MZC4 SAW81F1D Rev1.0(0)

Product Data Sheet
SAW81F1D – Chip on Board
Enable High Flux and Cost Efficient System
Z Power Chip on board – ZC series
SAW81F1D
RoHS
Product Brief
Description
Features and Benefits
•
The ZC series are LED arrays which
provide High Flux and High Efficacy.
•
Especially it is designed for easy
assembly of lighting fixtures by
eliminating reflow soldering process.
•
It‘s thermal management is better than
other power LED solutions with wide
Metal area.
•
•
•
•
•
•
•
•
ZC series are ideal light sources for
general lighting applications including
Replacement Lamps, Industrial &
Commercial Lightings and other high
lumen required applications.
Size 10.8mm * 10.8mm
Power dissipation 3.7W
ErP 6-step binning
High Color quality with CRI Min.80(R9>0)
Uniformed Shadow
Excellent Thermal management
RoHS compliant
Key Applications
•
•
•
Replacement Lamps – Bulb, MR16, PAR
Commercial – Downlight
Residential
Table 1. Product Selection Table
CCT [K]
Part Number
SAW81F1D
Rev1.0, Apr 6, 2016
Color
Min.
Typ.
Max.
Cool White
4,700K
5,600K
7,000K
Neutral White
3,700K
4,200K
4,700K
Warm White
2,600K
3,000K
3,700K
1
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Product Data Sheet
SAW81F1D – Chip on Board
Table of Contents
Index
•
Product Brief
1
•
Table of Contents
2
•
Product Performance & Characterization Guide
3
•
Characteristics Graph
5
•
Product Nomenclature (Labeling Information)
11
•
Color Bin Structure
12
•
Mechanical Dimensions
14
•
Handling of Silicone Resin for LEDs
17
•
Precaution For Use
18
•
Company Information
21
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Product Data Sheet
SAW81F1D – Chip on Board
Performance Characteristics
Table 2. Electro Optical Characteristics, IF=20mA
CCT (K) [1]
Part Number
SAW81F1D
Typical
Luminous Flux [2]
ФV [3] [lm]
Typ.
Tj=25℃
Tj=85℃
6500
485
439
4000
510
462
3000
475
430
Typical
Forward Voltage [V]
Tj=25℃
185
Tj=85℃
175
CRI [5],
Ra
Viewing
Angle
[degrees]
2Θ ½
Min.
Typ.
80
120
80
120
80
120
Notes for Table 2:
1.
Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color
coordinate(x, y) : 0.005, CCT 5% tolerance.
2.
Seoul Semiconductor maintains a tolerance of ±5% on flux and power measurements.
3.
ФV is the total luminous flux output as measured with an integrating sphere.
4.
Tolerance is ±3% on forward voltage measurements.
5.
Tolerance is ±2 on CRI measurements.
* No values are provided by real measurement. Only for reference purpose.
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Product Data Sheet
SAW81F1D – Chip on Board
Performance Characteristics
Table 3. Absolute Maximum Characteristics, Tj=25ºC
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
Forward Current
IF
-
20
40
mA
Power Dissipation
Pd
-
3.7
7.6
W
Tj
-
-
125
ºC
Operating Temperature
Topr
-40
-
85
ºC
Surface Temperature
TS
-
-
100
ºC
Storage Temperature
Tstg
-40
-
100
ºC
Thermal resistance (J to S)
RthJS
-
2.9
-
K/W
Junction Temperature
ESD Sensitivity(HBM)
[1]
[2]
-
Class 2 JESD22-A114-E
Notes for Table 3 :
1.
At thermal Resistance, J to S means junction to COB’s metal PCB bottom.
2.
At ESD Sensitivity, Class 2 is voltage level between 2000V and 4000V.
3.
Thermal resistance : RthJS (Junction / solder)
•
LED’s properties might be different from suggested values like above and below tables if
operation condition will be exceeded our parameter range. Care is to be taken that power
dissipation does not exceed the absolute maximum rating of the product.
•
Thermal resistance can be increased substantially depending on the heat sink design/operating
condition, and the maximum possible driving current will decrease accordingly.
•
All measurements were made under the standardized environment of Seoul Semiconductor.
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Product Data Sheet
SAW81F1D – Chip on Board
Characteristics Graph
Fig 1. Color Spectrum, IF=20mA, Tj=25℃
Relative Radiant Power [%]
100
6500K
4000K
3000K
80
60
40
20
0
400
500
600
700
800
Wavelength [nm]
Fig 2. Radiant pattern, IF=20mA, Tj=25℃
Relative Luminous Intensity [%]
100
80
60
40
20
0
-100
-75
-50
-25
0
25
50
75
100
Angular Displacement [degree]
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Product Data Sheet
SAW81F1D – Chip on Board
Characteristics Graph
Fig 3. Forward Voltage vs. Forward Current, Tj=85℃
45
40
Forward Current [mA]
35
30
25
20
15
10
5
0
155
160
165
170
175
180
185
190
195
Forward Voltage [V]
Fig 4. Forward Current vs. Relative Luminous Flux, T j=85℃
Relative Luminous Flux [%]
200
160
120
80
40
0
0
10
20
30
40
50
Forward Current [mA]
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Product Data Sheet
SAW81F1D – Chip on Board
Characteristics Graph
Fig 5. Relative Light Output vs. Junction Temperature, IF=20mA
CCT: 3000K
Relative Luminous Flux [%]
100
80
60
40
20
0
20
40
60
80
100
120
140
o
Junction Temperature [ C]
Fig 6. Forward Voltage vs. Junction Temperature, IF=20mA
CCT: 3000K
Relative forward voltage[%]
100
80
60
40
20
0
20
40
60
80
100
120
140
o
Junction Temperature [ C]
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Product Data Sheet
SAW81F1D – Chip on Board
Characteristics Graph
Fig 7. Forward Current vs. CIE x, y Shift, Tj = 85ºC
CCT: 3700-7000K
0.02
Relative Variation[a.u.]
CIEx
CIEy
0.01
0.00
-0.01
-0.02
20
30
40
50
60
70
80
Forward Current [mA]
CCT: 2600-3700K
0.02
Relative Variation[a.u.]
CIEx
CIEy
0.01
0.00
-0.01
-0.02
20
30
40
50
60
70
80
Forward Current [mA]
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Product Data Sheet
SAW81F1D – Chip on Board
Characteristics Graph
Fig 8. Junction Temperature vs. CIE x, y Shift, IF=20mA
CCT: 3700-7000K
0.02
Relative Variation[a.u.]
CIEx
CIEy
0.01
0.00
-0.01
-0.02
25
50
75
100
125
150
o
Junction Temperature [ C]
CCT: 2600-3700K
0.02
Relative Variation[a.u.]
CIEx
CIEy
0.01
0.00
-0.01
-0.02
25
50
75
100
125
150
o
Junction Temperature [ C]
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Product Data Sheet
SAW81F1D – Chip on Board
Characteristics Graph
Fig 9. Ambient Temperature vs. Maximum Forward Current, Tj(max.)=125℃
50
Forward Current [mA]
40
30
20
Rth(j-a) = 6K/W
Rth(j-a) = 8K/W
Rth(j-a) = 10K/W
10
0
0
20
40
60
80
100
120
O
Ambient Temperature Ta [ C]
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Product Data Sheet
SAW81F1D – Chip on Board
Product Nomenclature
Table 4. Part Numbering System : X1X2X3 X4X5 X6X7 X8
Part Number Code
Description
Part Number
Value
X1
Company
S
X2
Package series
A
X3X4
Color Specification
W8
X5
Series number
1
X6
Lens type
F
Flat
X7
PCB type
1
PCB
X8
Revision number
D
CRI 80
Table 5. Lot Numbering System : Y1Y2Y3Y4Y5Y6 – Y7Y8Y9Y10 – Y11Y12Y13
Lot Number Code
Description
Y1Y2
Year
Y3Y4
Month
Y5Y6
Day
Y7Y8Y9Y10
Mass order
Y11Y12Y13
Tray No.
Rev1.0, Apr 6, 2016
Lot Number
11
Value
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Product Data Sheet
SAW81F1D – Chip on Board
Color Bin Structure
CIE Chromaticity Diagram, IF = 20mA, Ts=85℃
0.45
2700K
3000K
0.42
4000K
0.39
Y
5000K
0.36
6500K
0.33
ANSI
ErP 6step Ellipse
0.30
0.30
0.33
0.36
0.39
0.42
0.45
0.48
X
Center Point
a
b
Ellipse Rotation
Angle(degrees)
0.3370
0.02622
0.01136
57.46
0.3460
0.3590
0.03273
0.01397
57.48
0.3800
0.3800
0.03786
0.01642
53.92
GE6
0.4400
0.4030
0.03492
0.01678
53.85
HE6
0.4630
0.4200
0.02985
0.01598
57.59
CCT
Rank
6,500K
Cx
Cy
AE6
0.3130
5,000K
CE6
4,000K
EE6
3,000K
2,700K
Notes :
1.
Cx and Cy are the center coordinates of the ellipse, a the length of the major axis, b the length of
the minor axis and Θ the angle of the major axis as defined in IEC 60081.
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Product Data Sheet
SAW81F1D – Chip on Board
Color Bin Structure
Table 6. Bin Code description, IF = 20mA
Luminous Flux (lm) [1]
Part
Number
Tj=25℃
Tj=85℃
Color
Chromaticity
Coordinate
Bin
No.
Min.
Max.
Min.
Max.
Tj=85℃
A3
420
460
374
410
A4
460
500
410
440
Refer to
page.12
SAW81F1D
Typical Forward Voltage (V)
Bin
No.
Tj=25℃
Min.
Max.
Min.
Max.
X5
180
190
170
180
X6
190
200
180
190
Available ranks
Table 7. Ordering Information(Bin Code)
Part
Number
Tj=85℃
CCT
CIE
LF rank
VF rank
6000~7000K
A
A3
A4
X5
X6
5300~6000K
B
A3
A4
X5
X6
4700~5300K
C
A3
A4
X5
X6
3700~4200K
D
A3
A4
X5
X6
3700~4200K
E
A3
A4
X5
X6
3100~3700K
F
A3
A4
X5
X6
2900~3100K
G
A3
A4
X5
X6
2600~2900K
H
A3
A4
X5
X6
SAW81F1D
Notes for Table 6:
1.
Flux values @ 85 °C are calculated and for reference only.
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Product Data Sheet
SAW81F1D – Chip on Board
Mechanical Dimensions
Top view
Side view
Marking1
< Inner Circuit Diagram>
Cathode
X4
Anode
Notes :
1.
2.
3.
All dimensions are in millimeters.
Scale : none
Undefined tolerance is ±0.2mm
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Product Data Sheet
SAW81F1D – Chip on Board
Packaging Specification
Top view
Side view
Notes :
1.
2.
3.
Quantity : 30pcs/Tray
All dimensions are in millimeters (tolerance : ±0.3)
Scale none
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Product Data Sheet
SAW81F1D – Chip on Board
Packaging Specification
Aluminum Bag
Outer Box
Notes :
1. Heat Sealed after packing (Use Zipper Bag)
2. Quantity : 3Tray(90pcs) /Bag
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Product Data Sheet
SAW81F1D – Chip on Board
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
(3) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As
mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of wire.
(4) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are
used, it must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(5) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this
product with acid or sulfur material in sealed space.
(6) Avoid leaving fingerprints on silicone resin parts.
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Product Data Sheet
SAW81F1D – Chip on Board
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend storing Power LEDs in a dry box with a
desiccant.
The recommended storage temperature range is 5C to 30C and a maximum humidity of 50%.
(2) Use Precaution after Opening the Packaging. Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 4 week or the color of the desiccant changes.
(3) For manual soldering
Seoul Semiconductor recommends the soldering condition
(ZC series product is not adaptable to reflow process)
a. Use lead-free soldering
b. Soldering should be implemented using a soldering equipment at temperature lower than 350°C.
c. Before proceeding the next step, product temperature must be stabilized at room temperature.
(4) Components should not be mounted on warped (non coplanar) portion of PCB.
(5) Radioactive exposure is not considered for the products listed here in.
(6) It is dangerous to drink the liquid or inhale the gas generated by such products when chemically
disposed of.
(7) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(8) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(9) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more
after being shipped from Seoul Semiconductor,
a sealed container with vacuum atmosphere should be used for storage.
(10) The appearance and specifications of the product may be modified for improvement without
notice.
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Product Data Sheet
SAW81F1D – Chip on Board
Precaution for Use
(11) Long time exposure of sun light or occasional UV exposure will cause silicone discoloration.
(12) Attaching LEDs, do not use adhesive that outgas organic vapor.
(13) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the
reverse voltage is applied to LED, migration can be generated resulting in LED damage.
(14) Please do not touch any of the circuit board, components or terminals with bare hands or metal
while circuit is electrically active.
(15) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic
energy. The result can be a significant loss of light output from the fixture. Knowledge of the
properties of the materials selected to be used in the construction of fixtures can help prevent
these issues.
(16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact. While most ESD events are considered harmless, it can be an expensive problem in
many industrial environments during production and storage. The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as:
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event.
One or more recommended work area suggestions:
- Ionizing fan setup
- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options:
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls:
- Humidity control (ESD gets worse in a dry environment)
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Product Data Sheet
SAW81F1D – Chip on Board
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires.
- This damage usually appears due to the thermal stress produced during the EOS event.
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
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Product Data Sheet
SAW81F1D – Chip on Board
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (SeoulSemicon.com) manufacturers and packages a wide selection of light
emitting diodes (LEDs) for the automotive, general illumination/lighting, appliance, signage and back
lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000
patents globally, while offering a wide range of LED technology and production capacity in areas such
as “nPola”, deep UV LEDs, "Acrich", the world’s first commercially produced AC LED, and "Acrich
MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad
product portfolio includes a wide array of package and device choices such as Acrich, high-brightness
LEDs, mid-power LEDs, side-view LEDs, through-hole type LED lamps, custom displays, and sensors.
The company is vertically integrated from epitaxial growth and chip manufacture in it’s fully owned
subsidiary, Seoul Viosys, through packaged LEDs and LED modules in three Seoul Semiconductor
manufacturing facilities. Seoul Viosys also manufactures a wide range of unique deep-UV
wavelength devices.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party. The appearance and specifications of the product can be changed
to improve the quality and/or performance without notice.
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