Freescale Semiconductor Advance Information Document Number: MC33874 Rev. 9.0, 8/2008 Quad High Side Switch (Quad 35mΩ) 33874 The 33874 is one in a family of devices designed for low-voltage automotive and industrial lighting and motor control applications. Its four low RDS(ON) MOSFETs (four 35mΩ) can control the high sides of four separate resistive or inductive loads. HIGH SIDE SWITCH Programming, control, and diagnostics are accomplished using a 16-bit SPI interface. Additionally, each output has its own parallel input for pulse-width modulation (PWM) control if desired. The 33874 allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush or motor stall intervals. Such programmability allows tight control of fault currents and can protect wiring harnesses and circuit boards as well as loads. The 33874 is packaged in a power-enhanced 12 x 12 nonleaded Power QFN package with exposed tabs. Features • Quad 35mΩ high side switches (at 25°C) • Operating voltage range of 6.0V to 27V with standby current < 5.0μA • SPI control of over-current limit, over-current fault blanking time, output OFF open load detection, output ON / OFF control, watchdog timeout, slew rates, and fault status reporting • SPI status reporting of over-current, open and shorted loads, over-temperature, under-voltage and over-voltage shutdown, fail-safe pin status, and program status • Analog current feedback with selectable ratio • Analog board temperature feedback • Enhanced -16V reverse polarity VPWR protection • Pb-free packaging designated by suffix code PNA VDD VDD VPWR PNA SUFFIX (PB_FREE) 98ART10510D 24-PIN PQFN (12 x 12) ORDERING INFORMATION Device Temperature Range (TA) Package MC33874BPNA/R2 - 40°C to 125°C 24 PQFN VDD VPWR 33874 VDD VPWR HS0 WAKE SO SCLK MCU SI CS CS SI SO I/O RST I/O I/O FS IN0 I/O IN1 I/O IN2 I/O IN3 A/D GND A/D LOAD 0 SCLK CSNS TEMP FSI HS1 LOAD 1 HS2 LOAD 2 HS3 LOAD 3 GND Figure 1. 33874 Simplified Application Diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2006-2008. All rights reserved. INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM VDD VPWR VIC Internal Regulator IUP CS SCLK Over/Under-voltage Protection VIC Selectable Slew Rate Gate Drive SPI 3.0MHz IDWN Selectable Over-current High Detection HS[0:3]: 55A or 40A SO SI RST WAKE FS IN0 Logic IN1 IN2 Selectable Overcurrent Low Detection Blanking Time 0.15ms–155ms HS0 Selectable Overcurrent Low Detection HS[0:3]: 2.8A–10A Open Load Detection IN3 Over-temperature Detection RDWN HS0 IDWN HS1 Programmable Watchdog 279ms–2250ms HS1 VIC HS2 HS2 FSI HS3 HS3 TEMP Temperature Feedback Selectable Output Current Recopy (Analog MUX) HS[0:3]: 1/7200 or 1/21400 GND CSNS Figure 2. 33874 Simplified Internal Block Diagram 33874 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS PIN CONNECTIONS RST WAKE FS IN3 IN2 TEMP IN1 IN0 CSNS 9 8 7 6 5 4 3 2 1 SI SO 16 GND 17 HS3 18 SCLK 13 12 11 10 VDD CS Transparent Top View of Package 14 GND 24 FSI 23 GND 22 HS2 15 VPWR 19 20 21 HS1 NC HS0 Figure 3. 33874 Pin Connections Table 1. 33874 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 15. Pin Number Pin Name Pin Function 1 CSNS Output Output Current Monitoring The Current Sense pin sources a current proportional to the designated HS0 : HS3 output. 2 3 5 6 IN0 IN1 IN2 IN3 Input Parallel Inputs The IN0 : IN3 high side input pins are used to directly control HS0 : HS3 high side output pins, respectively. 4 TEMP Output Temperature Feedback This pin reports an analog value proportional to the temperature of the GND flag (pins 14, 17, 23). It is used by the MCU to monitor board temperature. 7 FS Output Fault Status (Active Low) This pin is an open drain configured output requiring an external pull-up resistor to VDD for fault reporting. 8 WAKE Input Wake This input pin controls the device mode and watchdog timeout feature if enabled. 9 RST Input Reset This input pin is used to initialize the device configuration and fault registers, as well as place the device in a low-current Sleep Mode. 10 CS Input Chip Select (Active Low) This input pin is connected to a chip select output of a master microcontroller (MCU). 11 SCLK Input Serial Clock This input pin is connected to the MCU providing the required bit shift clock for SPI communication. 12 SI Input Serial Input This pin is a command data input pin connected to the SPI Serial Data Output of the MCU or to the SO pin of the previous device of a daisy-chain of devices. 13 VDD Power Digital Drain Voltage (Power) This pin is an external voltage input pin used to supply power to the SPI circuit. Formal Name Definition 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 3 PIN CONNECTIONS Table 1. 33874 Pin Definitions (continued) A functional description of each pin can be found in the Functional Pin Description section beginning on page 15. Pin Number Pin Name Pin Function Formal Name 14, 17, 23 GND Ground Ground 15 VPWR Power 16 SO Output Serial Output 18 19 21 22 HS3 HS1 HS0 HS2 Output High Side Outputs Definition These pins are the ground for the logic and analog circuitry of the device. Positive Power Supply This pin connects to the positive power supply and is the source of operational power for the device. 20 NC N/A No Connect 24 FSI Input Fail-safe Input This output pin is connected to the SPI Serial Data Input pin of the MCU or to the SI pin of the next device of a daisy-chain of devices. Protected 35mΩ high side power output pins to the load. This pin may not be connected. The value of the resistance connected between this pin and ground determines the state of the outputs after a watchdog timeout occurs. 33874 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS Operating Voltage Range VPWR(SS) Steady-State V -16 to 41 VDD Supply Voltage -0.3 to 5.5 V See note (1) - 0.3 to 7.0 V VSO - 0.3 to VDD + 0.3 V WAKE Input Clamp Current ICL(WAKE) 2.5 mA CSNS Input Clamp Current ICL(CSNS) 10 mA Input / Output VDD Voltage(1) SO Output Voltage(1) HS [0:3] Voltage VHS V Positive 41 Negative -16 Current(2) IHS[0:3] 11 A Output Clamp Energy(3) ECL [0:3] 85 mJ VESD ± 2000 Output ESD Voltage(4) V Human Body Model (HBM) Charge Device Model (CDM) Corner Pins (1, 13, 19, 21) ± 750 All Other Pins (2-12, 14-18, 20, 22-24) ± 500 THERMAL RATINGS °C Operating Temperature Ambient Junction TA - 40 to 125 TJ - 40 to 150 TSTG - 55 to 150 Junction to Case RθJC <1.0 Junction to Ambient RθJA 30 TSOLDER Note 6 Storage Temperature Thermal Resistance(5) Peak Pin Reflow Temperature During Solder Mounting(6) °C °C/ W °C Notes 1. Exceeding voltage limits on IN[0:3], RST, FSI, CSNS, TEMP, SI, SO, SCLK, CS, or FS pins may cause a malfunction or permanent damage to the device. 2. Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output current using package thermal resistance is required. 3. Active clamp energy using single-pulse method (L = 2mH, RL = 0Ω, VPWR = 14V, TJ = 150°C initial). 4. ESD testing is performed in accordance with the Human Body Model (CZAP = 100pF, RZAP = 1500Ω), Charge Device Model (CDM), Robotic (CZAP = 4.0pF). 5. 6. Device mounted on a 2s2p test board per JEDEC JESD51-2. Freescale’s Package Reflow capability meets Sn-Pb-free requirements for JEDEC standard J-STD-020A. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions 6.0V ≤ VPWR ≤ 27V, 4.5V ≤ VDD ≤ 5.5V, - 40°C ≤ TA ≤ 125°C, GND = 0V, unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max 6.0 – 27 – – 20 Unit POWER INPUT (VPWR, VDD) Battery Supply Voltage Range VPWR Fully Operational VPWR Operating Supply Current IPWR(ON) Outputs ON, HS[0 : 3] open VPWR Supply Current V mA IPWR(SBY) Outputs OFF, Open Load Detection Disabled, WAKE > 0.7 x VDD, RST = VLOGIC HIGH Sleep State Supply Current (VPWR = 14V, RST < 0.5V, WAKE < 0.5V) mA – – 5.0 μA IPWR(SLEEP) TA = 25°C – 1.0 TA = 85°C – – 50 4.5 5.0 5.5 No SPI Communication – – 1.0 3.0MHz SPI Communication(7) – – 5.0 VDD Supply Voltage VDD(ON) VDD Supply Current IDD(ON) 10 V mA IDDSLEEP – – 5.0 μA Over-voltage Shutdown Threshold VOV 28 32 36 V Over-voltage Shutdown Hysteresis VOVHYS 0.2 0.8 1.5 V VUV 4.75 5.25 5.75 V Under-voltage Hysteresis VUVHYS – 0.25 – V Under-voltage Power-ON Reset VUVPOR – – 4.75 V VDD Sleep State Current Under-voltage Shutdown Threshold(8) (9) Notes 7. Not guaranteed in production. 8. The under-voltage fault condition is reported to SPI register as long as the external VDD supply is within specification and the VPWR voltage level does not go below the under-voltage Power-ON Reset threshold. 9. This applies when the under-voltage fault is not latched (IN = [0:3]). 33874 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ VPWR ≤ 27V, 4.5V ≤ VDD ≤ 5.5V, - 40°C ≤ TA ≤ 125°C, GND = 0V, unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max VPWR = 6.0V – – 55 VPWR = 10V – – 35 VPWR = 13V – – 35 VPWR = 6.0V – – 94 VPWR = 10V – – 60 VPWR = 13V – – 60 – – 70 Unit OUTPUTS (HS0, HS1, HS2, HS3) Output Drain-to-Source ON Resistance (IHS = 5.0A, TA = 25°C) Output Drain-to-Source ON Resistance (IHS = 5.0A, TA = 150°C) Output Source-to-Drain ON Resistance(10) RDS(ON) mΩ RDS(ON) mΩ RSD(ON) IHS = 1.0A, TA = 25°C, VPWR = -12V mΩ Output Overcurrent High Detection Levels (9.0V < VPWR < 16V) A SOCH = 0 IOCH0 44 55 66 SOCH = 1 IOCH1 32 40 48 Overcurrent Low Detection Levels (9.0V < VPWR < 16V) A SOCL[2:0] : 000 IOCL0 8.0 10 12 SOCL[2:0] : 001 IOCL1 7.1 8.9 10.7 SOCL[2:0] : 010 IOCL2 6.3 7.9 9.5 SOCL[2:0] : 011 IOCL3 5.6 7.0 8.5 SOCL[2:0] : 100 IOCL4 4.6 5.8 7.0 SOCL[2:0] : 101 IOCL5 3.8 4.8 5.8 SOCL[2:0] : 110 IOCL6 3.1 3.9 4.7 SOCL[2:0] : 111 IOCL7 2.2 2.8 3.4 Current Sense Ratio (9.0V < VPWR < 16V, CSNS < 4.5V) – DICR D2 = 0 CSR0 – 1/7200 – DICR D2 = 1 CSR1 – 1/21400 – Current Sense Ratio (CSR0) Accuracy CSR0_ACC % Output Current 2.0A to 10A -17 – 17 Notes 10. Source-Drain ON Resistance (Reverse Drain-to-Source ON Resistance) with negative polarity VPWR. 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 7 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ VPWR ≤ 27V, 4.5V ≤ VDD ≤ 5.5V, - 40°C ≤ TA ≤ 125°C, GND = 0V, unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit OUTPUTS (HS0, HS1, HS2, HS3) (continued) Current Sense Ratio (CSR1) Accuracy CSR1_ACC % Output Current 10A to 20A Current Sense Clamp Voltage -19 – 19 4.5 6.0 7.0 30 – 100 2.0 3.0 4.0 - 20 – -16 TSD 155 175 190 °C TSD(HYS) 5.0 – 20 °C VCL(CSNS) CSNS Open; IHS[0:3] = 11A Open Load Detection Current(11) IOLDC Output Fault Detection Threshold VOFD(THRES) Output Programmed OFF Output Negative Clamp Voltage Over-temperature Shutdown Hysteresis(12) μA V VCL 0.5A < IHS[0:3] < 2.0A, Output OFF Over-temperature Shutdown(12) V V Notes 11. Output OFF Open Load Detection Current is the current required to flow through the load for the purpose of detecting the existence of an open load condition when the specific output is commanded OFF. 12. Guaranteed by process monitoring. Not production tested. 33874 8 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ VPWR ≤ 27V, 4.5V ≤ VDD ≤ 5.5V, - 40°C ≤ TA ≤ 125°C, GND = 0V, unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit Input Logic High-voltage(13) VIH 0.7 VDD Input Logic Low-voltage(13) VIL – – – V – 0.2 VDD V CONTROL INTERFACE (SCLK, SI, SO, IN[0:3], RST, WAKE, FS, CS, FSI) Input Logic Voltage Hysteresis(14) VIN(HYS) 100 850 1200 mV Input Logic Pull-down Current (SCLK, SI, IN[0:3], VIN>0.2 x VDD) IDWN 5.0 – 20 μA RST Input Voltage Range VRST 4.5 5.0 5.5 V SO, FS Tri-State Capacitance(14) CSO – – 20 pF RDWN 100 200 400 kΩ CIN – 4.0 12 pF 7.0 – 14 Input Logic Pull-down Resistor (RST) and WAKE Input Capacitance(15) Wake Input Clamp Voltage(16) VCL(WAKE) ICL(WAKE) < 2.5mA Wake Input Forward Voltage VF(WAKE) ICL(WAKE) = -2.5mA SO High-state Output Voltage - 0.3 0.8 VDD – – – 0.2 0.4 - 5.0 0 5.0 5.0 – 20 V V μA μA IUP CS, VIN < 0.7 x VDD FSI Input pin External Pull-down Resistance(18) – ISO(LEAK) CS > 0.7 x VDD, 0 < VSO < VDD Input Logic Pull-up Current(17) - 2.0 VSOL IOL = -1.6mA SO Tri-state Leakage Current V VSOH IOH = 1.0mA FS, SO Low-state Output Voltage V RFS FSI Disabled, HS[0:3] state according to direct inputs state and SPI INx_SPI bits and A/O_s bit kΩ – 0 1.0 FSI Enabled, HS[0:3] OFF 6.0 6.5 7.0 FSI Enabled, HS0 ON, HS[1:3] OFF 15 17 19 FSI Enabled, HS0 and HS2 ON, HS1 and HS3 OFF 40 Infinite – 3.8 3.9 4.0 -7.2 -7.5 -7.8 Temperature Feedback TFEED TA = 25°C Temperature Feedback Derating DTFEED V mV/°C Notes 13. Upper and lower logic threshold voltage range applies to SI, CS, SCLK, RST, IN[0:3], and WAKE input signals. The WAKE and RST signals may be supplied by a derived voltage referenced to VPWR. 14. 15. 16. 17. 18. No hysteresis on FSI and wake pins. Parameter is guaranteed by process monitoring but is not production tested. Input capacitance of SI, CS, SCLK, RST, and WAKE. This parameter is guaranteed by process monitoring but is not production tested. The current must be limited by a series resistance when using voltages > 7.0V. Pull-up current is with CS OPEN. CS has an active internal pull-up to VDD. The selection of the RFS must take into consideration the tolerance, temperature coefficient and lifetime duration to assure that the resistance value will always be within the desired (specified) range. 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 9 ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions 6.0V ≤ VPWR ≤ 27V, 4.5V ≤ VDD ≤ 5.5V, - 40°C ≤ TA ≤ 125°C, GND = 0V, unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit POWER OUTPUT TIMING (HS0, HS1, HS2, HS3) Output Rising Slow Slew Rate A (DICR D3 = 0)(19) SRRA_SLOW 9.0V < VPWR < 16V Output Rising Slow Slew Rate B (DICR D3 = 0)(20) DICR = 0 Output Turn-OFF Delay Time in Fast Slew Rate Mode(22) 3.0 0.025 0.3 1.0 0.1 0.3 0.75 0.015 0.05 0.15 0.5 1.5 3.0 V/μs V/μs V/μs V/μs V/μs V/μs 0.025 0.3 1.0 2.0 30 200 1.0 6.0 100 40 200 800 μs μs t DLY_FAST(ON) DICR = 1 Output Turn-OFF Delay Time in Slow Slew Rate Mode(22) 1.5 t DLY_SLOW(ON) DICR = 0 Output Turn-ON Delay Time in Fast Slew Rate(21) 0.5 V/μs SRFB_FAST 9.0V < VPWR < 16V Output Turn-ON Delay Time in Slow Slew Rate(21) 0.15 SRFA_FAST 9.0V < VPWR < 16V Output Falling Fast Slew Rate B (DICR D3 = 1)(20) 0.05 SRFB_SLOW 9.0V < VPWR < 16V Output Falling Fast Slew Rate A (DICR D3 = 1)(19) 0.015 SRFA_SLOW 9.0V < VPWR < 16V Output Falling Slow Slew Rate B (DICR D3 = 0)(20) 0.75 SRRB_FAST 9.0V < VPWR < 16V Output Falling Slow Slew Rate A (DICR D3 = 0)(19) 0.3 SRRA_FAST 9.0V < VPWR < 16V Output Rising Fast Slew Rate B (DICR D3 = 1)(20) 0.1 SRRB_SLOW 9.0V < VPWR < 16V Output Rising Fast Slew Rate A (DICR D3 = 1)(19) V/μs t DLY_SLOW(OF F) μs t DLY_FAST(OFF) DICR = 1 μs 20 50 400 108 155 202 Over-current Low Detection Blanking Time OCLT[1:0]: 00 OCLT[1:0]: 01(23) OCLT[1:0]: 10 OCLT[1:0]: 11 ms t OCL0 t OCL1 t OCL2 t OCL3 – – – 55 75 95 0.08 0.15 0.3 Notes 19. Rise and Fall Slew Rates A measured across a 5.0Ω resistive load at high side output = 0.5V to VPWR - 3.5V (see Figure 4, page 12). These parameters are guaranteed by process monitoring. 20. Rise and Fall Slew Rates B measured across a 5.0Ω resistive load at high side output = 0.5V to VPWR - 3.5V (see Figure 4). These parameters are guaranteed by process monitoring. 21. Turn-ON delay time measured from rising edge of any signal (IN[0 : 3], SCLK, CS) that would turn the output ON to VHS[0 : 3] = 0.5V with RL = 5.0Ω resistive load. 22. Turn-OFF delay time measured from falling edge of any signal (IN[0 : 3], SCLK, CS) that would turn the output OFF to VHS[0 : 3] = VPWR 0.5V with RL = 5.0Ω resistive load. 23. This logical bit is not defined. Do not use. 33874 10 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0V ≤ VPWR ≤ 27V, 4.5V ≤ VDD ≤ 5.5V, - 40°C ≤ TA ≤ 125°C, GND = 0V, unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit POWER OUTPUT TIMING (HS0, HS1, HS2, HS3) (continued) Over-current High Detection Blanking Time CS to CSNS Valid Time(24) Watchdog tOCH 1.0 5.0 20 μs t CNSVAL – – 10 μs t WDTO0 t WDTO1 t WDTO2 t WDTO3 446 558 725 Timeout(25) ms WD[1:0] : 00 WD[1:0] : 01 WD[1:0] : 10 WD[1:0] : 11 223 279 363 1800 2250 2925 900 1125 1463 fPWM - 300 - Hz f SPI – – 3.0 MHz t WRST – 50 350 ns t CS – – 300 ns Rising Edge of RST to Falling Edge of CS (Required Setup Time) t ENBL – – 5.0 μs Falling Edge of CS to Rising Edge of SCLK (Required Setup Time)(27) t LEAD – 50 167 ns (27) t WSCLKh – – 167 ns Required Low-state Duration of SCLK (Required Setup Time)(27) t WSCLKl – – 167 ns Direct Input Switching Frequency (DICR D3 = 0) SPI INTERFACE CHARACTERISTICS (RST, CS, SCLK, SI, SO) Maximum Frequency of SPI Operation (26) Required Low-state Duration for RST Rising Edge of CS to Falling Edge of CS (Required Setup Time)(27) (27) Required High-state Duration of SCLK (Required Setup Time) Falling Edge of SCLK to Rising Edge of CS (Required Setup Time) SI to Falling Edge of SCLK (Required Setup Time)(28) Falling Edge of SCLK to SI (Required Setup Time) (28) (27) t LAG – 50 167 ns t SI (SU) – 25 83 ns t SI (HOLD) – 25 83 ns – 25 50 – 25 50 t RSO SO Rise Time CL = 200pF ns t FSO SO Fall Time CL = 200pF ns SI, CS, SCLK, Incoming Signal Rise Time(28) t RSI – – 50 ns SI, CS, SCLK, Incoming Signal Fall Time(28) t FSI – – 50 ns Low-impedance(29) t SO(EN) – – 145 ns Time from Rising Edge of CS to SO High-impedance(30) t SO(DIS) – 65 145 ns – 65 105 Time from Falling Edge of CS to SO Time from Rising Edge of SCLK to SO Data Valid 0.2 VDD ≤ SO ≤ 0.8 x VDD, CL = 200pF (31) t VALID ns Notes 24. Time necessary for the CSNS to be with ±5% of the targeted value. 25. Watchdog timeout delay measured from the rising edge of WAKE or RST from a sleep state condition, to output turn-ON with the output driven OFF and FSI floating. The values shown are for WDR setting of . The accuracy of t WDTO is consistent for all configured watchdog timeouts. 26. RST low duration measured with outputs enabled and going to OFF or disabled condition. 27. Maximum setup time required for the 33874 is the minimum guaranteed time needed from the microcontroller. 28. Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing. 29. Time required for output status data to be available for use at SO. 1.0kΩ on pull-up on CS. 30. Time required for output status data to be terminated at SO. 1.0kΩ on pull-up on CS. 31. Time required to obtain valid data out from SO following the rise of SCLK. 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 11 ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TIMING DIAGRAMS CS VPWR V PWR VPWR - 0.5V VPWR -0.5 V SRFB_SLOW & SRFB_FAST SRRB_SLOW & SRRB VPWR - 3V -3.5 V VPWR SRFA_SLOW & SRFA_FAST SRRA_SLOW & SRRA_FAST t 0.5V 0.5 V t DLY_SLOW(OFF) & t DLY_FAST(OFF) tDLY(ON) Figure 4. Output Slew Rate and Time Delays IOCHx Load Current t OCH IOCLx t OCLx Time Figure 5. Over-current Shutdown 33874 12 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS IOCH0 IOCH1 IOCL0 IOCL1 IOCL2 Load Current IOCL3 IOCL4 IOCL5 IOCL6 IOCL7 Time t OCH t OCL3 t OCL2 t OCL0 Figure 6. Over-current Low and High Detection VIH VIH RSTB RST 0.2 VDD 0.2 VDD tWRST TwRSTB tENBL VIL VIL tTCSB CS TENBL VIH VIH 0.7 VDD 0.7VDD CS CSB 0.2 VDD 0.7VDD tTlead LEAD VIL VIL t RSI t WSCLKh TwSCLKh TrSI t LAG Tlag 0.70.7VDD VDD SCLK SCLK VIH VIH 0.2 VDD 0.2VDD t TSIsu SI(SU) VIL VIL t WSCLKl TwSCLKl t SI(HOLD) TSI(hold) SI SI 0.7 0.7 V VDD DD 0.2VDD 0.2 VDD Don’t Care Valid tTfSI FSI Don’t Care Valid Don’t Care VIH VIH VIH VIL Figure 7. Input Timing Switching Characteristics 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 13 ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS tFSI tRSI TrSI TfSI VOH VOH 3.5 V 3.5V 50% SCLK SCLK 1.0VV 1.0 VOL VOL t SO(EN) TdlyLH SO SO 0.7 V VDD DD 0.20.2 VDD VDD Low-to-High Low to High TrSO t RSO VOH VOH VOL VOL VALID tTVALID SO TfSO t FSO SO VOH VOH VDD VDD High to Low 0.70.7 High-to-Low 0.2VDD 0.2 VDD TdlyHL VOL VOL t SO(DIS) Figure 8. SCLK Waveform and Valid SO Data Delay Time 33874 14 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION The 33874 is one in a family of devices designed for lowvoltage automotive and industrial lighting and motor control applications. Its four low RDS(ON) MOSFETs (35mΩ) can control the high sides of four separate resistive or inductive loads. allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush or motor stall intervals. Such programmability allows tight control of fault currents and can protect wiring harnesses and circuit boards as well as loads. Programming, control, and diagnostics are accomplished using a 16-bit SPI interface. Additionally, each output has its own parallel input for PWM control if desired. The 33874 The 33874 is packaged in a power-enhanced 12 x 12 nonleaded PQFN package with exposed tabs. FUNCTIONAL PIN DESCRIPTION OUTPUT CURRENT MONITORING (CSNS) The Current Sense pin sources a current proportional to the designated HS0 : HS3 output. That current is fed into a ground-referenced resistor and its voltage is monitored by an MCU's A/D. The output to be monitored is selected via the SPI. This pin can be tri-stated through the SPI. SERIAL INPUTS (IN0, IN1, IN2, IN3) The IN0 : IN3 high side input pins are used to directly control HS0 : HS3 high side output pins, respectively. A SPI register determines if each input is activated or if the input logic state is OR ed or AND ed with the SPI instruction. These pins are to be driven with 5.0V CMOS levels, and they have an active internal pull-down current source. TEMPERATURE FEEDBACK (TEMP) This pin reports an analog voltage value proportional to the temperature of the GND. It is used by the MCU to monitor board temperature. FAULT STATUS (FS) This pin is an open drain configured output requiring an external pull-up resistor to VDD for fault reporting. If a device fault condition is detected, this pin is active LOW. Specific device diagnostic faults are reported via the SPI SO pin. WAKE This input pin controls the device mode and watchdog timeout feature if enabled. An internal clamp protects this pin from high damaging voltages when the output is current limited with an external resistor. This input has a passive internal pull-down. RESET (RST) This input pin is used to initialize the device configuration and fault registers, as well as place the device in a lowcurrent sleep mode. The pin also starts the watchdog timer when transitioning from logic  to logic . This pin should not be allowed to be logic  until VDD is in regulation. This pin has a passive internal pull-down. CHIP SELECT (CS) The CS pin enables communication with the master microcontroller (MCU). When this pin is in a logic  state, the device is capable of transferring information to, and receiving information from, the MCU. The 33874 latches in data from the Input Shift registers to the addressed registers on the rising edge of CS. The device transfers status information from the power output to the Shift register on the falling edge of CS. The SO output driver is enabled when CS is logic . CS should transition from a logic  to a logic  state only when SCLK is a logic . CS has an active internal pull-up, IUP. SERIAL CLOCK (SCLK) The SCLK pin clocks the internal shift registers of the 33874 device. The serial input (SI) pin accepts data into the input shift register on the falling edge of the SCLK signal while the serial output (SO) pin shifts data information out of the SO line driver on the rising edge of the SCLK signal. It is important the SCLK pin be in a logic low state whenever CS makes any transition. For this reason, it is recommended the SCLK pin be in a logic  whenever the device is not accessed (CS logic  state). SCLK has an active internal pull-down. When CS is logic , signals at the SCLK and SI pins are ignored and SO is tri-stated (high-impedance) (see Figure 9, page 18). SERIAL INPUT (SI) This is a serial interface (SI) command data input pin. Each SI bit is read on the falling edge of SCLK. A 16-bit stream of serial data is required on the SI pin, starting with D15 to D0. The internal registers of the 33874 are configured and controlled using a 5-bit addressing scheme described in Table 8, page 22. Register addressing and configuration are 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 15 FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION described in Table 9, page 22. The SI input has an active internal pull-down, IDWN. DIGITAL DRAIN VOLTAGE (VDD) This pin is an external voltage input pin used to supply power to the SPI circuit. In the event VDD is lost, an internal supply provides power to a portion of the logic, ensuring limited functionality of the device. GROUND (GND) This pin is the ground for the device. POSITIVE POWER SUPPLY (VPWR) This pin connects to the positive power supply and is the source of operational power for the device. The VPWR contact is the backside surface mount tab of the package. SERIAL OUTPUT (SO) The SO data pin is a tri-stateable output from the shift register. The SO pin remains in a high-impedance state until the CS pin is put into a logic  state. The SO data is capable of reporting the status of the output, the device configuration, and the state of the key inputs. The SO pin changes state on the rising edge of SCLK and reads out on the falling edge of SCLK. Fault and input status descriptions are provided in Table 16, page 26. HIGH SIDE OUTPUTS (HS3, HS1, HS0, HS2) Protected 35mΩ high side power output pins to the load. FAIL-SAFE INPUT (FSI) The value of the resistance connected between this pin and ground determines the state of the outputs after a watchdog timeout occurs. Depending on the resistance value, either all outputs are OFF or the output HSO only is ON. If the FSI pin is left to float up to a logic  level, then the outputs HS0 and HS2 will turn ON when in the Fail-safe state. When the FSI pin is connected to GND, the watchdog circuit and Fail-safe operation are disabled. This pin incorporates an active internal pull-up current source. 33874 16 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION MC33874 - Functional Block Diagram Analog Control Circuitry ANALOG CONTROL CIRCUITRY The 33874 is designed to operate from 6.0V to 27V on the VPWR Pin. The VPWR Pin supplies power to all internal regulators, analog and logic circuit blocks. The VDD supply is used for setting communication threshold levels and supplying power to the SPI interface logic. This IC architecture provides a very low standby current. The analog circuitry provides for over-current and over-temperature protection as well as temperature warning features. MCU INTERFACE AND OUTPUT CONTROL The device is designed with 4 inputs for PWM Output driver control, if desired. MCU programming, control and diagnostics are accomplished using the 16-bit SPI interface. Several parallel control and status lines are provided. HIGH–SIDE DRIVERS: HS0 – HS3 The 33874 provides high side load drive capability for 4 outputs. The RDSON for the output MOSFETs is 35mΩ. The outputs are protected for over-current and over-temperature. The MOSFET gate drive can be slew rate controlled using the SPI interface. There is also an open load detection feature. A ratioed value of the MOSFET output current is available to the MCU. The device allows for control of the 4 outputs through the SPI interface or by use of the parallel inputs, which allows for PWM capability. 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 17 FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES FUNCTIONAL DEVICE OPERATION SPI PROTOCOL DESCRIPTION The SI / SO pins of the 33874 follow a first-in first-out (D15 to D0) protocol, with both input and output words transferring the most significant bit (MSB) first. All inputs are compatible with 5.0V CMOS logic levels. The SPI interface has a full duplex, three-wire synchronous data transfer with four I/O lines associated with it: Serial Input (SI), Serial Output (SO), Serial Clock (SCLK), and Chip Select (CS). CSB CS CS SCLK SI D15 SO D14 D13 D12 D11 D10 D9 OD15 OD14 OD13 OD12 OD11 OD10 OD9 D8 OD8 D7 D6 OD7 OD6 D5 OD5 D4 D3 OD4 OD3 D2 OD2 D1 D0 OD1 OD0 Notes 1. RST is a logic  state during the above operation. D15is: D0 to the most ordered entry of data into the device. NOTES: 1. 2.RSTB in arelate logic H state during therecent above operation. OD15 : OD0 relate thetofirst 16 bits ofordered ordered fault and status data out IC of the device. device. 2. 3.DO, D1, D2, ... , and D15to relate the most recent entry of program data into the LUX Figure 9. Single 16-Bit Word SPI Communication OPERATIONAL MODES The 33874 has four operating modes: Sleep, Normal, Fault, and Fail-safe. Table 5 summarizes details contained in succeeding paragraphs. Table 5. Fail-Safe Operation and Transitions to Other 33874 Modes FS Sleep x 0 0 x Device is in Sleep mode. All outputs are OFF Normal 1 x 1 No Normal mode. Watchdog is active if enabled. Fault 0 1 1 No 0 1 0 NORMAL MODE 0 0 1 Device is currently in fault mode. The faulted output(s) is (are) OFF. 1 0 1 1 1 1 1 1 0 Watchdog has timed out and the device is in Fail-safe Mode. The outputs are as configured with the RFS resistor connected to FSI. RST and WAKE must go from logic  to logic  simultaneously to bring the device out of the Fail-safe mode or momentarily tied the FSI pin to ground. FAIL-SAFE MODE x = Don’t care. Yes Comments The Default mode of the 33874 is the Sleep Mode. This is the state of the device after first applying battery voltage (VPWR) prior to any I/O transitions. This is also the state of the device when the WAKE and RST are both logic . In the Sleep Mode, the output and all unused internal circuitry, such as the internal 5.0V regulator, are off to minimize current draw. In addition, all SPI-configurable features of the device are as if set to logic . The 33874 will transition to the Normal or Fail-safe operating modes based on the WAKE and RST inputs as defined in Table 5. Mode FailSafe Wake RST WDTO SLEEP MODE The 33874 is in Normal Mode when: • VPWR and VDD are within the normal voltage range. • RST pin is logic . • No fault has occurred. FAIL-SAFE MODE AND WATCHDOG If the FSI input is not grounded, the watchdog timeout detection is active when either the WAKE or RST input pin transitions from logic  to logic . The WAKE input is capable of being pulled up to VPWR with a series of limiting 33874 18 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES resistance limiting the internal clamp current according to the specification. Table 5 summarizes the various methods for resetting the device from the latched Fail-safe Mode. The Watchdog timeout is a multiple of an internal oscillator and is specified in the Table 15, page 24. As long as the WD bit (D15) of an incoming SPI message is toggled within the minimum watchdog timeout period (WDTO), based on the programmed value of the WDR, the device will operate normally. If an internal watchdog timeout occurs before the WD bit, the device will revert to a Fail-safe mode until the device is reinitialized. If the FSI pin is tied to GND, the Watchdog fail-safe operation is disabled. During the Fail-safe Mode, the outputs will be ON or OFF depending upon the resistor RFS connected to the FSI pin, regardless of the state of the various direct inputs and modes (Table 6). Table 6. Output State During Fail-safe Mode RFS (kΩ) High Side State 0 (shorted to ground) Fail-safe Mode Disabled 6.0 All HS OFF 15 HS0 ON HS1 : HS3 OFF 30 (open) HS0 and HS2 ON HS1 and HS3 OFF In the Fail-safe Mode, the SPI register content is retained except for over-current high and low detection levels, timing and latched over-temperature which are reset to their default value (SOCL, SOCH, and OCTL and OT_latch_[0:3] bits). Then the watchdog, over-voltage, over-temperature, and over-current circuitry (with default value) are fully operational. The Fail-safe Mode can be detected by monitoring the WDTO bit D2 of the WD register. This bit is logic  when the device is in Fail-safe Mode. The device can be brought out of the Fail-safe Mode by transitioning the WAKE and RST pins from logic  to logic  or forcing the FSI pin to logic . LOSS OF VDD If the external 5.0 V supply is not within specification, or even disconnected, all register content is reset. The outputs can still be driven by the direct inputs IN0 : IN3. The 33874 uses the battery input to power the output MOSFET-related current sense circuitry and any other internal logic providing fail-safe device operation with no VDD supplied. In this state, the watchdog, under-voltage, over-voltage, over-temperature (latched) and over-current circuitry are fully operational with default values. FAULT MODE This 33874 indicates the faults below as they occur by driving the FS pin to logic : • • • • Over-temperature fault Over-voltage and under-voltage fault Open load fault Over-current fault (high and low) The FS pin will automatically return to logic  when the fault condition is removed, except for overcurrent, overtemperature (in case of latching configuration) and in some cases of undervoltage. The FS pin reports all faults. For latched faults, this pin is reset by a new Switch ON command (via the SPI or direct input IN). Fault information is retained in the fault register and is available (and reset) via the SO pin during the first valid SPI communication (refer to Table 17, page 26). PROTECTION AND DIAGNOSTIC FEATURES OVER-TEMPERATURE FAULT (LATCHING OR NON-LATCHING) • in Fail-safe Mode: the FSI input must be grounded and then set to its nominal voltage to switch ON the outputs. The 33874 incorporates over-temperature detection and shutdown circuitry for each output structure. The over-temperature fault (one for each output) is reported by SPI. If the over-temperature is latched, the SPI reports OTF_s =  and OCLF_s = . In case of nonlatched, OTF_s =  only is reported. The over-temperature is latched per default and can be unlatched through SPI with OT_latch_[0:3] bits. An over-temperature fault condition results in turning OFF the corresponding output. To remove the fault and be able to turn ON again the outputs, the failure must be removed and: • in Normal Mode: the corresponding output must be commanded OFF and ON again in case of overtemperature latched (OT_latch bit = 0). • in Normal Mode: the corresponding output turns ON automatically if the temperature is below TSD-TSD(HYS) in case of unlatched over-temperature (OT_latch bit = 1). The fault bits will be cleared in the status register after either a valid SPI read command or a power on reset of the device. OVERCURRENT FAULT (LATCHING) The 33874 has eight programmable over-current low detection levels (IOCL) and two programmable over-current high detection levels (IOCH) for maximum device protection. The two selectable, simultaneously active over-current 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 19 FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES detection levels, defined by IOCH and IOCL, are illustrated in Figure 6, page 13. The eight different over-current low detect levels (IOCL0 : IOCL7) are illustrated in Figure 6. If the load current level ever reaches the selected overcurrent low detection level and the over-current condition exceeds the programmed over-current time period (tOCx), the device will latch the output OFF. If at any time the current reaches the selected IOCH level, then the device will immediately latch the fault and turn OFF the output, regardless of the selected tOCH driver. For both cases, the device output will stay off indefinitely until the device is commanded OFF and then ON again. OVER-VOLTAGE FAULT (NON-LATCHING) The 33874 shuts down the output during an over-voltage fault (OVF) condition on the VPWR pin. The output remains in the OFF state until the over-voltage condition is removed. When experiencing this fault, the OVF fault bit is set in the bit D1 and cleared after either a valid SPI read or a power reset of the device. The over-voltage protection can be disabled through SPI (bit OV_DIS). When disabled, the returned SO bit OD13 still reflects any over-voltage condition (over-voltage warning). UNDER-VOLTAGE SHUTDOWN (LATCHING OR NON-LATCHING) The output(s) will latch off at some battery voltage below 6.0 V. As long as the VDD level stays within the normal specified range, the internal logic states within the device will be sustained. In the case where battery voltage drops below the undervoltage threshold (VPWRUV) output will turn off, FS will go to logic 0, and the fault register UVF bit will be set to 1. Two cases need to be considered when the battery level recovers : • If outputs command are low, FS will go to logic 1 but the UVF bit will remain set to 1 until the next read operation (warning report). • If the output command is ON, then FS will remain at logic 0. The output must be turned OFF and ON again to re-enable the state of output and release FS. The UVF bit will remain set to 1 until the next read operation. The under-voltage protection can be disabled through SPI (bit UV_dis = 1). In this case, the FS does not report any under-voltage fault condition, UVF bit is set to 1, and the output state is not changed as long as the battery voltage does not drop any lower than 2.5 V. The daisy chain feature is available under VDD in nominal conditions. 33874 20 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES Table 7. Device behavior in case of Under-voltage Quad High Side Switch (VPWR Battery Voltage) ∗∗ VPWR > VPWRUV VPWRUV > VPWR > UVPOR UVPOR > VPWR > 2.5V ∗ State Output State UV Enable UV Enable UV Enable UV Enable IN[0:3] = 0 IN[0:3] = 0 IN_x*** = 1 IN_x*** = 1 (Falling VPWR) (Rising VPWR) (Falling VPWR) (Rising VPWR) UV Disable UV Disable IN[0:3] = 0 IN_x*** = 1 (Falling or (Falling or Rising VPWR) Rising VPWR) OFF OFF ON OFF OFF ON FS State 1 1 1 0 1 1 SPI Fault Register UVF Bit 0 1 until next read 0 1 0 (falling) 1 until next read (rising) 0 (falling) 1 until next read (rising) OFF OFF OFF OFF OFF ON FS State 0 0 0 0 1 1 SPI Fault Register UVF Bit 1 1 1 1 1 1 OFF OFF OFF OFF OFF ON 1 1 1 1 1 1 Output State Output State FS State SPI Fault Register 1 until next read 1 until next read 1 until next read 1 until next read 1 until next read 1 until next read UVF Bit 2.5V > VPWR > 0V Output State FS State OFF OFF OFF OFF OFF OFF 1 1 1 1 1 1 SPI Fault Register 1 until next read 1 until next read 1 until next read 1 until next read 1 until next read 1 until next read UVF Bit Comments UV fault is not latched UV fault is not latched UV fault is latched ∗ = Typical value; not guaranteed ∗∗ = While VDD remains within specified range. *** = IN_x is equivalent to IN_x direct input or IN_spi_s SPI input. OPEN LOAD FAULT (NON-LATCHING) The 33874 incorporates open load detection circuitry on the output. Output open load fault (OLF) is detected and reported as a fault condition when the output is disabled (OFF). The open load fault is detected and latched into the status register after the internal gate voltage is pulled low enough to turn OFF the output. The OLF fault bit is set in the status register. If the open load fault is removed, the status register will be cleared after reading the register. The open load protection can be disabled through SPI (bit OL_DIS). It is recommended to disable open load circuitry in case of a permanent disconnected load. REVERSE BATTERY The output survives the application of reverse voltage as low as -16V. Under these conditions, the output’s gate is enhanced to keep the junction temperature less than 150°C. The ON resistance of the output is fairly similar to that in the Normal mode. No additional passive components are required except on VDD. GROUND DISCONNECT PROTECTION In the event the 33874 ground is disconnected from load ground, the device protects itself and safely turns OFF the output regardless of the state of the output at the time of disconnection. A 10KΩ resistor needs to be added between the wake pin and the rest of the circuitry in order to ensure that the device turns off in case of ground disconnect and to prevent this pin to exceed its maximum ratings. Current limit resistors in the digital input lines protect the digital supply against excessive current (10kΩ typical). 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 21 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS LOGIC COMMANDS AND REGISTERS SERIAL INPUT COMMUNICATION D4 : D0, are used to configure and control the outputs and their protection features. SPI communication is accomplished using 16-bit messages. A message is transmitted by the MCU starting with the MSB D15 and ending with the LSB, D0 (Table 8). Each incoming command message on the SI pin can be interpreted using the following bit assignments: the MSB, D15, is the watchdog bit. In some cases, output selection is done with bits D12 : D11. The next three bits, D10 : D8, are used to select the command register. The remaining five bits, Multiple messages can be transmitted in succession to accommodate those applications where daisy-chaining is desirable, or to confirm transmitted data, as long as the messages are all multiples of 16 bits. Any attempt made to latch in a message that is not 16 bits will be ignored. The 33874 has defined registers, which are used to configure the device and to control the state of the outputs. Table 9, page 22, summarizes the SI registers. Table 8. SI Message Bit Assignment Bit Sig SI Msg Bit MSB D15 Message Bit Description Watchdog in: toggled to satisfy watchdog requirements. D14 : D15 Not used. D12 : D11 Register address bits used in some cases for output selection. D10 : D8 Register address bits. D7 : D5 Not used. D4 : D1 Used to configure the inputs, outputs, and the device protection features and SO status content. D0 Used to configure the inputs, outputs, and the device protection features and SO status content. LSB Table 9. Serial Input Address and Configuration Bit Map SI Data SI Register D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 STATR_s WDIN 0 0 0 0 0 0 0 0 0 0 SOA4 SOA3 SOA2 SOA1 SOA0 OCR0 WDIN 0 0 0 0 0 0 1 0 0 0 0 IN3_SPI IN2_SPI IN1_SPI IN0_SPI OCR1 WDIN 0 0 0 1 0 0 1 0 0 0 0 CSNS3 EN CSNS2 EN CSNS1 EN CSNS0 EN SOCHLR_s WDIN 0 0 A1 A0 0 1 0 0 0 0 0 SOCH_s SOCL2_s SOCL1_s SOCL0_s CDTOLR_s WDIN 0 0 A1 A0 0 1 1 0 0 0 0 OL_DIS_s OCL_DIS_s OCLT1_s OCLT0_s DICR_s WDIN 0 0 A1 A0 1 0 0 0 0 0 0 FAST_SR_s CSNS_high_s DIR_DIS_s A/O_s UOVR WDIN 0 0 0 0 1 0 1 0 0 0 0 OT_latch-1 OT_latch_0 UV_DIS OV_DIS WDR WDIN 0 0 0 1 1 0 1 0 0 0 0 OT_latch_3 OT_latch_2 WD1 WD0 NAR WDIN 0 0 0 0 1 1 0 0 0 0 0 RESET 0 0 0 X X X X X 0 0 0 0 No Action (Allow Toggling of D15- WDIN) 0 0 0 0 x = Don’t care. s = Output selection with the bits A1A0 as defined in Table 10. D15 is used to toggle watchdog event (WDIN) DEVICE REGISTER ADDRESSING ADDRESS 00000 — STATUS REGISTER (STATR_S) The following section describes the possible register addresses and their impact on device operation. The STATR register is used to read the device status and the various configuration register contents without disrupting the device operation or the register contents. The register bits D[4:0] determine the content of the first sixteen bits of SO data. In addition to the device status, this feature provides the ability to read the content of the OCR0, OCR1, SOCHLR, 33874 22 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS CDTOLR, DICR, UOVR, WDR, and NAR registers. (Refer to the section entitled Serial Output Communication (Device Status Return Data) beginning on page 24.) ADDRESS 00001— OUTPUT CONTROL REGISTER (OCR0) The OCR0 register allows the MCU to control the ON / OFF state of four outputs through the SPI. Incoming message bit D3 : D0 reflects the desired states of the four high side outputs (INx_SPI), respectively. A logic  enables the corresponding output switch and a logic  turns it OFF. ADDRESS 01001— OUTPUT CONTROL REGISTER (OCR1) Incoming message bits D3 : D0 reflect the desired output that will be mirrored on the Current Sense (CSNS) pin. A logic  on message bits D3 : D0 enables the CSNS pin for outputs HS3 : HS0, respectively. In the event the current sense is enabled for multiple outputs, the current will be summed. In the event that bits D3 : D0 are all logic , the output CSNS will be tri-stated. This is useful when several CSNS pins of several devices share the same A /D converter. ADDRESS A1A0010 — SELECT OVER-CURRENT HIGH AND LOW REGISTER (SOCHLR_S) The SOCHLR_s register allows the MCU to configure the output over-current low and high detection levels, respectively. Each output “s” is independently selected for configuration based on the state of the D12 : D11 bits (Table 10). Table 10. Output Selection A1 (D12) A0 (D11) HS_s 0 0 HS0 0 1 HS1 1 0 HS2 1 1 HS3 Each output can be configured to different levels. In addition to protecting the device, this slow blow fuse emulation feature can be used to optimize the load requirements matching system characteristics. Bits D2 : D0 set the over-current low detection level to one of eight possible levels, as shown in Table 11, page 23. Bit D3 sets the over-current high detection level to one of two levels, as outlined in Table 12, page 23. Table 11. Over-current Low Detection Levels SOCL2_s* SOCL1_s* SOCL0_s* (D2) (D1) (D0) Over-current Low Detection (Amperes) HS0 to HS3 0 0 0 10 0 0 1 8.9 0 1 0 7.9 0 1 1 7.0 1 0 0 5.8 1 0 1 4.8 1 1 0 3.9 1 1 1 2.8 * “_s” refers to the output, which is selected through bits D12 : D11; refer to Table 10, page 23. Table 12. Over-current High Detection Levels SOCH_s* (D3) Over-current High Detection (Amperes) HS0 to HS3 0 55 1 40 * “_s” refers to the output, which is selected through bits D12 : D11; refer to Table 10, page 23. ADDRESS A1A0011 — CURRENT DETECTION TIME AND OPEN LOAD REGISTER (CDTOLR) The CDTOLR register is used by the MCU to determine the amount of time the device will allow an over-current low condition before an output latches OFF. Each output is independently selected for configuration based on A1A0 , which are the state of the D12 : D11 bits (refer to Table 10, page 23). Bits D1 : D0 (OCLT1_s : OCLT0_s) allow the MCU to select one of three over-current fault blanking times defined in Table 13. Note that these timeouts apply only to the overcurrent low detection levels. If the selected over-current high level is reached, the device will latch off within 20μs. Table 13. Over-current Low Detection Blanking Time OCLT[1:0]_s* Timing 00 155ms 01 Do not use 10 75ms 11 150μs * “_s” refers to the output, which is selected through bits D12 : D11; refer to Table 10, page 23. 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 23 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS A logic  on bit D2 (OCL_DIS_s) disables the overcurrent low detection feature. When disabled, there is no timeout for the selected output and the over-current low detection feature is disabled. A logic  on bit D3 (OL_DIS_s) disables the open load (OL) detection feature for the output corresponding to the state of bits D12 : D11. ADDRESS A1A0100 — DIRECT INPUT CONTROL REGISTER (DICR) The DICR register is used by the MCU to enable, disable, or configure the direct IN pin control of each output. Each output is independently selected for configuration based on the state bits D12 : D11 (refer to Table 10, page 23). For the selected output, a logic  on bit D1 (DIR_DIS_s) will enable the output for direct control. A logic  on bit D1 will disable the output from direct control. While addressing this register, if the Input was enabled for direct control, a logic  for the D0 (A/O_s) bit will result in a Boolean AND of the IN pin with its corresponding IN_SPI D[4:0] message bit when addressing OCR0. Similarly, a logic  on the D0 pin results in a Boolean OR of the IN pin to the corresponding message bits when addressing the OCR0. This register is especially useful if several loads are required to be independently PWM controlled. For example, the IN pins of several devices can be configured to operate all of the outputs with one PWM output from the MCU. If each output is then configured to be Boolean ANDed to its respective IN pin, each output can be individually turned OFF by SPI while controlling all of the outputs, commanded on with the single PWM output. A logic  on bit D2 (CSNS_high_s) is used to select the high ratio on the CSNS pin for the selected output. The default value  is used to select the low ratio (Table 14). ADDRESS 00101 — UNDER-VOLTAGE / OVERVOLTAGE AND HS[0,1] OVER-TEMPERATURE REGISTER (UOVR) The UOVR register disables the under-voltage (D1) and/or over-voltage (D0) protection. When these two bits are , the under and over-voltages are active (default value). The UOVR register allows the over-temperature detection latching on the HS0 and HS1. To latch the over-temperature, the bits (OT_latch_1 and OT_latch_0) must be set to  which is the default value. To disable the latching, both bits must be set to . ADDRESS 01101 — WATCHDOG AND HS[2,3] OVER-TEMPERATURE REGISTER (WDR) The WDR register is used by the MCU to configure the watchdog timeout. The watchdog timeout is configured using bits D1 and D0. When D1 and D0 bits are programmed for the desired watchdog timeout period (Table 15), the WDSPI bit should be toggled as well, ensuring the new timeout period is programmed at the beginning of a new count sequence. The WDR register allows the over-temperature detection latching on the HS2 and HS3. To latch the over-temperature, the bits (OT_latch_3 and OT_latch_2) must be set to  which is the default value. To disable the latching, both bits must be set to . Table 15. Watchdog Timeout WD[1:0] (D1, D0) Timing (ms) 00 558 01 279 10 2250 11 1125 Table 14. Current Sense Ratio CSNS_high_s* (D2) Current Sense Ratio HS0 to HS3 0 1/7200 1 1/21400 * “_s” refers to the output, which is selected through bits D12 : D11; refer to Table 10, page 23. A logic  on bit D3 (FAST_SR_s) is used to select the high speed slew rate for the selected output, the default value  corresponds to the low speed slew rate. ADDRESS 00110 — NO ACTION REGISTER (NAR) The NAR register can be used to no-operation fill SPI data packets in a daisy-chain SPI configuration. This would allow devices to be unaffected by commands being clocked over a daisy-chained SPI configuration. By toggling the WD bit (D15) the watchdog circuitry would continue to be reset while no programming or data read back functions are being requested from the device. SERIAL OUTPUT COMMUNICATION (DEVICE STATUS RETURN DATA) When the CS pin is pulled low, the output register is loaded. Meanwhile, the data is clocked out MSB- (OD15-) first as the new message data is clocked into the SI pin. The first sixteen bits of data clocking out of the SO, and following a CS transition, is dependent upon the previously written SPI word. 33874 24 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Any bits clocked out of the Serial Output (SO) pin after the first 16 bits will be representative of the initial message bits clocked into the SI pin since the CS pin first transitioned to a logic . This feature is useful for daisy-chaining devices as well as message verification. A valid message length is determined following a CS transition of  to . If there is a valid message length, the data is latched into the appropriate registers. A valid message length is a multiple of 16 bits. At this time, the SO pin is tri-stated and the fault status register is now able to accept new fault status information. SO data will represent information ranging from fault status to register contents, user selected by writing to the STATR bits OD4, OD3, OD2, OD1, and OD0. The value of the previous bits SOA4 and SOA3 will determine which output the SO information applies to for the registers which are output specific; viz., Fault, SOCHLR, CDTOLR, and DICR registers. Note that the SO data will continue to reflect the information for each output (depending on the previous OD4, OD3 state) that was selected during the most recent STATR write until changed with an updated STATR write. The output status register correctly reflects the status of the STATR-selected register data at the time that the CS is pulled to a logic  during SPI communication, and/or for the period of time since the last valid SPI communication, with the following exceptions: • The previous SPI communication was determined to be invalid. In this case, the status will be reported as though the invalid SPI communication never occurred. • Battery transients below 6.0V resulting in an undervoltage shutdown of the outputs may result in incorrect data loaded into the status register. The SO data transmitted to the MCU during the first SPI communication following an under-voltage VPWR condition should be ignored. • The RST pin transition from a logic  to  while the WAKE pin is at logic  may result in incorrect data loaded into the Status register. The SO data transmitted to the MCU during the first SPI communication following this condition should be ignored. SERIAL OUTPUT BIT ASSIGNMENT The 16 bits of serial output data depend on the previous serial input message, as explained in the following paragraphs. Table 16, page 26, summarizes SO returned data for bits OD15 : OD0. • Bit OD15 is the MSB; it reflects the state of the watchdog bit from the previously clocked-in message. • Bit OD14 remains logic  except when an undervoltage condition occurred. • Bit OD13 remains logic  except when an over-voltage condition occurred. • Bits OD12 : OD8 reflect the state of the bits SOA4 : SOA0 from the previously clocked in message. • Bits OD7 : OD4 give the fault status flag of the outputs HS3 : HS0, respectively. • The contents of bits OD3 : OD0 depend on bits D4 : D0 from the most recent STATR command SOA4 : SOA0 as explained in the paragraphs following Table 16. 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 25 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Table 16. Serial Output Bit Map Description Previous STATR SO Returned Data SO SO SO SO SO OD A4 A3 A2 A1 A0 15 OD 14 OD 13 OD 12 OD 11 OD OD9 OD8 OD7 OD6 OD5 OD4 10 OD3 OD2 OD1 OD0 START A1 A0 _s 0 0 0 WDIN UVF OVF SOA4 SOA3 SOA2 SOA1 SOA0 ST3 ST2 ST1 ST0 OTF_s OCHF_s OCLF_s OLF_s OCR0 0 0 0 0 1 WDIN UVF OVF SOA4 SOA3 SOA2 SOA1 SOA0 ST3 ST2 ST1 ST0 IN3_SPI IN2_SPI IN1_SPI IN0_SPI OCR1 0 1 0 0 1 WDIN UVF OVF SOA4 SOA3 SOA2 SOA1 SOA0 ST3 ST2 ST1 ST0 CSNS3 EN CSNS2 EN CSNS1 EN CSNS0 EN SOCHL A1 A0 R_s 0 1 0 WDIN UVF OVF SOA4 SOA3 SOA2 SOA1 SOA0 ST3 ST2 ST1 ST0 SOCH_s SOCL2_s SOCL1_s SOCL0_s CDTOL A1 A0 R_s 0 1 1 WDIN UVF OVF SOA4 SOA3 SOA2 SOA1 SOA0 ST3 ST2 ST1 ST0 OL_DIS_s OCL_DIS_s OCLT1_s OCLT0_s DICR_s A1 A0 1 0 0 WDIN UVF OVF SOA4 SOA3 SOA2 SOA1 SOA0 ST3 ST2 ST1 ST0 Fast_SR_s CSNS_high_s DIR_DIS_s UOVR 0 0 1 0 1 WDIN UVF OVF SOA4 SOA3 SOA2 SOA1 SOA0 ST3 ST2 ST1 ST0 OT_latch_1 OT_latch_0 WDR 0 1 1 0 1 WDIN UVF OVF SOA4 SOA3 SOA2 SOA1 SOA0 ST3 ST2 ST1 ST0 PINR0 0 0 1 1 0 WDIN UVF OVF SOA4 SOA3 SOA2 SOA1 SOA0 ST3 ST2 ST1 ST0 HS2_failsafe HS0_failsafe PINR1 0 1 1 1 0 WDIN UVF OVF SOA4 SOA3 SOA2 SOA1 SOA0 ST3 ST2 ST1 ST0 PINR2 0 1 1 1 1 WDIN UVF OVF SOA4 SOA3 SOA2 SOA1 SOA0 ST3 ST2 ST1 ST0 OT_latch_3 OT_latch_2 0 0 RESET N/A N/A N/A N/A N/A 0 0 0 0 0 0 0 0 0 0 0 IN3 0 WDTO IN2 0 A/O_s UV_DIS OV_DIS WD1 WD0 WD_en WAKE IN1 IN0 X X 0 0 s = Output selection with the bits A1A0 as defined in Table 10, page 23. ID[1,0]: product identification PREVIOUS ADDRESS SOA4 : SOA0 = A1A0000 PREVIOUS ADDRESS SOA4 : SOA0 = A1A0010 Bits OD3 : OD0 reflect the current state of the Fault register (FLTR) corresponding to the output previously selected with the bits A1A0 (Table 17). Data returned in bits OD3 : OD0 are programmed current values for the over-current high detection level (refer to Table 12, page 23) and the over-current low detection level (refer to Table 11, page 23), corresponding to the output previously selected with A1A0. Table 17. Output-Specific Fault Register OD3 OD2 OD1 OD0 OTF_s OCHF_s OCLF_s OLF_s s = Selection of the output. Note The FS pin reports all faults. For latched faults, this pin is reset by a new Switch OFF command (via SPI or direct input IN). PREVIOUS ADDRESS SOA4 : SOA0 = 00001 Data in bits OD3 : OD0 contains IN3_SPI : IN0_SPI programmed bits for outputs HS3 : HS0, respectively. PREVIOUS ADDRESS SOA4 : SOA0 = 01001 Data in bits OD3 : OD0 contains the programmed CSNS3 EN : CSNS0 EN bits for outputs HS3 : HS0, respectively. PREVIOUS ADDRESS SOA4 : SOA0= A1A0011 The returned data contains the programmed values in the CDTOLR register for the output selected with A1A0. PREVIOUS ADDRESS SOA4 : SOA0 = A1A0100 The returned data contains the programmed values in the DICR register for the output selected with A1A0. PREVIOUS ADDRESS SOA4 : SOA0 = 00101 The returned data contains the programmed values in the UOVR register. PREVIOUS ADDRESS SOA4 : SOA0 = 01101 The returned data contains the programmed values in the WDR register. Bit OD2 (WDTO) reflects the status of the 33874 26 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS watchdog circuitry. If WDTO bit is logic , the watchdog has timed out and the device is in Fail-safe mode. IF WDTO is logic , the device is in Normal Mode (assuming the device is powered and not in the Sleep Mode), with the watchdog either enabled or disabled. PREVIOUS ADDRESS SOA4 : SOA0 = 00110 The returned data OD3 and OD2 contain the state of the outputs HS2 and HS0, respectively, in case of Fail-safe state. This information is stated with the external resistance placed at the FSI pin. OD1 indicates if the watchdog is enabled or not. OD0 returns the state of the WAKE pin. PREVIOUS ADDRESS SOA4 : SOA0 = 01110 The returned data OD3 : OD0 reflects the state of the direct pins IN3 : IN0, respectively. PREVIOUS ADDRESS SOA4 : SOA0 = 01111 The returned data OD3 -OD2 reports the over-temperature bits configuration of the outputs [3, 2] set through the WDR SPI register. 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 27 TYPICAL APPLICATION INTRODUCTION TYPICAL APPLICATION INTRODUCTION The 33874 can be configured in several applications. The figure below shows the 33874 in a typical lighting application. VPWR VDD Voltage regulator VDD VPWR VDD VPWR VDD VPWR VDD 10k 10k 100nF 10µF VDD NC WAKE I/O Microcontroller I/O I/O I/O I/O SCLK CS I/O SO SI 10k 10k 10k 10k SCLK CS RST SI SO TEMP CSNS FSI A/D A/D 1k HS0 FS IN0 IN1 IN2 IN3 10k 10k 10k 10k R1 100nF LOAD 0 21W 5W 21W 5W 21W 5W 21W 5W HS1 LOAD 1 33874 HS2 LOAD 2 HS3 GND LOAD 3 Automotive lamps do not tolerate high voltages very well. Tests of a few lamps indicate that failures can occur when 18V is applied for a few seconds. Consequently, PWM switching reduces the effective RMS voltage in order to drive bulbs safety. For example, to maintain the power dissipation associated with a 13V battery at 100% duty cycle, the duty cycle would be adjusted to (13/18)², or 52%, when the battery is at 18V. The loads must be chosen in order to guarantee the device normal operating condition as junction temperature from -40 to 150 °C. In case of permanent short-circuit conditions, the duration and number of activation cycles must be limited with a dedicated MCU fault management using the fault reporting through SPI. 33874 28 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATION STANDALONE MODE This section consists of evaluating the MC33874 standalone capability. CONFIGURATION WITHOUT MCU The standalone mode is intended for customers who desire to plug the device and then immediately “play” with it, without having to connect it to a microcontroller. It also provides an easy way to evaluate the main electrical features. Without the Microcontroller to select programmable parameters and get full diagnosis via the SPI, the MC33874 runs with all parameters set to default. The input SPI pins and VDD must be connected to ground. Fail-safe Mode and watchdog timeout must be disabled by connecting the FSI to GND. All protection functions are available without SPI communication. Nevertheless, any configuration is possible without an MCU to communicate by SPI. Some functions still enable, but diagnosis is reduced. Available functions and default parameters are detailed next. FUNCTIONING WITHOUT MCU Without an MCU, SPI communication is not possible. Failsafe Mode and watchdog timeout are not useful functions without an MCU, but still enable. Wake/Sleep Mode is used to minimize current consumption during Sleep Mode. IN pins control the corresponding outputs and FS output is active (at 0V) when a default occurs. The tables 1 and 2 illustrate the available functions without SPI and default parameters. Table 1. Available Functions Function With SPI Without SPI Wake/Sleep Mode Available Available Output ON/OFF control Via SPI or IN pin Only with IN pin Over-temperature protection Available, can be unlatched Available Over-voltage protection Available, can be disabled Available, always enable Under-voltage protection Available, can be disabled Available, always enable Over-current protection Available, configurable (with 8 low levels and 2 high levels), can be disabled Available, always enable with default values Open load, battery disconnect, reverse battery, ground disconnect protections Available Available Fault diagnosis Full diagnosis with report by SPI and fault status pin (/FS) Limited fault diagnosis with Fault status pin only Current sense Available, 2 configurable ratios Not available Watchdog timeout Available, 4 configurable timings Available, default value Configurable slew rate 2 slew rate modes Default slew rate mode Analog temperature feedback Available Available Table 2. Default SPI-configurable parameters Configulable parameter Default typical value Over-voltage protection Enable Under-voltage protection Enable Over-current protection Enable Over-current low level OCLO0 Over-current high level OCHI0 Over-current detect blanking time tOCLO0 Current sense Disable Watchdog time timeout TWDTO0 Slew rate mode Slow mode Table 2 illustrates default parameters after resetting or applying supply voltage to the MC33874. Levels and timings are typical values. 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 29 TYPICAL APPLICATION DIAGNOSIS WITHOUT MCU When any fault appears (over-current, open load…), a full diagnosis can be reported via the SPI. Without an MCU, the fault status pin allows reduced diagnosis, as illustrated in table 3. Table 3. Diagnosis without SPI Normal operation Over-temperature Under-voltage Over-voltage Over-current Short-circuit to VPWR Open load IN[x] level HS[x] level FS level H H H L L H L L L H L L L L L H L L L L H H L L L L H H L L L H L H H H L Z L H H H Latched N/A YES YES NO YES NO NO H : High Level, L : Low Level, Z : High-impedance, potential depends on the external circuit We can note that it is not possible to distinguish over temperature, over-current, under-voltage, and over-voltage. Nevertheless, Open load and short-circuit to VPWR fault can be singled out. All protections are reported to Fault status pin (FS), Open load and short-circuit to VPWR are reported only if the Output is OFF. If the fault is latched, the output must be turned OFF then ON to disable the fault. CONCLUSION Although the MC33874 is not fully functional without a microcontroller to control and program it, standalone functioning is safe because all protections are available. Diagnosis is limited, but the fault status pin will report any malfunction. This is a good way to evaluate the main electrical MC33874 features. Some simplified applications can also use the MC33874 switch without an MCU to drive a high power load with full protection. 33874 30 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING SOLDERING INFORMATION PACKAGING SOLDERING INFORMATION The 33874 is packaged in a surface mount power package intended to be soldered directly on the printed circuit board. The 33874 was qualified in accordance with JEDEC standards JESD22-A113-B, J-STD-020A with MSL3/245°C Sn-Pb soldering profile and JESD22-B102D as for solderability test, with reflow conditions as follows: Reflow Soldering: 215°C+/-5°C Wave Soldering: 245°C +/-5°C PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the 98ART10510D listed below. PNA SUFFIX (PB-FREE) 24-PIN PQFN NONLEADED PACKAGE 98ART10510D ISSUE O 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 31 PACKAGING PACKAGE DIMENSIONS PNA SUFFIX (PB-FREE) 24-PIN PQFN NONLEADED PACKAGE 98ART10510D ISSUE O 33874 32 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGE DIMENSIONS PNA SUFFIX (PB-FREE) 24-PIN PQFN NONLEADED PACKAGE 98ART10510D ISSUE O 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 33 ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) ADDITIONAL DOCUMENTATION 33874 THERMAL ADDENDUM (REV 2.0) Introduction This thermal addendum is provided as a supplement to the 33874 technical datasheet. The addendum provides thermal performance information that may be critical in the design and development of system applications. All electrical, application, and packaging information is provided in the datasheet. HIGH SIDE SWITCH Packaging and Thermal Considerations This package is a dual die package. There are two heat sources in the package independently heating with P1 and P2. This results in two junction temperatures, TJ1 and TJ2, and a thermal resistance matrix with RθJAmn. For m, n = 1, RθJA11 is the thermal resistance from Junction 1 to the reference temperature while only heat source 1 is heating with P1. For m = 1, n = 2, RθJA12 is the thermal resistance from Junction 1 to the reference temperature while heat source 2 is heating with P2. This applies to RθJ21 and RθJ22, respectively. TJ1 TJ2 = RθJA11 RθJA12 RθJA21 RθJA22 . P1 P2 PNA SUFFIX 98ART10510D 24-PIN PQFN (12 x 12) Note For package dimensions, refer to the 33874 data sheet. The stated values are solely for a thermal performance comparison of one package to another in a standardized environment. This methodology is not meant to and will not predict the performance of a package in an application-specific environment. Stated values were obtained by measurement and simulation according to the standards listed below. Table 18. Thermal Performance Comparison 1 = Power Chip, 2 = Logic Chip [°C/W] Thermal Resistance m = 1, n=1 m = 1, n = 2 m = 2, n = 1 m = 2, n=2 20 16 39 RθJBmn(2), (3) 6 2.0 26 RθJAmn(1), (4) 53 40 73 <0.5 0.0 1.0 RθJAmn (1), (2) RθJCmn(5) Notes: 1. Per JEDEC JESD51-2 at natural convection, still air condition. 2. 2s2p thermal test board per JEDEC JESD51-7and JESD51-5. 3. Per JEDEC JESD51-8, with the board temperature on the center trace near the power outputs. 4. Single layer thermal test board per JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance between the die junction and the exposed pad, “infinite” heat sink attached to exposed pad. 1.0 0.2 1.0 0.2 Figure 10. Testboard According to JEDEC 33874 34 Analog Integrated Circuit Device Data Freescale Semiconductor ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) Transparent Top View WAKE FS IN3 IN2 TEMP IN1 IN0 CSNS 7 6 5 4 3 2 1 SO 16 GND 17 HS3 18 14 GND 24 FSI 23 GND 22 HS2 A= 300sqmm A= 300sqmm 15 VPWR 19 20 21 HS1 NC HS0 114.3 mm RST 8 SCLK 9 SI 13 12 11 10 VDD CS 76.2 mm MC33874 Pin Connections 24-Pin PQFN (12 x 12) 0.9 mm Pitch 12.0 mm x 12.0 mm Body Figure 11. Thermal Test Board Device on Thermal Test Board Material: Outline: Single layer printed circuit board FR4, 1.6mm thickness Cu traces, 0.07mm thickness 80mm x 100mm board area, including edge connector for thermal testing Area A: Cu heat-spreading areas on board surface Ambient Conditions: Natural convection, still air Table 19. Thermal Resistance Performance Thermal Resistance RθJAmn Area A 1 = Power Chip, 2 = Logic Chip (°C/W) (mm2) m = 1, n=1 m = 1, n = 2 m = 2, n = 1 m = 2, n=2 0 53 38 61 300 44 32 56 600 42 30 55 RθJA is the thermal resistance between die junction and ambient air. This device is a dual die package. Index m indicates the die that is heated. Index n refers to the number of the die where the junction temperature is sensed. 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 35 ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) 65 60 55 50 45 40 35 30 25 0 100 200 R RJA11 θJA11 300 400 RRJA12=RJA21 θJA12= RθJA21 500 600 R RJA22 θJA22 Figure 12. Steady State Thermal Resistance1W step response; device on 1s thermal test board with heat spreading areas sq 600mm. 100 10 1 0.1 1.00E-06 1.00E-04 1.00E-02 RθJA11 RJA11 1.00E+00 RθJA12= RθJA21 RJA12=RJA21 1.00E+02 1.00E+04 RθJA22 RJA22 Figure 13. Transient Thermal Resistance 33874 36 Analog Integrated Circuit Device Data Freescale Semiconductor REVISION HISTORY REVISION HISTORY Revision Date Description of Changes 3.0 03/2006 • • Implemented Revision History page Converted to Freescale format 4.0 04/2006 • • • • • • Added ROHS logo Added “It is recommended to disable open load circuitry in case of a permanent disconnected load.“to the Open Load Fault (Non-Latching) paragraph Changed 1k to 10k in the second paragraph of Ground Disconnect Protection Added the section StandAlone mode to Typical Application Updated Package Dimensions to Issue C Added Thermal Addendum (Rev 2.0) to Data Sheet 5.0 6/2002 • • Corrected part number ordering information Modified Output Turn ON Delay Times on page 10 6.0 9/2006 • • Changed status from Preliminary to Advance. Made changes the resistive loads on the Typical Applications diagram and added a paragraph describing the behavior of automotive lamps. Added new thermal curves to the Thermal Addendum (Rev 2.0) on page 34 Made updates to Thermal Resistance Performance on page 35 • • 7.0 9/2006 • 8.0 4/2007 • Added Direct Input Switching Frequency to Dynamic Electrical Characteristics Table 1/2008 • • • • Updated Freescale form and style Added section for Functional Internal Block Description Clarified Legend in “Figure 13, Transient Thermal Resistance, on Page 36 Corrected Figure 3, Pin Numbers and Table 1 Pin Definitions for pins 2, 3, 5, & 6 Formal Name from Serial Inputs to Parallel Inputs. Changed Package drawing from 98ARL10596D to 98ART10510D. 9.0 • Made changes to Thermal Addendum (Rev 2.0) relating to Figure 11, Table 19, Thermal Resistance Performance, Figure 12, and Figure 13 33874 Analog Integrated Circuit Device Data Freescale Semiconductor 37 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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