AOS Semiconductor Product Reliability Report AOT472/AOT472L, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOT472. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOT472 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation Quality Assurance Information I. Product Description: The AOT472/L uses a robust technology that is designed to provide efficient and reliable power conversion even in the most demanding applications, including motor control. With low RDS(ON) and excellent thermal capability this device is appropriate for high current switching and can endure adverse operating conditions. AOT472/AOT472L are electrically Identical AOT472 -RoHS Compliant AOT472L -Halogen Free Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol Maximum Units Drain-Source Voltage VDS 75 V Gate-Source Voltage VGS ±25 V Continuous Drain Current TA=25°C 140 ID 101 Pulsed Drain Current IDM 340 Avalanche Current IAR 125 TA=100°C TA=25°C Power Dissipation TA=100°C Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-toAmbient Maximum Junction-to-Case A A 417 PD W 208 TJ, TSTG -55 to 175 Symbol SteadyState SteadyState RθJA °C Typ. Units 13.9 °C/W 65 RθJC 0.36 °C/W 2 II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond wire Mold Material Flammability Rating Backside Metallization Moisture Level AOT472 AOT472L (Green Compound) Standard sub-micron Standard sub-micron Low voltage N channel process Low voltage N channel process 3 leads TO220 3 leads TO220 Bare Cu Bare Cu Soft solder Soft solder Al 5&15mils Al 5&15mils Soft solder Soft solder UL-94 V-0 UL-94 V-0 Ti / Ni / Ag Ti / Ni / Ag Up to Level 1 * Up to Level 1* Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AOT472 (Standard) & AOT472L (Green) Test Item Test Condition Time Point Lot Attribution Total Sample size Solder Reflow Precondition Standard: 1hr PCT+3 cycle reflow@260°c Green: 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax - Standard: 24 lots Green: 8 lots 4345pcs 0 168 / 500 hrs 3 lots 246pcs 0 1000 hrs (Note A*) 168 / 500 hrs 3 lots 1000 hrs (Note A*) 130°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 100 hrs Standard : 21 lots Green: 5 lots 121°c , 29.7psi, RH=100% 96 hrs HTGB HTRB HAST Pressure Pot Temperature Cycle Temp = 150°c , Vds=80% of Vdsmax -65°c to 150°c , air to air 250 / 500 cycles (Note B**) Standard : 24 lots Green: 5 lots (Note B**) Standard : 16 lots Green: 8 lots (Note B**) Number of Failures 77+5 pcs / lot 246pcs 0 77+5 pcs / lot 1430pcs 0 50+5 pcs / lot 1595pcs 0 50+5 pcs / lot 1320pcs 0 50+5 pcs / lot 3 III. Result of Reliability Stress for AOT472 (Standard) & AOT472L (Green) Continues DPA Internal Vision Cross-section X-ray CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°c bake 150°c bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 245°c 5 sec 15 15 leads 0 Note A: The HTGB and HTRB reliability data presents total of available AOT472 and AOT472L burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AOT472 and AOT472L comes from the AOS generic package qualification data. IV. Reliability Evaluation FIT rate (per billion): 14 MTTF = 7918 years 4