VSMY3850 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diode, 850 nm, Surface Emitter Technology FEATURES • Package type: surface mount • Package form: PLCC-2 • Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75 • Peak wavelength: λp = 850 nm • High reliability • High radiant power • High radiant intensity • Angle of half intensity: ϕ = ± 60° 948553 • Suitable for high pulse current operation • Floor life: 168 h, MSL 3, acc. J-STD-020 • Lead (Pb)-free reflow soldering • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 DESCRIPTION RELEASED FOR APPLICATIONS As part of the SurfLightTM portfolio, the VSMY3850 is an infrared, 850 nm emitting diode based on surface emitter technology with high radiant intensity, high optical power and high speed, molded in a PLCC-2 package for surface mounting (SMD). Infrared radiation source for operation with CMOS cameras (illumination) • High speed IR data transmission • IR touch panels • 3D TV • Light curtain PRODUCT SUMMARY COMPONENT Ie (mW/sr) ϕ (deg) λP (nm) tr (ns) 17 ± 60 850 10 VSMY3850 Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY3850-GS08 Tape and reel MOQ: 7500 pcs, 1500 pcs/reel PLCC-2 VSMY3850-GS18 Tape and reel MOQ: 8000 pcs, 8000 pcs/reel PLCC-2 Note • MOQ: minimum order quantity Rev. 1.5, 24-Sep-13 Document Number: 83399 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY3850 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage Forward current Pulse peak forward current IF 100 mA tp/T = 0.5, tp = 100 μs IFM 200 mA tp = 100 μs IFSM 1 A PV 200 mW Surge forward current Power dissipation Junction temperature Operating temperature range Tj 100 °C Tamb -40 to +85 °C Storage temperature range Soldering temperature Thermal resistance junction/ambient Tstg -40 to +100 °C acc. figure 7, J-STD-020 Tsd 260 °C J-STD-051, soldered on PCB RthJA 250 K/W 120 IF - Forward Current (mA) PV - Power Dissipation (mW) 250 200 150 100 50 100 80 60 40 20 RthJA = 250 K/W RthJA = 250 K/W 0 0 0 22541 20 40 60 80 100 0 Tamb - Ambient Temperature (°C) 20 Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 40 60 80 100 Tamb - Ambient Temperature (°C) 22542 Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF TEST CONDITION SYMBOL IF = 100 mA, tp = 20 ms VF Radiant intensity Radiant power Temperature coefficient of φe TYP. MAX. UNIT 1.6 2.0 V IF = 1 A, tp = 100 μs VF 2.9 V IF = 1 mA TKVF -1.45 mV/K IF = 10 mA TKVF -1.2 mV/K IR not designed for reverse operation μA VR = 0 V, f = 1 MHz, E = 0 Cj 125 IF = 100 mA, tp = 20 ms Ie Reverse current Junction capacitance MIN. 12 17 pF 25 mW/sr IF = 1 A, tp = 100 μs Ie 150 mW/sr IF = 100 mA, tp = 20 ms φe 55 mW IF = 100 mA TKφe -0.35 %/K ϕ ± 60 Angle of half intensity deg Peak wavelength IF = 100 mA λp Spectral bandwidth IF = 30 mA Δλ 30 nm Temperature coefficient of λp IF = 100 mA TKλp 0.25 nm/K Rise time IF = 100 mA tr 10 ns Fall time IF = 100 mA tf 10 ns d 0.44 mm Virtual source diameter Rev. 1.5, 24-Sep-13 840 850 870 nm Document Number: 83399 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY3850 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1 10 Φe, rel - Relative Radiant Power 1 0.1 0.01 IF = 30 mA 0.75 0.5 0.25 0.001 0 0.5 1 1.5 2 2.5 VF - Forward Voltage (V) 21892 0 650 3 750 Fig. 3 - Forward Current vs. Forward Voltage 0° Ie, rel - Relative Radiant Intensity 100 10 1 21893 0.01 0.1 20° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 1 IF - Forward Pulse Current (A) Fig. 4 - Radiant Intensity vs. Forward Current Rev. 1.5, 24-Sep-13 10° 30° tp = 100 µs 0.1 0.001 950 Fig. 5 - Relative Radiant Power vs. Wavelength 1000 Ie - Radiant Intensity (mW/sr) 850 λ - Wavelength (nm) 21776-1 ϕ - Angular Displacement IF - Forward Current (A) tp = 100 µs 80° 0.6 0.4 0.2 0 948013-1 Fig. 6 - Relative Radiant Intensity vs. Angular Displacement Document Number: 83399 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY3850 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 0.9 1.75±0.1 3.5±0.2 0.8 A C Technical drawings according to DIN specifications 2.2 2.8±0.15 Pin identification Dimensions in mm Ø2.4 Drawing-No.: 6.541-5067.02-4 Issue: 5; 23.09.13 +0.15 3 Mounting Pad Layout Area covered with solderresist 4 2.6 (2.8) 1.2 1.6 (1.9) 4 Dimensions: Reflow and vapor phase (wave soldering) DRYPACK SOLDER PROFILE 300 Temperature (°C) max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 FLOOR LIFE 200 Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 3, acc. to J-STD-020. max. 30 s 150 max. 100 s max. 120 s 100 max. ramp up 3 °C/s max. ramp down 6 °C/s 50 0 0 19841 50 Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. 100 150 200 250 300 Time (s) DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 Rev. 1.5, 24-Sep-13 Document Number: 83399 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY3850 www.vishay.com Vishay Semiconductors TAPE AND REEL PLCC-2 components are packed in antistatic blister tape (DIN IEC (CO) 564) for automatic component insertion. Cavities of blister tape are covered with adhesive tape. The tape leader is at least 160 mm and is followed by a carrier tape leader with at least 40 empty compartments. The tape leader may include the carrier tape as long as the cover tape is not connected to the carrier tape. The least component is followed by a carrier tape trailer with a least 75 empty compartments and sealed with cover tape. Adhesive tape 10.0 9.0 120° Blister tape 4.5 3.5 2.5 1.5 Component cavity Identification Label: Vishay type group tape code production code quantity 94 8670 Fig. 8 - Blister Tape 2.2 2.0 3.5 3.1 63.5 60.5 14.4 max. 180 178 94 8665 Fig. 11 - Dimensions of Reel-GS08 5.75 5.25 3.6 3.4 4.0 3.6 8.3 7.7 1.85 1.65 1.6 1.4 4.1 3.9 4.1 3.9 13.00 12.75 10.4 8.4 120° 0.25 2.05 1.95 4.5 3.5 94 8668 2.5 1.5 Fig. 9 - Tape Dimensions in mm for PLCC-2 MISSING DEVICES A maximum of 0.5 % of the total number of components per reel may be missing, exclusively missing components at the beginning and at the end of the reel. A maximum of three consecutive components may be missing, provided this gap is followed by six consecutive components. Identification Label: Vishay type group tape code production code quantity 13.00 12.75 62.5 60.0 321 329 14.4 max. 18857 Fig. 12 - Dimensions of Reel-GS18 De-reeling direction 94 8158 COVER TAPE REMOVAL FORCE > 160 mm Tape leader 40 empty compartments min. 75 empty compartments Carrier leader Carrier trailer The removal force lies between 0.1 N and 1.0 N at a removal speed of 5 mm/s. In order to prevent components from popping out of the blisters, the cover tape must be pulled off at an angle of 180° with regard to the feed direction. Fig. 10 - Beginning and End of Reel Rev. 1.5, 24-Sep-13 Document Number: 83399 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000