MATERIAL DATA SHEET Material # SOD-123 series (Halogen Free) Product Line Date 2011/10/15 Rev. date E No. 1 2 3 4 5 Construction element Lead Frame Wire Mold Compound Wafer Plating Material group Material weight (mg) SDI Heraeus HuaWei YanDong 2.469 0.01 CAS if applicable Average mass (%) Nickel 7440-02-0 41.00% Manganese 7439-96-5 0.70% Cobalt 7440-48-4 0.40% Silicon 7440-21-3 0.20% Chromium 7440-47-3 0.05% Copper 7440-50-8 0.05% Carbon 7440-44-0 0.01% Iron 7439-89-6 56.59% Silver 7440-22-4 1.00% Aurum 7440-57-5 100.00% Silica Fused 60676-86-0 60~90% Silica amorphous 7631-86-9 5~20% Eoxy resin Trade Secret 2~10% Phenolic Resin Trade Secret 2~10% Carbon Resin 01333-86-4 <1% Flame Retardand Trade Secret <5% Silicon 7440-21-3 95.50% 6.783 YSTIN 0.142 9.754 Sum(%) 25.31 0.10 69.54 0.350 Total weight Comchip Technology CO., LTD. Material Gold 7440-57-5 3.50% Aluminum 7429-90-5 1.00% Tin 7440-31-5 100.00% www.comchiptech.com TEL: +886-2-86776675 FAX: +886-2-86776672 1/1 3.59 1.46 Traces