QFN halogenfree48

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
[email protected]
Package:
Total Device Weight
July, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
3.50%
0.005
Mold
49.24%
0.074
D/A Epoxy
0.61%
48 QFNS
0.15
Grams
% of Total
Pkg. Wt.
with matte Sn Plating
MSL: 3
Peak Reflow Temp: 260°C
Weight (g)
Substance
CAS #
Notes / Assumptions:
Silicon chip
7440-21-3
Die size: 3.0 x 3.0 mm
43.33%
2.46%
2.46%
0.86%
0.12%
0.065
0.0037
0.0037
0.0013
0.0002
Silica (fused)
Epoxy Resin
Phenol Resin
Metal Hydroxide
Carbon Black
60676-86-0
1333-86-4
Mold Compound Density ranges between 1.9 and 2.1 grams/cc
75 to 95% Fused silica filler (LSC uses 88% in our calculation)
2 to 10% Epoxy resin (LSC uses 5% in our calculation)
2 to 10% Phenol resin (LSC uses 5% in our calculation)
0.5 to 2.5% Metal hydroxide (LSC uses 1.75% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.25% in our calculation)
0.46%
0.15%
0.0007
0.0002
Silver (Ag)
Organic esters and resins
7440-22-4
-
Die attach epoxy Density: 4 grams/cc
70 to 80% Silver (LSC uses 75% in our calculation)
20 to 30% Organic Resins, Hardners and Elastomers (LSC uses 25% in our calculation)
0.0009
Wire
0.72%
0.0011
Gold (Au)
7440-57-5
Assume 1 wire per lead
Plating
0.34%
0.0005
Tin (Sn)
7440-31-5
Tin plating is 400 to 800 microinches (LSC uses 600 microinches in our calculation)
Leadframe
45.60%
0.068
Copper (Cu)
7440-50-8
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. A