TSMF1000, TSMF1020, TSMF1030 Datasheet

TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
High Speed Infrared Emitting Diode, RoHS Compliant,
890 nm, GaAlAs Double Hetero
FEATURES
TSMF1000
• Package type: surface mount
TSMF1020
• Package form: GW, RGW, yoke, axial
• Dimensions (L x W x H in mm): 2.5 x 2 x 2.7
• Peak wavelength: p = 890 nm
• High radiant power
• Angle of half intensity:  = ± 17°
TSMF1030
• Low forward voltage
• Suitable for high pulse current operation
• Versatile terminal configurations
16758-5
• Package matches with detector TEMD1000
• Floor life: 168 h, MSL 3, acc. J-STD-020
• Compliant to RoHS Directive 2002/95/EC and in
accordance with WEEE 2002/96/EC
DESCRIPTION
APPLICATIONS
TSMF1000 series are infrared, 890 nm emitting diodes in
GaAlAs double hetero (DH) technology with high radiant
power and high speed, molded in clear, untinted plastic
packages (with lens) for surface mounting (SMD).
• IrDA compatible data transmission
• Miniature light barrier
• Photointerrupters
• Optical switch
• Control and drive circuits
• Shaft encoders
PRODUCT SUMMARY
Ie (mW/sr)
 (deg)
P (nm)
tr (ns)
TSMF1000
5
± 17
890
30
TSMF1020
5
± 17
890
30
TSMF1030
5
± 17
890
30
COMPONENT
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
TSMF1000
Tape and reel
MOQ: 1000 pcs, 1000 pcs/reel
Reverse gullwing
TSMF1020
Tape and reel
MOQ: 1000 pcs, 1000 pcs/reel
Gullwing
TSMF1030
Tape and reel
MOQ: 1000 pcs, 1000 pcs/reel
Yoke
Note
• MOQ: minimum order quantity
Rev. 1.8, 30-Jun-11
1
Document Number: 81061
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
VR
5
V
Reverse voltage
Forward current
IF
100
mA
Peak forward current
tp/T = 0.5, tp  100 μs
IFM
200
mA
Surge forward current
tp = 100 μs
IFSM
0.8
A
PV
180
mW
Power dissipation
Junction temperature
Tj
100
°C
Operating temperature range
Tamb
- 40 to + 85
°C
Storage temperature range
Tstg
- 40 to + 100
°C
t5s
Tsd
260
°C
Soldered on PCB, pad dimensions:
4 mm x 4 mm
RthJA
400
K/W
Soldering temperature
Thermal resistance junction/ambient
200
120
160
IF - Forward Current (mA)
PV - Power Dissipation (mW)
180
140
120
100
RthJA = 400 K/W
80
60
40
100
80
60
RthJA = 400 K/W
40
20
20
0
0
0
10
21165
20
30
40
50
60
70 80
90 100
0
Tamb - Ambient Temperature (°C)
10
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
20 30 40
50 60 70 80
90 100
Tamb - Ambient Temperature (°C)
21166
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Forward voltage
Temperature coefficient of VF
Reverse current
Junction capacitance
Radiant intensity
TEST CONDITION
SYMBOL
TYP.
MAX.
UNIT
IF = 20 mA
VF
1.3
1.5
V
IF = 1 A, tp = 100 μs
VF
2.4
V
IF = 1 mA
TKVF
- 1.8
mV/K
VR = 5 V
IR
VR = 0 V, f = 1 MHz, E = 0
Cj
IF = 20 mA
Ie
IF = 100 mA, tp = 100 μs
Ie
MIN.
10
μA
13
mW/sr
160
2.5
5
25
pF
mW/sr
IF = 100 mA, tp = 20 ms
e
35
mW
IF = 20 mA
TKe
- 0.6
%/K

± 17
deg
Peak wavelength
IF = 20 mA
p
890
nm
Spectral bandwidth
IF = 20 mA

40
nm
Temperature coefficient of p
IF = 20 mA
TKp
0.2
nm/K
Rise time
IF = 20 mA
tr
30
ns
Fall time
IF = 20 mA
tf
30
ns
IDC = 70 mA, IAC = 30 mA pp
fc
12
MHz
d
1.2
mm
Radiant power
Temperature coefficient of e
Angle of half intensity
Cut-off frequency
Virtual source diameter
Rev. 1.8, 30-Jun-11
2
Document Number: 81061
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
10 000
1000
Tamb < 60 °C
0.01
1000
Φe - Radiant Power (mW)
IF - Forward Current (mA)
tp/T = 0.005
0.02
0.05
100
0.2
0.5
DC
0.1
10
1
0.01
0.1
1
10
1
10 4
Fig. 6 - Radiant Power vs. Forward Current
104
1.6
103
1.2
Ie rel; Φe rel
IF = 20 mA
102
0.8
0.4
101
100
0
94 8880
1
2
3
0
- 10 0 10
4
VF - Forward Voltage (V)
94 7993
1000
Φe rel - Relative Radiant Power
10
1
16189
101
102
103
140
1.0
0.75
0.5
0.25
0
800
104
IF - Forward Current (mA)
20082
1000
900
λ - Wavelength (nm)
Fig. 8 - Relative Radiant Power vs. Wavelength
Fig. 5 - Radiant Intensity vs. Forward Current
Rev. 1.8, 30-Jun-11
100
1.25
100
0.1
100
50
T amb - Ambient Temperature (°C)
Fig. 7 - Rel. Radiant Intensity/Power vs. Ambient Temperature
Fig. 4 - Forward Current vs. Forward Voltage
Ie - Radiant Intensity (mW/sr)
10 1
10 2
10 3
I F - Forward Current (mA)
94 8007
Fig. 3 - Pulse Forward Current vs. Pulse Duration
IF - Forward Current (mA)
10
0.1
10 0
100
tp - Pulse Length (ms)
95 9985
100
3
Document Number: 81061
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
REFLOW SOLDER PROFILE
0°
10°
20°
260
30°
1.0
0.9
50°
0.8
60°
70°
0.7
220
Temperature (°C)
40°
ϕ - Angular Displacement
Srel - Relative Sensitivity
240
200
160
140
120
0.4
0.2
60 s to 120 s
5s
100
80°
0.6
- 5 °C/s
+ 5 °C/s
180
80
60
0
0
20 40 60 80 100 120 140 160 180 200 220
94 8248
Time (s)
17172
Fig. 9 - Relative Radiant Intensity vs. Angular Displacement
Fig. 10 - Lead Tin (SnPb) Reflow Solder Profile
PRECAUTIONS FOR USE
1 °C/s to 5 °C/s
1. Over-current-proof
Customer must apply resistors for protection, otherwise
slight voltage shift will cause big current change (burn out
will happen).
Pre-heating
180 °C to 200 °C
260 °C max.
10 s max.
60 s max.
above 220 °C
120 s max.
2. Storage
• Storage temperature and rel. humidity conditions are:
5 °C to 35 °C, R.H. 60 %.
1 °C/s to 5 °C/s
• Floor life must not exceed 168 h, acc. to JEDEC level 3,
J-STD-020.
Once the package is opened, the products should be
used within a week. Otherwise, they should be kept in a
damp proof box with desiccant.
Considering tape life, we suggest to use products within
one year from production date.
22566
Fig. 11 - Lead (Pb)-Free Reflow Solder Profile acc. J-STD-020
• If opened more than one week in an atmosphere 5 °C to
35 °C, R.H. 60 %, devices should be treated at 60 °C
± 5 °C for 15 h.
• If humidity indicator in the package shows pink color
(normal blue), then devices should be treated with the
same conditions as 2.3.
Rev. 1.8, 30-Jun-11
4
Document Number: 81061
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters: TSMF1000
16159
PACKAGE DIMENSIONS in millimeters: TSMF1020
3.8 ± 0.2
2.7 ± 0.2
0.75
0.15 ± 0.05
1.4
0.85
Ø 1.9 ± 0.2
0.3
2.3 ± 0.1
0.4
C
Rev. 1.8, 30-Jun-11
4.5 ± 0.1
0.5
2 ± 0.2
1.1
1 ± 0.1
2.5 ± 0.2
16160
A
5
Document Number: 81061
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters: TSMF1030
16228
16 ±0.2
Unreel direction
X
2.
60.2
±0.5
REEL DIMENSIONS in millimeters
5
178 ±1
.5
±0
0.
5
Tape position
coming out from reel
13
±
X
13.2
±1.5
Label posted here
Leader and trailer tape:
Empty leader (400 mm, min.)
Parts mounted
Drawing-No.: 9.800-5080.01-4
Direction of pulling out
Issue: 3; 11.06.08
Empty trailer (200 mm, min.)
18033
Rev. 1.8, 30-Jun-11
6
Document Number: 81061
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
TAPING DIMENSIONS in millimeters: TSMF1000
3.05 ± 0.1
Top tape
Anode
12 ± 0.3
1.75 ± 0.1
2 ± 0.05
Ø 1.55 ± 0.05
5.5 ± 0.05
0.3
4 ± 0.1
4 ± 0.1
Feed direction
Push pin through hole
Quantity per reel: 1000 pcs or 5000 pcs
18030
TAPING DIMENSIONS in millimeters: TSMF1020
3.05 ± 0.1
4 ± 0.1
Feed direction
Top tape
12 ± 0.3
2 ± 0.05
1.75 ± 0.1
Ø 1.55 ± 0.05
5.5 ± 0.05
0.3
4 ± 0.1
Anode
Push pin through hole
Quantity per reel: 1000 pcs or 5000 pcs
Rev. 1.8, 30-Jun-11
7
18031
Document Number: 81061
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
TAPING DIMENSIONS in millimeters: TSMF1030
3.05 ± 0.1
Feed direction
Top tape
4 ± 0.1
Anode
Push pin through hole
Rev. 1.8, 30-Jun-11
12 ± 0.3
1.75 ± 0.1
2 ± 0.05
Ø 1.55 ± 0.05
5.5 ± 0.05
0.3
4 ± 0.1
18032
Quantity per reel: 1000 pcs or 5000 pcs
8
Document Number: 81061
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000