Alpha & Omega Semiconductor Product Reliability Report AO4830/AO4830L, rev B Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AO4830. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO4830 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation Quality Assurance Information I. Product Description: The AO4830 uses advanced trench technology to provide excellent RDS(ON) and low gate charge. This device is suitable for use as a load switch or in PWM applications. Standard Product AO4830 is Pb-free (meets ROHS & Sony 259 specifications). AO4830L is a Green Product ordering option. AO4830 and AO4830L are electrically identical. 2 II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond wire Mold Material Flammability Rating Backside Metallization Moisture Level AO4830 Standard sub-micron Low voltage N channel process 8 leads SOIC Cu, D/pad, Ag spot Ag epoxy S: Cu 2 misl, G: Au 1.3mils Epoxy resin with silica filler UL-94 V-0 Ti / Ni / Ag Up to Level 1 * AO4830L (Green Compound) Standard sub-micron Low voltage N channel process 8 leads SOIC Cu, D/pad, Ag spot Ag epoxy S: Cu 2 misl, G: Au 1.3mils Epoxy resin with silica filler UL-94 V-0 Ti / Ni / Ag Up to Level 1* Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AO4830 (Standard) & AO4830L (Green) Test Item Test Condition Time Point Lot Attribution Total Sample size Solder Reflow Precondition Standard: 1hr PCT+3 cycle reflow@260°c Green: 168hr 85°c /85RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax - Standard: 49 lots Green: 16 lots 9625 pcs HTGB HTRB HAST Pressure Pot Temperature Cycle 168 / 500 hrs 1lot 1000 hrs (note A*) 168 / 500 hrs 1lot 1000 hrs (note A*) 130 +/- 2°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 100 hrs Standard: 33 lots Green: 13 lots 121°c , 29.7 psi, RH=100% 96 hrs Temp = 150°c , Vds=80% of Vdsmax -65°c to 150°c , air to air, 250 / 500 cycles (note B**) Standard: 49 lots Green: 16 lots (note B**) Standard: 49 lots Green: 15 lots (note B**) 82 pcs Number of Failures 0 0 77+5 pcs / lot 82 pcs 0 77+5 pcs / lot 2530 pcs 0 50+5 pcs / lot 3575 pcs 0 50+5 pcs / lot 3520 pcs 0 50+5 pcs / lot 3 III. Result of Reliability Stress for AO4830 (Standard) & AO4830L (Green) Continues DPA Internal Vision Cross-section X-ray CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°c bake 150°c bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 245°c 5 sec 15 15 leads 0 Note A: The HTGB and HTRB reliability data presents total of available AO4830 and AO4830L burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AO4830 and AO4830L comes from the AOS generic package qualification data. IV. Reliability Evaluation FIT rate (per billion):43 MTTF =2639years 4