
0.670
0.820
μs
REF=1.65V
Maximum On Time
TONMAX
3.5
7
14
μs
Minimum Off Time
TOFFMIN
0.2
0.4
μs
FS1, FS2 bias current
IFS
-10
0
10
μA
[FET driver block]
HG higher side ON resistor
HGHON
3.0
6.0
Ω
HG lower side ON resistor
HGLON
2.0
4.0
Ω
LG higher side ON resistor
LGHON
2.0
4.0
Ω
LG lower side ON resistor
LGLON
0.5
1.0
Ω
[Over Voltage Protection block]
REF×2 REF×2 REF×2
Latch Type OVP Threshold voltage VLOVP
V
×1.15
×1.175
×1.20
Latch Type OVP delay time
TLOVP
50
150
300
μs
[Short circuit protection block]
REF×2 REF×2 REF×2
SCP Threshold voltage
VSCP
V
×0.66
×0.7
×0.74
Delay time
TSCP
0.5
1
2
ms
[Current limit protection block]
Maximum offset voltage
dVSMAX
50
65
80
mV
Is+1 bias current
IISP1
2.5
10
μA
Is+2 bias current
IISP2
2.5
10
μA
[Power good block]
REF×2 REF×2 REF×2
Power good low threshold
VPGTHL
V
×0.87
×0.90
×0.93
REF×2 REF×2 REF×2
Power good high threshold
VPGTHH
V
×1.07
×1.10
×1.13
Power good low voltage
VPGL
0.1
0.2
V
IPGOOD=1mA
Power good leakage current
ILEAKPG
-2
0
2
μA
VPGOOD=5V
[Soft Start block]
Charge current
ISS
1.8
2.5
3.2
μA
Standby voltage
VSS_STB
50
mV
SLLM mode control block]
MCTL terminal voltage 1
VCONT
-0.3
0.3
V
Continuous mode
2
QL M mode
MCTL terminal voltage 2
VQLLM
1.5
3.0
V
(Maximum LG off time : 50μs)
2
REG1
SL M mode
MCTL terminal voltage 3
VSLLM
4.5
V
(Maximum LG off time : ∞)
+0.3
MCTL float level
VMCTL
1.5
3.0
V
●Output condition table
CTL
Low
Low
Low
Low
High
High
High
High
Input
EN1
Low
Low
High
High
Low
Low
High
High
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EN2
Low
High
Low
High
Low
High
Low
High
REG1(5V)
OFF
OFF
OFF
OFF
ON
ON
ON
ON
3/20
Output
REG2(3.3V)
DC/DC1
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
ON
OFF
ON
ON
ON
ON
DC/DC2
OFF
OFF
OFF
OFF
OFF
ON
OFF
ON
2009.04 - Rev.B
Technical Note
31
1
32
22
24
23
PGND1
LG1
SW1
HG1
BOOT1
PGND2
REG1
VIN
2
3
LG2
SW2
HG2
BOOT2
REG1
VIN
Vo2
Adjustable
Vo1
Adjustable
●Block Diagram, Application circuit
26
25
REG1
REG1
AGND
13
DGND
FS2
TSD
FS1
EN1
EN2
FB1
FB2
REF2
REG2
REF1
17
8
16
FB1
FB1
REF1
Soft Start Block
SS1
EN1
21
19
28
REG2
29
REG1
7~
25V
5V
3.3V
REG1
SL2M Mode Control
MCTL2
MCTL1
REG2
SS1
27
VIN
VIN
SS2
12
PGOOD1
Is+1
3.3V
Reg
VIN
EXTVCC
18
30
MCTL
6
CTL
SS2
4
Soft Start Block
REF2
FB2
FB2
EN2
Reference
Block
CL1
Power Good Block
Power Good Block
5V
Reg
9
REG2
20
Current Limit
Protect
UVLO
Thermal
Protection
REG1
REG2
Is+2
Current Limit
Protect
PGOOD2
CL2
5
REG2
15
SS1
SS2
10
14
VIN
SCP1
H3RegTM
Controller
Block
Timer
H3RegTM
Controller
Block
FS1
SL2MTM
Block
MCTL1
7
Short Circuit Protect
MCTL2
SL2MTM
Block
Over Voltage
Protect
Timer
VIN
SCP2
11
Short Circuit Protect
FS2
CL1
SCP1
Overlap
Protection
Circuit
Overlap
Protection
Circuit
Over Voltage
Protect
CL2
SCP2
*Apply the supply voltage EXTVCC pin after REG1 pin is operated.
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4/20
2009.04 - Rev.B
Technical Note
SW1
HG1
BOOT1
EN1
PGOOD1
SS1
CTL
REF1
●Pin Configuration
24
23
22
21
20
19
18
17
PGND1 25
16 Is+1
LG1 26
15 FB1
EXTVCC 27
14 FS1
REG2 28
13 AGND
FIN
REG1 29
●Pin Function Table
PIN No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
reverse
PIN name
SW2
HG2
BOOT2
EN2
PGOOD2
SS2
DGND
REF2
Is+2
FB2
FS2
MCTL
AGND
FS1
FB1
Is+1
REF1
CTL
SS1
PGOOD1
EN1
BOOT1
HG1
SW1
PGND1
LG1
EXTVCC
REG2
REG1
VIN
LG2
PGND2
FIN
12 MCTL
3
4
5
6
7
8
REF2
2
DGND
1
SS2
9 Is+2
PGOOD2
PGND2 32
EN2
10 FB2
BOOT2
LG2 31
HG2
11 FS2
SW2
VIN 30
PIN Function
Highside FET source pin 2
Highside FET gate drive pin 2
HG Driver power supply pin 2
Vo2 ON/OFF pin (High=ON, Low=OFF)
Vo2 Power Good Open Drain Output pin
Vo2 soft start pin
Ground
Vo2 output voltage setting pin
Current sense pin +2
Vo2 output voltage sense pin, current sense pin -2
Input pin for setting Vo2 frequency
Mode shift pin (Low=continuous, Middle=QLLM, High=SLLM)
Input pin Ground
Input pin for setting Vo1 frequency
Vo2 output voltage sense pin, current sense pin -1
Current sense pin +1
Vo1 output voltage setting pin
Linear regulator ON/OFF pin (High=ON, Low=OFF)
Vo1 soft start pin
Vo1 Power Good Open Drain Output pin
Vo1 ON/OFF pin (High=ON, Low=OFF)
HG Driver power supply pin 1
Highside FET gate drive pin 1
Highside FET source pin 1
Lowside FET source pin 1
Lowside FET gate drive pin 1
Outside power supply input pin
3.3V linear regulator output pin
5V linear regulator output pin
Power supply input pin
Lowside FET gate drive pin 2
Lowside FET source pin 2
Exposed Pad, Connect to GND
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5/20
2009.04 - Rev.B
Technical Note
●Reference data
EN
5V/div
EN
5V/div
PGOOD
5V/div
PGOOD
5V/div
SS
1V/div
Vo
2V/div
SS
1V/div
Vo
2V/div
Fig.1 wake up (Vo=5.0V)
CTL
10V/div
REG1
2V/div
REG2
2V/div
Fig.2 wake up (Vo=3.3V)
Fig.3 Wake up (REG1, REG2)
Vo
20mV/div
Vo
20mV/div
Vo
20mV/div
IL
2A/div
IL
2A/div
IL
2A/div
SW
5V/div
LG
5V/div
SW
5V/div
LG
5V/div
SW
5V/div
LG
5V/div
Fig.5 CONT Mode (Io=0.4A)
Fig.4 CONT Mode (Io=0A)
Fig.6 CONT Mode (Io=1.4A)
Vo
20mV/div
Vo
20mV/div
Vo
20mV/div
IL
2A/div
IL
2A/div
IL
2A/div
SW
5V/div
LG
5V/div
SW
5V/div
LG
5V/div
SW
5V/div
LG
5V/div
Fig.7 QLLM (Io=0A)
Fig.8 QLLM (Io=0.4A)
Fig.9 QLLM (Io=1.4A)
Vo
20mV/div
Vo
20mV/div
Vo
20mV/div
IL
2A/div
IL
2A/div
IL
2A/div
SW
5V/div
LG
5V/div
SW
5V/div
LG
5V/div
SW
5V/div
LG
5V/div
Fig.10 SLLM (Io=0A)
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Fig.11 SLLM (Io=0.4A)
6/20
Fig.12 SLLM (Io=1.4A)
2009.04 - Rev.B
Technical Note
●Reference data – Continued
1.5
500 CONT Mode (VIN=19)
1200
CONT Mode (VIN=12)
VIN=12V, Vo=5.0V
450 CONT Mode (VIN=7)
Vo=5.0V
0.5
Vo=3.3V
400
350
800
frequency [KHz]
1.0
frequency [kHz]
600
400
CONT Mode (5.0V)
CONT Mode (3.3V)
QLLM, SLLM (3.3V)
QLLM, SLLM (3.3V)
200
0.0
0.40
0.80
1.20
1.60
200
150
0.40
50
0.80
1.20
1.60
0.001
Fig.14 FS- frequency
100
0.1
Io [A]
1
10
Fig.15 Io-frequency (Vo1=5.0V)
500
100
CONT Mode
480
CONT Mode
SLLM
80
0.01
FS[V]
Fig.13 FS-ON TIME
90
QLLM
(VIN=7,12,19)
SLLM
0
0.00
FS[V]
460
70
QLLM
50
40
30
QLLM
1
CONT Mode
(Io=5A)
440
10
60
IVIN [A]
efficiency [%]
250 QLLM, SLLM (VIN=7)
0
0.00
QLLM, SLLM (VIN=19)
300 QLLM, SLLM (VIN=12)
100
frequency [KHz]
ON TIME[usec]
1000
SLLM
420
(Io=2A)
400
380
360
20
340
10
320
0
0.1
1
10
100
Io [mA]
1000
10000
Fig.16 Io-efficiency (VIN=12V, Vo1=5.0V)
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300
7
9
11
13
15 17
VIN [V]
19
21
23
25
Fig.17 VIN-IVIN (Io=0A, Vo1=5.0V)
7/20
5
10
15
20
V IN [V ]
Fig.18 VIN-frequency (Vo1=5.0V)
2009.04 - Rev.B
Technical Note
●Pin Descriptions
・VIN
This is the main power supply pin. The input supply voltage range is 7V to 25V. The duty cycle of BD9524MUV is
determined by input voltage and control output voltage. Therefore, when VIN voltage fluctuated, the output voltage also
becomes unstable. Since VIN line is also the input voltage of switching regulator, stability depends on the impedance of
the voltage supply. It is recommended to establish bypass capacitor and CR filter suitable for the actual application.
・CTL
When CTL pin voltage is at least 2.3V the status of the linear regulator output becomes active (REG1=5V, REG2=3.3V).
Conversely, the status switches off when CTL pin voltage goes lower than 0.8V. The switching regulator doesn’t become
active when the status of CTL pin is low, if the status of EN pin is high.
・EN
When EN pin voltage is at least 2.3V, the status of the switching regulator becomes active. Conversely, the status switches
off when EN pin voltage goes lower than 0.8V.
・REG1
This is the output pin for 5V linear regulator and also active in power supply for driver and control circuit of the inside. The
standby function for REG1 is determined by CTL pin. The voltage is 5V, with 100mA current ability. It is recommended that
a 10uF capacitor (X5R or X7R) be established between REG1 and GND.
・REG2
This is the output pin for 3.3V linear regulator. The standby function for REG2 is determined by CTL. The voltage is 3.3V,
with 100mA current ability. It is recommended that a 10uF capacitor (X5R or X7R) be established between REG2 and
GND. It is available to set REF and SS by the resistance division value from REG2 in case REF are not set from an
external power supply.
・EXTVCC
This is the external input pin to REG1. When EXTVCC is beyond 4.4V, it supplies REG1 as EXTVCC is the power supply.
・REF
This is the setting pin for output voltage of switching regulator. It is so convenient to be synchronized to outside power
supply. This IC controls the voltage in the status of 2×REF≒FB.
・FB
This is the feedback pin from the output of switching regulator. This IC controls the voltage in the status of 2×REF≒FB.
・SS
This is the setting pin for soft start. The rising time is determined by the capacitor connected between SS and GND, and
the fixed current inside IC after it is the status of low in standby mode. It controls the output voltage till SS voltage catch up
the REF pin to become the double of the SS terminal voltage.
・FS
This is the input pin for setting the frequency. It is available to set it in frequency range is 200KHz to 500kHz.
・Is+
This is the sense pin for output current. In case it is connected to side of the coil resistance for sense current and the
voltage is set 65mV(typ) or more higher than FB pin voltage, the switching operation turns OFF.
・PGOOD
This is the open drain pin for deciding the output of switching regulator.
・MCTL
This is the switching shift pin for SLLM (Simple Light Load Mode). The efficiency in SLLM mode improves in setting MCTL
pin to 1.5V or more. In case MCTL terminal voltage range is from 1.5 to 3.0V, LG maximum OFF time is 40usec, from 4.5V
to REG1+0.3V, LG maximum OFF time is to infinity. It is in continuous mode that MCTL pin voltage is set 0.3V or less.
・AGND、DGND
This is the ground pin.
・BOOT
This is the power supply pin for high side FET driver. The maximum voltage range to GND pin is to 35V, to SW pin is to 7V.
In switching operations, the voltage swings from (VIN+REG1) to REG1 by BOOT pin operation.
・HG
This is the highside FET gate drive pin. It is operated in switching between BOOT to SW. In case the output MOS is 3ohm
/the status of Hi, 2ohm/the status of Low, it is operated hi-side FET gate in high speed.
・SW
This is the ground pin for high side FET drive. The maximum voltage range to GND pin is to 30V. Switching operation
swings from the status of BOOT to the status of GND.
・LG
This is the lowside FET gate drive pin. It is operated in switching between REG1 to PGND. In case the output MOS is
2ohm /the status of Hi, 0.5ohm/the status of Low, it is operated low-side FET gate in high speed.
・PGND
This is the ground pin for low side FET drive.
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8/20
2009.04 - Rev.B
Technical Note
● Explanation of Operation
The BD95242MUV is a 2ch synchronous buck regulator controller incorporating ROHM’s proprietary H3RegTM CONTROLLA
control system. When VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the TON
time interval. Thus, it serves to improve the regulator’s transient response. Activating the Light Load Mode will also exercise
Simple Light Load Mode (SLLM) control when the load is light, to further increase efficiency.
H3RegTM control
(Normal operation)
When VOUT falls to a reference voltage (2×REF), the
3
TM
drop is detected, activating the H Reg CONTROLLA
system.
VOUT
2×REF
tON=
HG
2×REF
1
×
VIN
f
[sec]・・・(1)
HG output is determined by the formula above.
LG
(VOUT drops due to a rapid load change)
VOUT
Io
When VOUT drops due to a rapid load change, and the
voltage remains below reference voltage after the
programmed tON time interval has elapsed, the system
quickly restores VOUT by extending the tON time, improving
the transient response.
tON+α
HG
LG
Light Load Control
(SLLM)
VOUT
2×REF
In SLLM (MCTL=”High voltage”), when the status of LG is OFF and
the coil current is within 0A (it flows to SW from VOUT.),
SLLM function is operated to prevent output next HG. The status
of HG is ON, when VOUT falls below reference voltage again.
HG
LG
0A
(QLLM)
VOUT
In QLLM (MCTL=”Hiz or Middle voltage”), when the status
of LG is OFF and the coil current is within 0A (it flows to
SW from VOUT.), QLLM function is operated to prevent
output next HG.
Then, VOUT falls below the output programmed voltage
within the programmed time (typ=40μs), the status of HG
is ON. In case VOUT doesn’t fall in the programmed time,
the status of LG is ON forcedly and VOUT falls. As a result,
he status of next HG is ON.
2×REF
HG
LG
0A
*Attention: H3RegTM CONTROLLA monitors the supplying current
from capacitor to load, using the ESR of output
capacitor, and realize the rapid response. Bpass
capacitor used at each load (Ex. Ceramic capacitor)
exercise the effect with connecting to each load side. Do
not put a ceramic capacitor on COUT side of power
supply.
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© 2009 ROHM Co., Ltd. All rights reserved.
9/20
COUT
Load
2009.04 - Rev.B
Technical Note
●Timing Chart
• Soft Start Function
Soft start is exercised with the EN pin set high. Current
control takes effect at startup, enabling a moderate
output voltage “ramping start.” Soft start timing and
incoming current are calculated with formulas (2) and
(3) below.
EN
TSS
SS
Soft start time
Tss=
VOUT
REF×Css
2.5μA(typ)
[sec] ・・・(2)
Incoming current
IIN=
IIN
Co×VOUT
Tss
[A] ・・・(3)
(Css: Soft start capacitor; Co: Output capacitor)
・Timer Latch Type Short Circuit Protection
Short protection kicks in when output falls to or below
REF × 1.4 (setting voltage ×0.7).
When the programmed time period (typ.=1ms) elapses,
output is latched OFF to prevent destruction of the IC.
Output voltage can be restored either by reconnecting
the EN pin or disabling UVLO.
REF×1.4
VOUT
SCP
EN / UVLO
・Over Voltage Protection
150μs(typ)
or less
When output rise to or above REF×2.35(output setting
voltage ×1.175), output over voltage protection is
exercised, and low side FET goes up maximum for
reducing output.(LG=High, HG=Low). When output falls
within the programmed time (typ=150μs), it returns to the
standard mode. When the programmed time period
elapses, output is latched OFF to prevent destruction of
the IC. Output voltage can be restored either by
reconnecting the EN pin or disabling UVLO.
150μs(typ)
or more
REF×2.35
VOUT
150μs(typ)
Latch
OVP
EN / UVLO
・Over current protection circuit
tON
tON
2.5μsec tON
During the normal operation, when VOUT becomes less
than reference voltage, HG becomes High during the
time tON . However, when inductor current exceeds ILIMIT
threshold, HG becomes OFF.
After 2.5μsec(typ), HG becomes ON again if the output
voltage is lower than the specific voltage level and IL is
lower than ILIMIT level.
HG
LG
ILIMIT
IL
Vo
2×REF
increase Io
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
10/20
2009.04 - Rev.B
Technical Note
● External Component Selection
1. Inductor (L) selection
The inductor value is a major influence on the output ripple
current. As formula (4) below indicates, the greater the inductor or
the switching frequency, the lower the ripple current.
(VIN-VOUT)×VOUT
[A]・・・(4)
ΔIL=
L×VIN×f
The proper output ripple current setting is about 30% of maximum
output current.
ΔIL=0.3×IOUTmax. [A]・・・(5)
ΔIL
VIN
IL
VOUT
L
L=
Co
(VIN-VOUT)×VOUT
ΔIL×VIN×f
[H]・・・(6)
(ΔIL: output ripple current; f: switch frequency)
Output ripple current
※Passing a current larger than the inductor’s rated current will cause magnetic saturation in the inductor and decrease
system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed
the inductor rated current value.
※To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance.
2.Output Capacitor (CO) Selection
VIN
VOUT
L
ΔVOUT=ΔIL×ESR [V]・・・(7)
ESR
Co
CEXT
When determining the proper output capacitor, be sure to factor in the equivalent
series resistance required to smooth out ripple volume and maintain a stable
output voltage range.
Output ripple voltage is determined as in formula (7) below.
Load
(ΔIL: Output ripple current; ESR: CO equivalent series resistance)
※ In selecting a capacitor, make sure the capacitor rating allows sufficient
margin relative to output voltage. Note that a lower ESR can minimize output
ripple voltage.
Output Capacitor
Please give due consideration to the conditions in formula (8) below for output capacity, bear in mind that output rise time
must be established within the soft start time frame.
Co+CEXT≦
TSS×(Limit-IOUT)
VOUT
・・・(8)
Tss: Soft start time
Limit: Over current detection 2A(Typ)
Note: Improper capacitor may cause startup malfunctions.
3. Input Capacitor (Cin) Selection
The input capacitor selected must have low enough ESR resistance to fully
support large ripple output, in order to prevent extreme over current. The
formula for ripple current IRMS is given in (9) below.
VIN
Cin
VOUT
L
IRMS=IOUT×
√VIN(VIN-VOUT)
[A]・・・(9)
VIN
Co
Where VIN=2×VOUT, IRMS=
IOUT
2
Input Capacitor
A low ESR capacitor is recommended to reduce ESR loss and maximize efficiency.
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
11/20
2009.04 - Rev.B
Technical Note
4. MOSFET Selection
Loss on the main MOSFET
VIN
Pmain=PRON+PGATE+PTRAN
main switch
=
VOUT
L
VOUT
×RON×IOUT2+Ciss×f×VDD+
VIN
VIN2×Crss×IOUT×f
IDRIVE
・・・(10)
(Ron: On-resistance of FET; Ciss: FET gate capacitance;
f: Switching frequency Crss: FET inverse transfer function;
IDRIVE: Gate peak current)
Co
synchronous switch
Loss on the synchronous MOSFET
Psyn=PRON+PGATE
=
VIN-VOUT
×RON×IOUT2+Ciss×f×VDD ・・・(11)
VIN
5. Setting Detection Resistance (Detect ILIMIT at the peak current)
(A) High accuracy current detective circuit (use the low resistance)
VIN
The over current protection function detects the output ripple
current peak value. This parameter (setting value) is
determined as in formula (13) below.
L
R
VOUT
ILMIT=
IL
65mV(typ)
R
Co
[A]・・・(12)
(R: Detection resistance)
OCP
65mV
Current limit
(B) Low loss current detective circuit (use the DCR value of inductor)
When the over current protection is detected by DCR of inductor L,
this parameter (setting value) is determined as in formula (13) below.
(Application circuit:P.18)
VIN
IL
L
RL
r
VOUT
C
r×C
ILMIT=65mV(typ)×
Co
L
(RL=
r×C
OCP
L
[A]・・・(13)
)
(RL: the DCR value of inductor)
Current limit
65mV
(C) Low loss current detective circuit (the DCR value of inductor : high)
VIN
ILIMIT=
65mV(typ)
k×RL
IL
L
(1-k)RL kRL
R1
R2
VOUT
Co
( k=
R2
R1+R2
,
L
RL
[A]・・・(14)
= kR1C )
(RL: the DCR value of inductor)
C
65mV
Current limit
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
12/20
2009.04 - Rev.B
Technical Note
6. Setting standard voltage (REF)
VIN
REF
H3RegTM
CONTROLLA
Outside
voltage
R
It is available to set the reference voltage (REF)
with outside supply voltage ×2 [V] by using outside
power supply voltage.
Q
S
FB
R0
R0
REG2(3.3V)
It is available to set the reference voltage (REF) by
the resistance division value from REG2 in case
REF is not set from an external power supply.
VIN
R1
REF
H3RegTM
CONTROLLA
R2
R
Q
S
REF=
R2
R1+R2
×REG2 [V]・・・(15)
FB
R0
R0
7. Setting output voltage
This IC is operated that output voltage is REF×2≒FB.
And it is operated that output voltage is feed back to FB pin.
VIN
H3RegTM
REF
CONTROLLA
VIN
R
Q
Output
voltage
SLLM
Driver
S
SLLM
Circuit
FB
R0
R0
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© 2009 ROHM Co., Ltd. All rights reserved.
13/20
2009.04 - Rev.B
Technical Note
●I/O Equivalent Circuit
1, 24pin (SW2, SW1)
BOOT
2, 23pin (HG2, HG1)
BOOT
3, 22pin (BOOT2, BOOT1)
BOOT
HG
HG
SW
SW
4, 21pin (EN2, EN1)
5, 20pin (PGOOD2, PGOOD1)
6, 19pin (SS2, SS1)
REG1
8, 17pin (REF2, REF1)
9, 16pin (Is+2, Is+1)
10, 15pin (FB2, FB1)
12pin (MCTL)
18pin (CTL)
REG1
11, 14pin (FS2, FS1)
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
14/20
2009.04 - Rev.B
Technical Note
●I/O Equivalent Circuit
26, 31pin (LG1, LG2)
27pin (EXTVCC)
REG1
28pin (REG2)
REG1
REG1
29pin (REG1)
30pin (VIN)
VIN
●Evaluation Board Circuit (Vo1=5V f1=300kHz Vo2=3.3V f2=400kHz)
CTL
EN1
REG1
EN1
HG1
R3
REG1
21
EN1
4
EN2
EN2
EN2
29
REG2
3.3V
28
REG2
R46
EXTVCC
FB1
15
C21
R43
C22
C32 C20
C33
R44
Q1
25
16
VO1
R48
C23
R45 C34
Is+1
R60
L1
TPQ6
R10
R40
R57
R56
Q5
R55
R39
REG1
VIN
VIN
SS1
6
SS2
C7
14
SW2
1
LG2
31
PGND2
32
FS2
R12
11
7
13
R32
Q3
R25
Is+2
9
FB2
10
C9
REG1
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
PGOOD2
20
R21
R53
R37
R59
L2
R24
VO2
R33
C11
C12
C29
C30 C10
R29
D2
C13
R15
R54
R28
TPQ5
R63
Q6
R52
PGOOD1
R20
REG1
5
C16
R31 C36
FS2
MCTL
DGND
AGND
C15
Q4
R30
PGOOD1
12
C14
SW2
C31
MCTL
C28
R34
VO2
C17
FS1
R17
R14
2
D4
C37
C8
REF2
19
C18
REG2
HG2
R35
R18
FS1
3
C5
REG2
R16
BOOT2
R22
R7
REF1
R27
C6
8
R13
R51
SW1
R26
R9
VIN
26
C4
17
R58
Q2
R47
R6
R8
VIN
C26
C24
R49
C19
27
REG2
LG1
PGND1
C3
R5
REG2
24
C25
REG1
C2
EXTVCC
SW1
23
VO1
C27
D1
R4
REG1
5V
Vo1
22
C35
18
BOOT1
VIN
R19
CTL
VIN
C1
R2
VIN
D3
R50
R11
30
R42
CTL
VIN
REG1
BD9524MUV
R1
R41
VIN
12V
PGOOD2
R36
15/20
2009.04 - Rev.B
Technical Note
DESIGNATION RATING
PART No.
COMPANY
DESIGNATION
RATING
PART No.
COMPANY
R1
0Ω
MCR03EZHJ000
ROHM
R58
1MΩ
MCR03PZHZF1004
ROHM
R2
0Ω
MCR03EZHJ000
ROHM
R59
0Ω
MCR03EZHJ000
ROHM
R3
0Ω
MCR03EZHJ000
ROHM
R60
0Ω
MCR03EZHJ000
ROHM
R4
0Ω
MCR03EZHJ000
ROHM
R63
-
-
-
R5
0Ω
MCR03EZHJ000
ROHM
C1
10uF(25V)
CM32X7R106M25A
KYOCERA
R6
15kΩ
MCR03PZHZF1502
ROHM
C2
10uF(6.3V)
GRM21BB10J106KD
MURATA
R7
47kΩ
MCR03PZHZF4702
ROHM
C3
10uF(6.3V)
GRM21BB10J106KD
MURATA
R8
30kΩ
MCR03PZHZF3002
ROHM
C4
10uF(6.3V)
GRM21BB10J106KD
MURATA
R9
30kΩ
MCR03PZHZF3002
ROHM
C5
0.01uF(50V)
GRM188B11H103KD
MURATA
R10 *
-
-
-
C6
GRM188B11H103KD
MURATA
R11 *
-
-
-
C7
0.01uF(50V)
1000pF(50
GRM188B11H102KD
MURATA
R12
-
-
-
C8
1000pF(50V)
GRM188B11H102KD
MURATA
R13
1MΩ
MCR03PZHZF1004
ROHM
C9
-
-
-
R14
51kΩ
MCR03PZHZF5102
ROHM
C10
-
-
SANYO
R15 *
-
-
-
C11
220uF
6TPE220MI
R16
-
-
-
C12
-
-
-
R17
36kΩ
MCR03PZHZF3602
ROHM
C13 *
-
-
-
R18 *
-
-
-
C14
0.47uF(10V)
GRM188B11A474KD
MURATA
R19 *
-
-
-
C15
10uF(25V)
CM32XR7106M25A
KYOCERA
R20
100kΩ
MCR03PZHZF1003
ROHM
C16
10uF(25V)
CM32XR7106M25A
KYOCERA
R21
0Ω
MCR03EZHJ000
ROHM
C17
10uF(6.3V)
GRM21BB10J106KD
MURATA
R22 *
-
-
-
C18
-
-
-
R24
0Ω
MCR03EZHJ000
ROHM
C19
-
-
-
R25
0Ω
MCR03EZHJ000
ROHM
C20
-
-
-
R26 *
-
-
-
C21
220uF
6TPE220MI
SANYO
R27 *
-
-
-
C22
-
-
-
R28
0Ω
MCR03EZHJ000
ROHM
C23 *
-
-
-
R29
0Ω
MCR03EZHJ000
ROHM
C24
0.47uF(10V)
GRM188B11A474KD
MURATA
R30
0Ω
MCR03EZHJ000
ROHM
C25
10uF(25V)
CM32XR7106M25A
KYOCERA
R31 *
-
-
-
C26
10uF(25V)
CM32XR7106M25A
KYOCERA
R32
0Ω
MCR03EZHJ000
ROHM
C27
10uF(6.3V)
GRM21BB10J106KD
MURATA
R33
5mΩ
PMR100HZPFU5L00
ROHM
C28
-
-
-
R34
0Ω
MCR03EZHJ000
ROHM
C29
-
-
-
R35
0Ω
MCR03EZHJ000
ROHM
C30
-
-
R36
100kΩ
MCR03PZHZF1003
ROHM
C31
-
-
-
R37
0Ω
MCR03EZHJ000
ROHM
C32
-
-
-
R39
0Ω
MCR03EZHJ000
ROHM
C33
-
-
-
R40
0Ω
MCR03EZHJ000
ROHM
C34 *
-
-
-
R41 *
-
-
-
C35 *
-
-
-
R42 *
-
-
-
C36 *
-
-
-
R43
0Ω
MCR03EZHJ000
ROHM
C37 *
-
-
ROHM
R44
0Ω
MCR03EZHJ000
ROHM
D1
Diode
RSX501L-20
R45 *
-
-
-
D2
Diode
RSX501L-20
ROHM
R46
0Ω
MCR03EZHJ000
ROHM
D3
Diode
RB520S-30
ROHM
R47
0Ω
MCR03EZHJ000
ROHM
D4
Diode
RB520S-30
ROHM
R48
5mΩ
PMR100HZPFU5L00
ROHM
L1
2.5uH
CDEP105NP-2R5MC-32
Sumida
R49
0Ω
MCR03EZHJ000
ROHM
L2
2.5uH
CDEP105NP-2R5MC-32
Sumida
R50
0Ω
MCR03EZHJ000
ROHM
Q1
FET
uPA2702
NEC
R51 *
-
-
-
Q2
FET
uPA2702
NEC
R52
-
-
-
Q3
FET
uPA2702
NEC
R53 *
-
-
-
Q4
FET
uPA2702
NEC
R54
-
-
-
Q5
-
-
-
R55
-
-
-
Q6
-
-
-
R56
-
-
-
U1
-
BD9524MUV
ROHM
R57
-
-
-
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
* Patterns for over current detection used DCR.
16/20
2009.04 - Rev.B
Technical Note
●Handling method of unused pin during using only 1ch DC/DC.
If using only 1ch DC/DC and 2ch pin is set to be off at all times, please manage the unused pin as diagram below.
PIN No,
PIN Name
Management
1
SW2
GND
2
HG2
OPEN
3
BOOT2
GND
4
EN2
GND
5
PGOOD2
GND
6
SS2
GND
8
REF2
GND
9
Is+2
GND
10
FB2
GND
11
FS2
GND
31
LG2
OPEN
CTL
R2
EN1
R3
30
VIN
C1
18
BOOT1
CTL
EN1
REG1
22
HG1
21
EN1
4
EN2
SW1
23
24
VIN
D3
R50
VIN
VO1
C27
C25
R49
C26
C24
Q2
R51
SW1
R47
C2
PGND1
REG2
3.3V
28
REG2
C3
EXTVCC
Vo1
26
R45 C34
25
Is+1
16
27
EXTVCC
FB1
15
17
REF1
C23
R10
R40
C33
C32 C20
TPQ6
R57
R56
Q5
R55
C19
R5
REG2
LG1
REG1
C22
R44
R42
29
C21
R43
Q1
R41
REG1
5V
R48
R19
D1
R46
VO1
R60
L1
C35
CTL
VIN
REG1
BD95242MUV
R1
R11
VIN
12V
R39
C4
R6
R7
8
VIN
REG2
R58
BOOT2
3
HG2
2
SW2
1
LG2
31
PGND2
32
C5
C7
R16
REF2
19
SS1
6
SS2
FS1
14
C18
FS1
R17
11
C28
7
13
9
FB2
10
REG1
FS2
MCTL
12
Is+2
MCTL
DGND
AGND
PGOOD1
20
PGOOD2
5
R21
PGOOD1
R20
●Charge pump Circuit Example.
During SLLM, if Vo1=5V and charge pump output is set 10V~15V, circuit example is below.
LG1
2.2μF
2.2μF
Charge pump
Vo1
2.2μF
2.2μF
510kΩ
MCTL pin
470kΩ
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© 2009 ROHM Co., Ltd. All rights reserved.
17/20
2009.04 - Rev.B
Technical Note
●Operation Notes and Precautions
1. This integrated circuit is a monolithic IC, which (as shown in the figure below), has P isolation in the P substrate and
between the various pins. A P-N junction is formed from this P layer and N layer of each pin, with the type of junction
depending on the relation between each potential, as follows:
・When GND> element A> element B, the P-N junction is a diode.
・When element B>GND element A, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, as well as operating malfunctions and physical damage. Therefore, be careful to avoid
methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an
input pin.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin B
B
E
Pin A
N
P+
N
P+
P
N
Parasitic
element
N
P+
P
P substrate
Parasitic element
B
N
P+
N
C
E
Parasitic
element
P substrate
GND
Parasitic element
GND
GND
GND
Other adjacent elements
2. In some modes of operation, power supply voltage and pin voltage are reversed, giving rise to possible internal circuit
damage. For example, when the external capacitor is charged, the electric charge can cause a VCC short circuit to the
GND. In order to avoid these problems, inserting a VCC series countercurrent prevention diode or bypass diode between
the various pins and the VCC is recommended.
Bypass diode
Countercurrent
VCC
Pin
3. Absolute maximum rating
Although the quality of this IC is rigorously controlled, the IC may be destroyed when applied voltage or operating
temperature exceeds its absolute maximum rating. Because short mode or open mode cannot be specified when the IC is
destroyed, it is important to take physical safety measures such as fusing if a special mode in excess of absolute rating
limits is to be implemented.
4.GND potential
Make sure the potential for the GND pin is always kept lower than the potentials of all other pins, regardless of the
operating mode.
5. Thermal design
In order to build sufficient margin into the thermal design, give proper consideration to the allowable loss (Power
Dissipation) in actual operation.
6. Short-circuits between pins and incorrect mounting position
When mounting the IC onto the circuit board, be extremely careful about the orientation and position of the IC. The IC may
be destroyed if it is incorrectly positioned for mounting. Do not short-circuit between any output pin and supply pin or
ground, or between the output pins themselves. Accidental attachment of small objects on these pins will cause shorts and
may damage the IC.
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© 2009 ROHM Co., Ltd. All rights reserved.
18/20
2009.04 - Rev.B
Technical Note
7. Operation in strong electromagnetic fields
Use in strong electromagnetic fields may cause malfunctions. Use extreme caution with electromagnetic fields.
8. Thermal shutdown circuit
This IC is provided with a built-in thermal shutdown (TSD) circuit, which is activated when the operating temperature
reaches 175℃ (standard value), and has a hysteresis range of 15℃ (standard). When the IC chip temperature rises to
the threshold, all the inputs automatically turn OFF. Note that the TSD circuit is provided for the exclusive purpose shutting
down the IC in the presence of extreme heat, and is not designed to protect the IC per se or guarantee performance when
or after extreme heat conditions occur. Therefore, do not operate the IC with the expectation of continued use or
subsequent operation once the TSD is activated.
9. Capacitor between output and GND
When a larger capacitor is connected between the output and GND, Vcc or VIN shorted with the GND or 0V line – for any
reason – may cause the charged capacitor current to flow to the output, possibly destroying the IC. Do not connect a
capacitor larger than 1000uF between the output and GND.
10. Precautions for board inspection
Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be
certain to use proper discharge procedure before each process of the operation. To prevent electrostatic accumulation and
discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and
continue observing ESD-prevention procedures in all handling, transfer and storage operations. Before attempting to
connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is
OFF before removing any component connected to the test setup.
11. GND wiring pattern
When both a small-signal GND and high current GND are present, single-point grounding (at the set standard point) is
recommended, in order to separate the small-signal and high current patterns, and to be sure the voltage change
stemming from the wiring resistance and high current does not cause any voltage change in the small-signal GND. In the
same way, care must be taken to avoid wiring pattern fluctuations in any connected external component GND.
●Thermal Derating Curve
[mW]
1000
70mm×70mm×1.6mm
880mW
Power Dissipation [Pd]
800
Glass-epoxy PCB
θj-a=142.0℃/W
600
With no heat sink
θj-a=328.9℃/W
400
380mW
200
0
25
50
75
100
125
150
[℃]
Ambient Temperature [Ta]
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© 2009 ROHM Co., Ltd. All rights reserved.
19/20
2009.04 - Rev.B
Technical Note
●Ordering part number
B
D
9
Part No.
5
2
4
2
M
Part No.
U
V
Package
MUV : VQFN032V5050
-
E
2
Packaging and forming specification
E2: Embossed tape and reel
VQFN032V5050
<Tape and Reel information>
5.0 ± 0.1
5.0±0.1
1.0MAX
3.4±0.1
0.4 ± 0.1
1
8
9
32
16
25
24
0.75
0.5
2500pcs
E2
The direction is the 1pin of product is at the upper left when you hold
)
(0.22)
( reel on the left hand and you pull out the tape on the right hand
3.4 ± 0.1
+0.03
0.02 -0.02
S
C0.2
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.08 S
Tape
17
+0.05
0.25 -0.04
1pin
(Unit : mm)
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© 2009 ROHM Co., Ltd. All rights reserved.
Reel
20/20
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.04 - Rev.B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2009 ROHM Co., Ltd. All rights reserved.
R0039A