Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 Package: Total Device Weight October, 2009 % of Total Pkg. Wt. Weight (g) Die 5.55% 0.0023 Mold 56.46% 0.0237 D/A Epoxy 0.97% 24 QFNS 0.042 Grams % of Total Pkg. Wt. with matte Sn Plating MSL: 1 Peak Reflow Temp: 260°C Substance Weight (g) Silicon chip 49.69% 2.82% 2.82% 0.99% 0.14% 0.0209 0.0012 0.0012 0.0004 0.0001 Silica (fused) Epoxy Resin Phenol Resin Metal Hydroxide Carbon Black 0.73% 0.24% 0.0003 0.0001 Silver (Ag) Organic esters and resins 0.0004 Wire 0.67% 0.0003 Gold (Au) Plating 2.10% 0.0009 Tin (Sn) Leadframe 34.25% 0.0144 Copper (Cu) CAS # Notes / Assumptions: 7440-21-3 Die size: 2.00 x 2.00 mm 60676-86-0 1333-86-4 Mold Compound Density ranges between 1.9 and 2.1 grams/cc 75 to 95% Fused silica filler (LSC uses 88% in our calculation) 2 to 10% Epoxy resin (LSC uses 5% in our calculation) 2 to 10% Phenol resin (LSC uses 5% in our calculation) 0.5 to 2.5% Metal hydroxide (LSC uses 1.75% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.25% in our calculation) Die attach epoxy Density: 4 grams/cc 7440-22-4 70 to 80% Silver (LSC uses 75% in our calculation) 20 to 30% Organic Resins, Hardners and Elastomers (LSC uses 25% in our calculation) 7440-57-5 Assume 1 wire per lead 7440-31-5 Tin plating is 400 to 800 microinches (LSC uses 600 microinches in our calculation) 7440-50-8 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A