MATERIAL DATA SHEET Material # CDSUR & CDSU series (0603) (Halogen Free) Product Line SOD-523F Date 2012/2/20 Rev. F COMPONENT DETAILS No. 1 2 3 4 5 Construction element FR-4 Board Wafer Al wire Silver paste Molding Compound Material group Material weight (mg) Substrate/ Terminal Diode Conductor Welding Outer Total weight 1.357 0.029 0.001 0.006 1.881 Material CAS if applicable Average mass (%) Copper 7440-50-8 10~30% Epoxy Resin 67-64-1 30~60% Fillers 19287-45-7 10~20% E-Glass Fabric 14808-60-7 30~60% Silicon 7440-21-3 90.40% Aluminum 7429-90-5 0.10% Sum(%) Traces 41.45 0.89 Gold 7440-57-5 9.50% Al i Aluminum 7429 90 5 7429-90-5 99 00% 99.00% Silicon 7440-21-3 <1% Modified Epoxy Resin 29690-82-2 5~25% Silver 7440-22-4 76~85% Imidazole 827-43-0 1~4% Amide 461-58-5 1~4% 4% Silica 60676-86-0 70~90% 88% Epoxy Resin 29690-82-2 6~16% Phenolic Resin 9003-35-4 5~15% Carbon Black 1333-86-4 0.1~1% 0.03 8% 0.18 57.45 88% 6% 5% 0% 3.274 99% Comchip Technology CO., LTD. www.comchiptech.com TEL: +886-2-86776675 FAX: +886-2-86776672 1/1