CSBGA SNPB Auwire64

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
August, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
4.43%
0.0021
Mold
35.68%
0.0171
D/A Epoxy
0.72%
3.17%
0.0015
Solder Balls
16.59%
0.0080
Foil
30.50%
8.92%
with SnPb Solder Balls
% of Total
Weight (g)
Pkg. Wt.
MSL: 3
Peak Reflow Temp: 240°C
Substance
CAS #
Notes / Assumptions:
Silicon chip
7440-21-3
Die size: 1.77 x 1.91 mm
30.32%
2.14%
2.14%
0.89%
0.18%
0.3032
0.0214
0.0214
0.0089
0.00178
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon Black
60676-86-0
1333-86-4
Mold Compound composition:
75-95% Silica (LSC uses 85% in our calculation)
2-10% Epoxy resin (LSC uses 6% in our calculation)
2-10% Phenol Resin (LSC uses 6% in our calculation)
0.5 to 2.5% Metal Hydroxide (LSC uses 2.5% in our calculation)
0.1-0.5% Carbon Black (LSC uses 0.5% in our calculation)
Mold Compound Density between 1.9 and 2.1 grams/cc
0.33%
0.08%
0.00027
0.00007
Silver (Ag)
Organic esters and resins
7440-22-4
-
60 to 90% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
Gold (Au)
7440-57-5
0.8 to 1.0 mil diameter; 1 wire per solder ball
0.00034
Wire
Substrate
64 csBGA
0.048
Grams
10.45%
6.14%
0.0050
0.0029
Tin (Sn)
Lead (Pb)
7440-31-5
7439-92-1
Solder ball composition Sn63/Pb37
20.74%
9.76%
0.0100
0.0047
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.0146
0.0043
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. J
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