VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 850 nm, Surface Emitter Technology VSMY2850RG FEATURES VSMY2850G • Package type: surface mount • Package form: GW, RGW • Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8 • Peak wavelength: λp = 850 nm • High reliability • High radiant power • Very high radiant intensity DESCRIPTION • Angle of half intensity: ϕ = ± 10° As part of the SurfLightTM portfolio, the VSMY2850 series are infrared, 850 nm emitting diodes based on GaAlAs surface emitter chip technology with extreme high radiant intensities, high optical power and high speed, molded in clear, untinted plastic packages (with lens) for surface mounting (SMD). • Suitable for high pulse current operation • Terminal configurations: gullwing or reverse gullwing • Package matches with detector VEMD2500X01 series • Floor life: 4 weeks, MSL 2a, acc. J-STD-020 • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • IrDA compatible data transmission • Miniature light barrier • Photointerrupters • Optical switch • Emitter source for proximity sensors • IR touch panels • IR illumination PRODUCT SUMMARY COMPONENT Ie (mW/sr) ϕ (deg) λP (nm) tr (ns) VSMY2850RG 100 ± 10 850 10 VSMY2850G 100 ± 10 850 10 Note • Test conditions see table “Basic Characteristics“ ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY2850RG Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing VSMY2850G Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing Note • MOQ: minimum order quantity Rev. 1.5, 06-Sep-13 Document Number: 83398 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage Forward current IF 100 mA Peak forward current tp/T = 0.5, tp = 100 μs IFM 200 mA Surge forward current tp = 100 μs IFSM 1 A PV 190 mW Power dissipation Junction temperature Operating temperature range Tj 100 °C Tamb - 40 to + 85 °C Storage temperature range Soldering temperature Thermal resistance junction/ambient Tstg - 40 to + 100 °C acc. figure 10, J-STD-020 Tsd 260 °C J-STD-051, soldered on PCB RthJA 250 K/W 120 200 IF - Forward Current (mA) PV - Power Dissipation (mW) 180 160 140 120 100 RthJA = 250 K/W 80 60 40 100 80 60 RthJA = 250 K/W 40 20 20 0 0 0 10 21890 20 30 40 50 60 70 80 0 90 100 Tamb - Ambient Temperature (°C) 10 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) 21891 Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 20 30 40 Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL TYP. MAX. UNIT IF = 100 mA, tp = 20 ms VF 1.65 1.9 V IF = 1 A, tp = 100 μs VF 2.9 V IF = 100 mA TKVF - 1.6 mV/K IR not designed for reverse operation μA VR = 0 V, f = 1 MHz, E = 0 mW/cm2 CJ 125 IF = 100 mA, tp = 20 ms Ie IF = 1 A, tp = 100 μs Ie 850 mW/sr IF = 100 mA, tp = 20 ms φe 55 mW IF = 100 mA TKφe - 0.2 %/K Peak wavelength IF = 100 mA λp Spectral bandwidth IF = 30 mA Δλ 30 nm Temperature coefficient of λp IF = 30 mA TKλp 0.25 nm/K Rise time IF = 100 mA, 20 % to 80 % tr 10 ns Fall time IF = 100 mA, 20 % to 80 % tf 10 ns Forward voltage Temperature coefficient of VF Reverse current Junction capacitance Radiant intensity Radiant power Temperature coefficient of radiant power 50 ϕ Angle of half intensity Rev. 1.5, 06-Sep-13 MIN. 100 pF 150 ± 10 840 850 mW/sr deg 870 nm Document Number: 83398 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1000 Ie - Radiant Intensity (mW/sr) IF - Forward Current (mA) 1000 tp = 100 μs 100 10 1 tp = 100 μs 100 10 1 0.1 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 1 VF - Forward Voltage (V) VF - Forward Voltage (V) IF = 100 mA 1.80 1.70 1.60 1.50 1.40 20 40 60 80 110 IF = 100 mA tp = 20 ms 105 100 95 90 85 80 100 -60 -40 -20 115 IF = 100 mA tp = 20 ms 105 100 95 90 0 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 5 - Relative Forward Voltage vs. Ambient Temperature Rev. 1.5, 06-Sep-13 20 40 60 80 100 Fig. 7 - Relative Radiant Intensity vs. Ambient Temperature Ie, rel - Relative Radiant Intensity (%) VF, rel - Relative Forward Voltage (%) Fig. 4 - Forward Voltage vs. Ambient Temperature -60 -40 -20 0 Tamb - Ambient Temperature (°C) Tamb - Ambient Temperature (°C) 110 1000 Fig. 6 - Radiant Intensity vs. Forward Current Ie, rel - Relative Radiant Intensity (%) 1.90 0 100 IF - Forward Current (mA) Fig. 3 - Forward Current vs. Forward Voltage -60 -40 -20 10 100 IF = 20 mA 90 80 70 60 50 40 30 20 10 0 700 750 800 850 900 950 λ - Wavelength (nm) Fig. 8 - Relative Radiant Intensity vs. Wavelength Document Number: 83398 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors Fig. 10 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 10° 20° DRYPACK 30° 40° 1.0 50° 0.9 60° 0.8 70° ϕ - Angular Displacement Ie rel - Relative Radiant Intensity 0° 80° 0.7 0.6 21111 0.4 0.2 0 Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 4 weeks Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 2a, acc. to J-STD-020. DRYING Fig. 9 - Relative Radiant Intensity vs. Angular Displacement SOLDER PROFILE In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. 300 Temperature (°C) max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp up 3 °C/s max. ramp down 6 °C/s 50 0 0 19841 Rev. 1.5, 06-Sep-13 50 100 150 200 250 300 Time (s) Document Number: 83398 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors PACKAGE DIMENISONS in millimeters: VSMY2850RG Ø 1.8 ± 0.1 0.3 Z 1.6 0.19 2.77 ± 0.2 0.05 ± 0.1 0.4 2.2 2.2 5.8 ± 0.2 Z 20:1 1.1 ± 0.1 Exposed copper 0.254 0.5 2.3 ± 0.2 0.4 2.3 ± 0.2 Pin ID Anode 1.7 Cathode 0.75 Solder pad proposal acc. IPC 7351 technical drawings according to DIN specifications Not indicated tolerances ± 0.1 Ø 2.3 ± 0.1 6.7 Drawing-No.: 6.544-5391.03-4 Issue: 1; 18.03.10 22100 Rev. 1.5, 06-Sep-13 Document Number: 83398 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMY2850G Ø 1.8 2.2 0.19 1.6 X 0.05 2.77 ± 0.2 0.3 0.4 2.2 4.2 ± 0.2 Exposed copper X 20:1 0.6 Anode 0.75 0.254 0.5 2.3 ± 0.2 0.4 2.3 ± 0.2 Pin ID Cathode technical drawings according to DIN specifications Solder pad proposal acc. IPC 7351 Not indicated tolerances ± 0.1 2.45 5.15 Drawing-No.: 6.544-5383.03-4 Issue: 1; 18.03.10 22099 Rev. 1.5, 06-Sep-13 Document Number: 83398 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY2850RG Unreel direction X 2. Ø 62 ± 0.5 Reel Ø 13 ± 0.5 Ø 330 ± 1 0.5 5± Tape position coming out from reel 6000 pcs/reel Label posted here Technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Devicce Lead I Lead II Collector Emitter Cathode Anode Anode Cathode Ø 1.55 ± 0.05 I VEMT2000 VEMT2500 X 2:1 4 ± 0.1 2 ± 0.05 VEMD2000 5.5 ± 0.05 VEMD2500 VSMB2000 VSMG2000 VSMY2850RG 3.05 ± 0.1 II 12 ± 0.3 Terminal position in tape 1.75 ± 0.1 Empty (400 mm min.) 4 ± 0.1 Drawing-No.: 9.800-5100.01-4 Issue: 2; 18.03.10 21572 Rev. 1.5, 06-Sep-13 Document Number: 83398 7 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY2850G Reel X Unreel direction 5± Ø 62 ± 0.5 2. Ø 13 ± 0.5 Ø 330 ± 1 0.5 Tape position coming out from reel 6000 pcs/reel Label posted here technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Ø 1.55 ± 0.05 Devicce Lead I Lead II Collector Emitter Cathode Anode Anode Cathode I VEMT2020 VEMT2520 X 2:1 4 ± 0.1 2 ± 0.05 VSMB2020 VEMD2020 VEMD2520 VSMY2850G 3.05 ± 0.1 II 4 ± 0.1 5.5 ± 0.05 VSMG2020 12 ± 0.3 Terminal position in tape 1.75 ± 0.1 Empty (400 mm min.) Drawing-No.: 9.800-5091.01-4 Issue: 3; 18.03.10 21571 Rev. 1.5, 06-Sep-13 Document Number: 83398 8 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000