VSMB2948SL Datasheet

VSMB2948SL
www.vishay.com
Vishay Semiconductors
High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, MQW
FEATURES
• Package type: surface mount
• Package form: side view
• Dimensions (L x W x H in mm): 2.3 x 2.55 x 2.3
• Peak wavelength: p = 940 nm
• High reliability
• High radiant power
• High radiant intensity
• Angle of half intensity:  = ± 25°
DESCRIPTION
• Low forward voltage
VSMB2948SL is an infrared, 940 nm, side looking emitting
diode in GaAlAs multi quantum well (MQW) technology with
high radiant power and high speed, molded in clear,
untinted plastic package (with lens) for surface mounting
(SMD).
• Suitable for high pulse current operation
• Package matches with detector VEMD2023SLX01 and
VEMT2023SLX01
• Floor life: 4 weeks, MSL 2a, acc. J-STD-020
APPLICATIONS
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
• Remote control


• IR touch panels
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
 (deg)
p (nm)
tr (ns)
VSMB2948SL
20
± 25
940
15
Note
• Test conditions see table “Basic Characteristics“
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
VSMB2948SL
Tape and reel
MOQ: 3000 pcs, 3000 pcs/reel
Side view
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Reverse voltage
Forward current
Surge forward current
tp = 100 μs
Power dissipation
Junction temperature
SYMBOL
VALUE
UNIT
VR
5
V
mA
IF
100
IFSM
500
mA
PV
160
mW
Tj
100
°C
Operating temperature range
Tamb
- 40 to + 85
°C
Storage temperature range
Tstg
- 40 to + 100
°C
according figure 9, J-STD-020
Tsd
260
°C
J-STD-051, leads 7 mm,
soldered on PCB
RthJA
250
K/W
Soldering temperature
Thermal resistance junction/ambient
Rev. 1.0, 07-Feb-13
Document Number: 83498
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMB2948SL
www.vishay.com
Vishay Semiconductors
120
160
IF - Forward Current (mA)
PV - Power Dissipation (mW)
180
140
120
100
RthJA = 250 K/W
80
60
40
100
80
60
RthJA = 250 K/W
40
20
20
0
0
0
10
21343
20 30
40
50
60
70 80
90
0
100
10
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
50 60 70 80
90 100
Tamb - Ambient Temperature (°C)
21344
Tamb - Ambient Temperature (°C)
20 30 40
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
IF = 100 mA, tp = 20 ms
VF
1.15
1.35
1.6
IF = 500 mA, tp = 100 μs
VF
1.8
Temperature coefficient of VF
IF = 1 mA
TKVF
- 1.5
Reverse current
VR = 5 V
IR
VR = 0 V, f = 1 MHz, E = 0 mW/cm2
CJ
IF = 100 mA, tp = 20 ms
Ie
Forward voltage
Junction capacitance
Radiant intensity
20
V
V
mV/K
10
μA
30
mW/sr
21
10
UNIT
pF
IF = 500 mA, tp = 100 μs
Ie
90
mW/sr
IF = 100 mA, tp = 20 ms
e
40
mW
IF = 1 mA
TKe
- 1.1
%/K
Peak wavelength
IF = 30 mA
p
Spectral bandwidth
IF = 30 mA

25
nm
Temperature coefficient of p
IF = 30 mA
TKp
0.25
nm/K
Rise time
IF = 100 mA, 20 % to 80 %
tr
15
ns
Fall time
IF = 100 mA, 20 % to 80 %
tf
15
ns
IDC = 70 mA, IAC = 30 mA pp
fc
23
MHz
Radiant power
Temperature coefficient of
radiant power

Angle of half intensity
Cut-off frequency
Rev. 1.0, 07-Feb-13
± 25
920
940
deg
960
nm
Document Number: 83498
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMB2948SL
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1000
Ie rel - Relative Radiant Intensity (%)
180
100
10
1
0.5
IF = 1 mA
160
140
120
IF = 100 mA
100
80
60
tp = 20 ms
40
0.7
0.9
1.1
1.3
1.7
1.5
1.9
VF - Forward Voltage (V)
- 60 - 40 - 20
Fig. 3 - Forward Current vs. Forward Voltage
40
60
80
100
106
104
102
IF = 100 mA
100
IF = 10 mA
98
tp = 20 ms
96
94
IF = 1 mA
92
Φe rel - Relative Radiant Power (%)
100
108
90
- 40
- 20
0
20
40
60
80
70
60
50
40
30
20
10
0
840
100
Tamb - Ambient Temperature (°C)
21443
IF = 30 mA
80
90
880
920
960
0°
10°
20°
30°
Ie rel - Relative Radiant Intensity
tp = 100 µs
100
10
1
0.01
0.1
1
IF - Forward Current (A)
Fig. 5 - Radiant Intensity vs. Forward Current
Rev. 1.0, 07-Feb-13
1040
Fig. 7 - Relative Radiant Power vs. Wavelength
1000
0.1
0.001
1000
λ - Wavelength (nm)
21445
Fig. 4 - Relative Forward Voltage vs. Ambient Temperature
Ie - Radiant Intensity (mW/sr)
20
Fig. 6 - Relative Radiant Intensity vs. Ambient Temperature
110
VF, rel - Relative Forward Voltage (%)
0
Tamb - Ambient Temperature (°C)
21444
40°
1.0
0.9
50°
0.8
60°
70°
0.7
ϕ - Angular Displacement
IF - Forward Current (mA)
tp = 100 µs
80°
0.6
0.4
0.2
0
22690
Fig. 8 - Relative Radiant Intensity vs. Angular Displacement
Document Number: 83498
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMB2948SL
www.vishay.com
Vishay Semiconductors
SOLDER PROFILE
DRYPACK
300
Temperature (°C)
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
FLOOR LIFE
200
max. 30 s
150
max. 100 s
max. 120 s
100
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label: 
Floor life: 4 weeks 
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020.
DRYING
0
0
19841
50
100
150
200
250
300
Time (s)
Fig. 9 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
PACKAGE DIMENSIONS in millimeters: VSMB2948SL
Rev. 1.0, 07-Feb-13
Document Number: 83498
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMB2948SL
www.vishay.com
Vishay Semiconductors
TAPING AND REEL DIMENSIONS in millimeters: VSMB2948SL
Rev. 1.0, 07-Feb-13
Document Number: 83498
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000