Copper Wirebond A JCET Company Technology Overview HIGHLIGHTS • STATS ChipPAC is ready to engage on all wirebond package types and in all manufacturing locations • QFNp, QFNs, QFN-dr, QFNs-st, QFNs-st-mr, QFP, TSOP, FBGA, FBGA-SD, FBGA-MD, FBGA-SS and PBGA package types supported • Full turnkey services available DESCRIPTION • Advanced design rules supported for bond pad opening (BPO), bond pad pitch (BPP), stacked die and die-to-die bonding • Advanced assembly processes and materials including 0.6 mil Cu wire • Assembly yields with Pd-coated Cu wire comparable to Au at >99.9% COST BENEFITS • Copper wire offers significant cost savings over gold wire and a hedge against continued increases in gold prices • Best Value BOM (BVB) available for each package for the most cost-effective copper wirebond solution Copper (Cu) wire is increasingly becoming the material of choice for interconnection in wirebond packages. Cost reduction is the primary driver for the industry’s conversion to copper wire, replacing traditional gold (Au) wire interconnects to achieve lower cost without sacrificing performance, quality and reliability. Increasingly implemented as a low risk replacement for gold wire in many mobile, consumer and computing applications, copper wire provides similar electrical characteristics and performance to gold wire, and also offers lower resistivity which can be a benefit where lower bond wire resistance is needed for device performance. STATS ChipPAC has focused on material and process enhancements such as Palladium (Pd) coated wire and ultra high density substrates to drive cost reduction and enable customers to realise the full benefits of copper wire interconnect. As the semiconductor industry moves towards higher pin counts, finer bond pad pitches and thinner wire diameters, there is a growing demand to utilize copper wire in more advanced multi-die laminate and leaded packages, including 3D packaging. STATS ChipPAC offers copper wirebond solutions in a wide range of leaded and laminate packages. STATS ChipPAC’s copper wire offering includes die-to-die bonding and a range of 3D package configurations including stacked die, side-byside die and a combination of stacked plus side-by-side die packages. PALLADIUM-COATED COPPER WIRE COPPER WIREBOND CONSIDERATIONS Palladium-coated copper wire (Pd-Cu) recommended for all applications, fab nodes and development programs With significant experience in copper wire conversions, STATS ChipPAC understands the requirements for successful copper wirebonding. While the customer’s existing structure can be successfully utilized in many cases, STATS ChipPAC recommends the following “ideal” guidelines: • Thicker aluminum pad (>0.8mm, ideally >1.0mm) • Thick barrier metal layer under pad (Ti or W) • 0.4mm larger bond pad vs Au to allow for metal splash • Provides enhanced reliability • Improves corrosion resistance Pd concentration Electron Probe Micro Analyzer image www.cj-elec.com www.statschippac.com Consult STATS ChipPAC for a review of your design for copper wirebond readiness. Copper Wirebond A JCET Company Data PACKAGE SUPPORT BY SITE SPECIFICATIONS Standard Wire Diameter 18mm / 0.7mil - 20mm / 0.8mil Optional Wire Diameter 15mm / 0.6mil - 50mm / 2.0mil • Contact STATS ChipPAC for site-specific availability • Pd-coated Cu wire recommended Wafer Nodes >28nm; non-Low-K, Low-K 40 - 28/32nm; Low-K, Extra Low-K Both CUP and non-CUP devices CUP Support China Korea Singapore FBGA FBGA-SD FBGA-MD FBGA-SS PBGA QFN QFN-dr QFNs-st QFNs-st-mr COPPER WIRE CHARACTERISTICS QFP TSOP Wire Material Melting Point (Deg, oC) Thermal Cond (W/m-c) Electrical Resistance (ohm-m) Young’s Modulus (Gpa) Tensile Strength (Mpa) Hardness @ Ball (Hv) Gold (Au) Copper (Cu) Pd Coated Copper 1064 1083 1083 315 393 393 2.33x10 -8 1.72 x 10-8 1.80 x 10-8 80 120 120 240 290 290 60-80 80 – 90 85 – 95 R Wire / mm (mOhms / mm) Bondwire Diameter Frequency DC Frequency 10 MHz Frequency 25 MHz 0.8 mil 1.0 mil 1.3 mil 72.49 46.48 27.61 72.75 46.77 27.94 73.29 47.44 28.86 Frequency 75 Frequency 500 MHz MHz 76.08 51.33 34.39 129.37 101.52 76.53 Frequency 1 GHz Frequency 10 GHz L Wire (nH / mm) C Wire (pF/mm) 175.50 138.06 105.16 518.58 416.80 324.29 0.82 0.78 0.73 0.06 0.06 0.06 Frequency 1 GHz Frequency 10 GHz L Wire (nH / mm) C Wire (pF/mm) 152.55 120.56 92.24 456.54 367.86 287.11 0.82 0.78 0.73 0.06 0.06 0.06 Frequency 1 GHz Frequency 10 GHz L Wire (nH / mm) C Wire (pF/mm) 149.06 117.88 90.26 447.20 360.31 281.37 0.82 0.78 0.73 0.06 0.06 0.06 Pd-coated Copper (Conductivity = 5.55 x 10^7 siemens / meter; R Wire / mm (mOhms / mm) Bondwire Diameter Frequency DC Frequency 10 MHz Frequency 25 MHz 0.8 mil 1.0 mil 1.3 mil 56.04 35.95 21.38 56.32 36.26 21.75 56.92 37.04 22.84 Frequency 75 Frequency 500 MHz MHz 60.31 41.71 29.13 112.46 88.20 66.85 Copper (Conductivity = 5.8 x 10^7 siemens / meter) Bondwire Diameter Frequency DC Frequency 10 MHz Frequency 25 MHz 0.8 mil 1.0 mil 1.3 mil 53.68 34.45 20.48 53.96 34.76 20.86 54.58 35.56 21.98 Frequency 75 Frequency 500 MHz MHz 58.08 40.36 28.38 109.84 86.17 65.37 RELIABILITY Item MRT MSL3 MRT MSL2aA mHAST PCT TC”C” HTST Condition 30’C / 60% 192hrs / 260’C 85’C / 85% 8 hrs / 260’C 130’C / 85% RH after MSL3, 168 hrs 121’C / 100% RH after MSL3, 168 hrs -65’C~150’C after MSL3, 1000 cycles 150’C w/o Precon, 1000 hrs Corporate Office Global Offices 10 Ang Mo Kio St. 65, #04-08/09 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823 USA 510-979-8000 CHINA 86-21-5976-5858 KOREA 82-32-340-3114 SWITZERLAND 41-22-929-5658 The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Pte. Ltd. Trademark registered in United States. Singapore company registration number 199407932D. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. ©Copyright 2016. STATS ChipPAC Pte. Ltd. All rights reserved. Apr 2016