datasheet

Board 4S SKYPER 32 PRO R Gold
Absolute Maximum Ratings
SKYPER®
Adaptor board
Board 4S SKYPER 32 PRO R
Gold
Preliminary Data
Features
• Two output channels
• Gold nickel finish
• Failure management
Typical Applications*
• Adaptor board for SKYPER 32 IGBT
drivers in bridge circuits for industrial
applications
• PCB with gold plating
• DC bus up to 1000V
Footnote
with external high voltage diode
Please Note: the isolation test is not
performed as a series test at SEMIKRON
and must be performed by the user
accroding to VDE 0110-20
Symbol
Conditions
Vs
Supply voltage primary
16
V
IoutPEAK
Output peak current
15
A
IoutAVmax
Output average current
50
mA
fmax
Max. switching frequency
50
kHz
VCE
Collector emitter voltage sense across
the IGBT
1700
V
4000
V
1200
V
1500
V
Visol IO
VisolPD
Visol12
Values
Isolation test voltage input - output (AC,
rms, 2s)
Partial discharge extinction voltage,
rms, QPD ≤ 10pC
Isolation test voltage output 1 - output 2
(AC, rms, 2s)
Unit
RGon min
Minimum rating for external RGon
1.5
Minimum rating for external RGoff
Ω
RGoff min
1.5
Ω
Top
Operating temperature
-40 ... 85
°C
Tstg
Storage temperature
-40 ... 85
°C
Characteristics
Symbol
Conditions
min.
typ.
max.
Unit
Vs
Supply voltage primary side
14.4
15
15.6
V
Vi
Input signal voltage on / off
VIT+
Input treshold voltage HIGH
12.3
V
VIT-
input threshold voltage (LOW)
VG(on)
Turn on output voltage
VG(off)
Turn off output voltage
-7
V
td(on)IO
Input-output turn-on propagation time
1.2
µs
td(off)IO
Input-output turn-off propagation time
1.2
µs
15 / 0
4.6
V
V
15
V
Isolation coordination in compliance with
EN50178 PD2
Operating temperature is real ambient
temperature around the driver core
Degree of protection: IP00
Adaptor board
© by SEMIKRON
Rev. 3 – 27.03.2015
1
Board 4S SKYPER 32 PRO R Gold
Derating
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
2
Rev. 3 – 27.03.2015
© by SEMIKRON
Board 4s SKYPER® 32PRO R - Technical Explanations
Adaptor Board 4s SKYPER® 32PRO R
Technical Explanations
Revision 03
-----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------This Technical Explanation is valid for the following parts:
part number
L5062701
type
Board 4s SKYPER® 32PRO R
date code (YYWW)
≥ 1512
Related documents:
title
Technical Explanations SKYPER® 32PRO R
Prepared by: Johannes Krapp
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Content
Application and Handling Instructions .................................................................................................................... 3
Further application support ..................................................................................................................................... 3
General Description ................................................................................................................................................ 3
Dimensions ............................................................................................................................................................. 4
Component Placement Layout ............................................................................................................................... 5
PIN Array ................................................................................................................................................................ 6
Signal IF_CMN_nHALT .......................................................................................................................................... 7
Setting Dead Time .................................................................................................................................................. 7
Setting Dynamic Short Circuit Protection ............................................................................................................... 7
Collector Series Resistance.................................................................................................................................... 8
Adaptation Gate Resistors ...................................................................................................................................... 8
Adaptation Decoupling Gate Resistors ................................................................................................................... 8
Setting Soft Turn-Off ............................................................................................................................................... 9
Temperature Signal ................................................................................................................................................ 9
Over Temperature Protection Circuit (OTP) ........................................................................................................... 9
Mounting Notes ..................................................................................................................................................... 10
Schematics ........................................................................................................................................................... 11
Parts List ............................................................................................................................................................... 14
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2015-03-27 – Rev03
© by SEMIKRON
Board 4s SKYPER® 32PRO R - Technical Explanations
Please note:
All values in this technical explanation are typical values. Typical values are the average values expected in large quantities and are
provided for information purposes only. These values can and do vary in different applications. All operating parameters should be
validated by user’s technical experts for each application.
Application and Handling Instructions

Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled,
the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any
synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be
short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements
apply to MOSFET- and IGBT-modules.
Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCDsnubber networks between main terminals for PLUS and MINUS of the power module.
When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current
in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and
the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case
temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions,
short-circuit testing may be done, starting again with low collector voltage.
It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events.
Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.
The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than VS +0,3V or below -0,3V may destroy
these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.
The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the
driver leads should be twisted.





Further application support
Latest information is available at http://www.semikron.com. For design support please read the SEMIKRON Application
Manual Power Modules available at http://www.semikron.com.
General Description
®
®
The Board 4s SKYPER 32PRO R is an adaptor board for the IGBT module SEMiX 4s (spring contact version). The board
®
can be customized allowing adaptation and optimization to the used SEMiX Module.
The switching characteristic of the IGBT can be influenced through user settings, e.g. changing turn-on and turn-off speed
by variation of RGon and RGoff. Furthermore, it is possible to adjust the monitoring level and blanking time for the DSCP (see
®
Technical Explanations SKYPER 32PRO R).
Please note:
This technical explanation is based on the Technical Explanations for SKYPER ® 32PRO R. Please read the Technical Explanations
SKYPER® 32 PRO R before using the Adaptor Board.
Board 4s SKYPER® 32PRO R
3
2015-03-27 – Rev03
© by SEMIKRON
Board 4s SKYPER® 32PRO R - Technical Explanations
Quality
The following table show the type and end tests of the adapter board.
End
test
test category
test describtion
standard
AOI
Automated Optical Inspection
Control of accurate placement of components/ of solder joints
SEMIKRON
ICT
In-Circuit Test
Test of the populated PCB, checking the correctly fabrication
SEMIKRON
Type
test
test category
test conditions
standard
EP
Electrical Parameters
amb = -40°C / +85°C
SEMIKRON
SP
STEP Test, Interrupted PS
20x 10µs to 2s
EN61000-4-29
Iso
Isolation Test
High voltage test 4kV, 60s
EN 61800-5-1
TC
Thermal Cycling
200 cycles, Tstgmax – Tstgmin
IEC60068-2-14
PD
Partial discharge test
>1,2 kV; suitable for 1000V DC Link
VDE 0110-20
TH
Temperature Humidity
85°C, 85% RH, 96h
IEC 60068-2-67
VB
Vibration
Sinus 20/2000Hz Random 10/2000Hz, 5g, 26 per x,y,z
IEC 60068-2-6
SH
Shock
Half-sinus pulse, 30g, 6000 shocks, 6ms, ±x, ± y, ± z
IEC 60068-2-29
Dimensions
Dimensions in mm
46,57
16,73
2,8
Ø3
34
9
10
1
2
65
Ø
1
2
Ø 3,2
1
2
Ø3
3
9
10
20
19
9
10
68
Ø 3,5
Ø 3,2
Ø3
X20
Ø
3,
5
Ø3
1
2
2
1
X10
Ø 3,2
9
10
3
Ø
24
21,3
25,11
3
2,75
Ø 1,3
2,5
2,54
130,2
130,25
4
10,1
13,2
133,5
2015-03-27 – Rev03
© by SEMIKRON
Board 4s SKYPER® 32PRO R - Technical Explanations
Component Placement Layout
Adaptor Board
5
2015-03-27 – Rev03
© by SEMIKRON
Board 4s SKYPER® 32PRO R - Technical Explanations
PIN Array
Connector X20 (ODU FLAKAFIX 511.068.803.020)
Product information of suitable female connectors and distributor
contact information is available at e.g. http://www.harting.com
(part number 09 18 520 6 813).
PIN
Signal
Function
Specification
X20:01
IF_PWR_15P
Drive power supply
Stabilised +15V ±4%
X20:02
IF_PWR_GND
GND for power supply
X20:03
IF_PWR_15P
Drive power supply
X20:04
IF_PWR_GND
GND for power supply
X20:05
IF_PWR_15P
Drive power supply
X20:06
IF_PWR_GND
GND for power supply
X20:07
reserved
X20:08
IF_PWR_GND
GND for power supply
X20:09
IF_CMN_nHALT
Driver core status signal (bidirectional
signal with dominant recessive behaviour)
X20:10
reserved
X20:11
reserved
X20:12
IF_CMN_GND
X20:13
reserved
X20:14
reserved
X20:15
IF_HB_TOP
Switching signal input (TOP switch)
Digital 15 V logic; 10 kOhm impedance;
LOW = TOP switch off;
HIGH = TOP switch on
X20:16
IF_HB_BOT
Switching signal input (BOTTOM switch)
Digital 15 V logic; 10 kOhm impedance;
LOW = BOT switch off;
HIGH = BOT switch on
X20:17
reserved
X20:18
IF_HB_GND
X20:19
reserved
X20:20
reserved
6
Stabilised +15V ±4%
Stabilised +15V ±4%
Digital 15V logic;
LOW (dominant) = driver disabled;
HIGH (recessive) = ready to operate
GND for signal IF_CMN_nHALT
GND for signals IF_HB_TOP &
F_HB_BOT
2015-03-27 – Rev03
© by SEMIKRON
Board 4s SKYPER® 32PRO R - Technical Explanations
Signal IF_CMN_nHALT
The Halt Logic Signals PRIM_HALT_IN and PRIM_HALT_OUT of the driver core are coupled to one bidirectional signal
(IF_CMN_nHALT) with dominant recessive behaviour. IF_CMN_nHALT shows the driver core status. When
IF_CMN_nHALT is HIGH (recessive), the driver core is ready to operate. When IF_CMN_nHALT is LOW (dominant), the
driver core is disabled / not ready to operate because of e. g. detected failure or driver core system start.
A controller can hold with the IF_CMN_nHALT signal the driver core in a safe state (e.g. during a start up of a system or
gathered failure signal of other hardware) or generate a coeval release of paralleled driver. Furthermore, paralleled drivers
can send and receive IF_CMN_nHALT signals among each other by using a single-wire bus.
Connection IF_CMN_nHALT
User Side
+15V
Rpull_up_int
5,1K
STATUS SIGNAL
GND
Setting Dead Time
DT adjustment
Designation
Pattern Name
R43
(connected to GND)
R44
(connected to GND)
R45
(connected to GND)
R46
(connected to GND)
Setting
PRIM_CFG_TDT2_IN
Factory setting: 0Ω
PRIM_CFG_SELECT_IN
Factory setting: not equipped
PRIM_CFG_TDT3_IN
Factory setting: 0Ω
PRIM_CFG_TDT1_IN
Factory setting: not equipped
0603
0603
0603
0603
Factory setting: 3,3µs
Setting Dynamic Short Circuit Protection
RCE & CCE
7
Designation
Pattern Name
R162
1206
C150
1206
R262
1206
C250
1206
Setting
RCE
Factory setting: not equipped
CCE
Factory setting: not equipped
RCE
Factory setting: not equipped
CCE
Factory setting: not equipped
2015-03-27 – Rev03
TOP
TOP
BOT
BOT
© by SEMIKRON
Board 4s SKYPER® 32PRO R - Technical Explanations
Collector Series Resistance
RVCE
Designation
Pattern Name
R150
MiniMELF
R250
MiniMELF
Setting
RVCE *
Factory setting: not equipped
RVCE *
Factory setting: not equipped
TOP
BOT
* 1200V IGBT operation: 0Ω
* 1700V IGBT operation: 1kΩ / 0,4W
Adaptation Gate Resistors
RGon & RGoff
Designation
R181, R151, R152, R153
(parallel connected)
R154, R155, R156, R182
(parallel connected)
R281, R251, R252, R253
(parallel connected)
R254, R255, R256, R282
(parallel connected)
Pattern Name
MiniMELF
MiniMELF
MiniMELF
MiniMELF
Setting
RGon
Factory setting: not equipped
RGoff
Factory setting: not equipped
RGon
Factory setting: not equipped
RGoff
Factory setting: not equipped
TOP
TOP
BOT
BOT
Adaptation Decoupling Gate Resistors
®
For details to the decoupling gate resistors and recommended values, see Modules Explanations and Data Sheets SEMiX .
RG1, RG2, RG3, RG4
8
Designation
Pattern Name
R101
MELF
R102
MELF
R103
MELF
R104
MELF
R201
MELF
R202
MELF
R203
MELF
R204
MELF
Setting
RG1
Factory setting: not equipped
RG2
Factory setting: not equipped
RG3
Factory setting: not equipped
RG4
Factory setting: not equipped
RG1
Factory setting: not equipped
RG2
Factory setting: not equipped
RG3
Factory setting: not equipped
RG4
Factory setting: not equipped
2015-03-27 – Rev03
TOP
TOP
TOP
TOP
BOT
BOT
BOT
BOT
© by SEMIKRON
Board 4s SKYPER® 32PRO R - Technical Explanations
Setting Soft Turn-Off
RGoff_SC
Designation
R160, R161
(parallel connected)
R260, R261
(parallel connected)
Pattern Name
MiniMELF
MiniMELF
Setting
RGoff_SC
Factory setting: not equipped
RGoff_SC
Factory setting: not equipped
TOP
BOT
Temperature Signal
®
The temperature sensor inside the SEMiX module is directly connected to contacting points T1 and T2. For details to the
®
temperature sensor, see Modules Explanations SEMiX .
Safety Warnings:
The contacting points T1 and T2 are not electrical isolated. Due to high voltage that may be present at the
contacting points T1 and T2, some care must be taken in order to avoid accident. There is no cover or potential
isolation that protect the high voltage sections / wires from accidental human contact.
Please note:
If the contacting points T1 and T2 are used for adaptor of the temperature sensor, the Over Temperature Protection Ciruit
must be disabled by taking out the resistors R175, R178 and R179.
Over Temperature Protection Circuit (OTP)
The external error input SEC_TOP_ERR_IN on the secondary side (high potential) of the driver core is used for an over
temperature protection circuit to place the gate driver into halt mode.
Dimensioning OTP
1. Define an over temperature trip level according to the application.
2. Calculate the nominal ohmic resistance value of the temperature sensor at the defined trip
level (see "Modules – Explanations - SEMiX®" on SEMiX® product overview page at
http://www.semikron.com).
3. The trip level on the adapter board is set with R172 by using the calculated resistance value.

Factory setting R172: not equipped

If no resistor is used, a failure signal is generated.
9
2015-03-27 – Rev03
© by SEMIKRON
Board 4s SKYPER® 32PRO R - Technical Explanations
Mounting Notes
®
®
The electrical connections between adaptor board and SEMiX are realised via spring contacts integrated in SEMiX power
modules and via landing pads on the bottom side of the adaptor board.
Adaptor Board & Driver Core Mounting
4. Soldering of components (e.g. RGon, RGoff, etc.) on adapter
board.
5. Adaptor Board has to be fixed to the SEMiX® module (see
"Mounting Instruction and Application Notes
for SEMiX®
IGBT modules" on SEMiX® product overview page at
http://www.semikron.com).
6. Insert driver core into the box connector on adaptor board.
The connection between driver core and adaptor board should be
mechanical reinforced by using support posts. The posts have to be
spaced between driver core and adaptor board.
SKYPER™ 32PRO
Support post
Product information of suitable support posts and distributor contact
information is available at e.g. http://www.richco-inc.com (e.g. part
number DLMSPM-8-01, LCBST-8-01).
Printed Ciruit Board
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2015-03-27 – Rev03
© by SEMIKRON
Board 4s SKYPER® 32PRO R - Technical Explanations
Schematics
Schematic I Adaptor Board
11
2015-03-27 – Rev03
© by SEMIKRON
Board 4s SKYPER® 32PRO R - Technical Explanations
Schematic II Adaptor Board
12
2015-03-27 – Rev03
© by SEMIKRON
Board 4s SKYPER® 32PRO R - Technical Explanations
Schematic III Adaptor Board
13
2015-03-27 – Rev03
© by SEMIKRON
Board 4s SKYPER® 32PRO R - Technical Explanations
Parts List
Parts List Adaptor Board
Count
Ref. Designator
Value
Pattern Name
Description
7
C170, C171, C173, C174, C175,
C176, CN170
100nF
0805 (SMD)
Capacitor X7R
6
1
1
1
2
1
1
1
2
1
C20, C21, C22, C23, C24, C25
C26
C27
C31
C35, C151
C36
CD20
D20
L150, L151
N170
1nF
2,2µF
220uF/35V
68pF
1uF
100pF
100nF
74C14
100uH
LM2904
0805 (SMD)
1210 (SMD)
SMD
0603 (SMD)
1206 (SMD)
0603 (SMD)
1206 (SMD)
SOIC 14 (SMD)
1210 (SMD)
SOIC 8 (SMD)
Capacitor X7R
Capacitor X7R
Longlife-Elko
Capacitor NP0
Capacitor X7R
Capacitor NP0
Capacitor X7R
Logic-IC 74C...
Inductor
Operational Amplifier
8
R111, R112, R113, R114, R201,
R211, R212, R 213, R114
0,51Ohm
Melf (SMD)
2%
2
1
2
3
1
1
3
3
6
1
2
3
1
1
1
1
2
1
R157, R171
R158
R163, R263
R170, R174, R176
R175
R177
R27, R178, R179
R28, R50, R52
R30, R31, R32, R33, R34, R37
R36
R43, R45
R47, R54, R56
R51
R53
R57
R58
R60, R61
R62
15,0KOhm
10,0Ohm
10,0KOhm
30,1KOhm
5,62KOhm
3,01KOhm
0,00Ohm
10,0KOhm
5,11KOhm
3,32KOhm
0,00Ohm
10,0KOhm
121KOhm
100Ohm
1,50KOhm
1,00KOhm
2,00KOhm
3,92KOhm
0603 (SMD)
0603 (SMD)
MiniMelf (SMD)
0603 (SMD)
MiniMelf (SMD)
1206 (SMD)
MiniMelf (SMD)
MicroMelf (SMD)
MicroMelf (SMD)
0603 (SMD)
0603 (SMD)
0603 (SMD)
0603 (SMD)
MicroMelf (SMD)
MicroMelf (SMD)
0603 (SMD)
0603 (SMD)
0603 (SMD)
1%
1%
1%
1%
1%
1%
8
V111, V112, V113, V114, V211,
V212, V213, V214
10BQ100
SMB (SMD)
Diode Schottky
2
2
1
5
1
1
4
V150, V250
V170, V171
V20
V23, V25, V26, V27, V29
V28
X20
X6, X7, X10, X11
BY203/20S
BAV70W
SMCJ15
BC847B
BZX284-C7V5
20p.
RM2,54 10p.
SMD
SOT323 (SMD)
DO214AB (SMD)
SOT23 (SMD)
SOD110 (SMD)
SMD
SMD
High Voltage Diode
Double Diode
Suppressor Diode
NPN-Transistor
Zener-Diode
Connector
Box Connector
1%
1%
1%
1%
1%
1%
1%
1%
1%
1%
TP: Test Point
Box Connector: SUYIN 254100FA010G200ZU
DISCLAIMER
SEMIKRON reserves the right to make changes without further notice herein to improve reliability, function or design.
Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is
given and no liability is assumed with respect to the accuracy or use of such information. SEMIKRON does not assume
any liability arising out of the application or use of any product or circuit described herein. Furthermore, this technical
information may not be considered as an assurance of component characteristics. No warranty or guarantee expressed
or implied is made regarding delivery, performance or suitability. This document supersedes and replaces all information
previously supplied and may be superseded by updates without further notice.
SEMIKRON products are not authorized for use in life support appliances and systems without the express written
approval by SEMIKRON.
www.SEMIKRON.com
14
2015-03-27 – Rev03
© by SEMIKRON