SiP2100 Datasheet

New Product
SiP2100
Vishay Siliconix
5 V, 1 A H-Bridge Motor Driver
DESCRIPTION
FEATURES
The SIP2100 is an integrated, buffered H-bridge with TTL
and CMOS compatible inputs with the capability of delivering
up to 1 A continuous current at 5 V VDD supply.
The SIP2100 has two independent logic inputs that can set
four different motor operation modes: normal rotation,
reverse rotation, stop (idling) and braking. The internal
shoot-through protection logic also prevents upper and lower
outputs from being turned on simultaneously.
The SiP2100 offers high efficiency with an extremely low
operating current. The device also benefits from over
temperature protection with a shut down hysteresis of 20 °C.
The SIP2100 is available in SOIC8 package.
•
•
•
•
•
•
1 A drive capability
Optimized for 5 V VDD bias
Extremely low idle current
Shoot-through protection scheme
Thermal shutdown
Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• High performance servo
• Optical/tape disk drives
• Brush/stepper motor driver
PACKAGE OUTLINE
SOIC (Top View)
SA
1
8
OUTA
GND
2
7
INA
VDD
3
6
INB
SB
4
5
OUTB
Fig. 1 - Package and Pinout
FUNCTIONAL BLOCK DIAGRAM AND TRUTH TABLE
Fig. 2 - Functional Block Diagram
TRUTH TABLE
INA
INB
OUTA
OutB
1
0
0
1
0
1
0
1
1
0
0
HiZ
0
1
0
HiZ
Document Number: 63949
S12-2801-Rev. B, 10-Dec-12
For technical questions, contact: [email protected]
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1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
New Product
SiP2100
Vishay Siliconix
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Electrical Parameter
Conditions
Limits
VDD
Reference to GND
- 0.3 to 6
OUTA, OUTB
Reference to GND
- 0.3 to 6
SA, SB
Reference to GND
- 0.3 to 1
INA, INB
Reference to GND
- 0.3 to VDD
Unit
V
Temperature
Operating Temperature
- 40 to 85
Max. Operating Junction Temperature
°C
150
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is
not implied. Exposure to absolute maximum rating/conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Parameter
VDD
Min.
Typ.
Max.
Unit
3.8
5
5.5
V
Temperature
Operating Junction Temperature
0
125
Recommended Ambient Temperature
0
70
°C
THERMAL RESISTANCE RATINGS
Parameter
Max.
Thermal Resistance (Junction to Ambient)
Power Dissipation
153
SO-8 PowerPAD, RthJC
40
SO-8, TA = 70 °C
522
mW
SO-8 PowerPAD, TA = 70 °C
2
W
Junction Temperature
- 65 to 150
Storage Temperature
- 55 to 150
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2
Unit
SO-8, RthJA
For technical questions, contact: [email protected]
°C/W
°C
Document Number: 63949
S12-2801-Rev. B, 10-Dec-12
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
New Product
SiP2100
Vishay Siliconix
SPECIFICATIONS (TA = 25 °C, unless otherwise specified)
Parameter
Symbol
Test Conditions
VDD = 5 V
Limits
Min.a
Typ.b
Max.a
Unit
Driver Power Supply
VDD Bias Supply Current
IDD
IN = 100 kHz
250
300
IN = 20 kHz
150
180
Quiescent state
50
VDD Rising Threshold
VDD TH_R
VDD rising
VDD Falling Threshold
VDD TH_F
VDD falling
VDD UVLO Hysteresis
VDD UVLO
2.8
2
3
2.5
300
µA
V
mV
Input Logic
Input Voltage High
VINH
Input Voltage Low
VINL
0.7
Input Sourcing Current
IINH
1
Input Sinking Current
IINL
2
V
µA
-1
Output Stage
VOUTH
Output Voltage High
IOUT = - 500 mA
IOUT = - 1000 mA
IOUT = + 500 mA
4.4
VDD = 4.75 V
4.25
0.25
Output Voltage Low
VOUTL
Output High Propagation Delay
TPLH
20
25
Output Low Propagation Delay
TPHL
20
25
IOUT = + 1000 mA
V
0.5
nS
Thermal Protection
Thermal Shutdown Threshold
150
Thermal Shutdown Hysteresis
20
°C
Notes:
a. Pulse test; pulse width  300 µs, duty cycle  2 %.
b. Guaranteed by design, not subject to production testing.
PIN DESCRIPTION (SOIC PACKAGE)
Pin Number
Name
Function
1
SA
Driver output return A
2
GND
Analog ground of internal logic
3
VDD
Input of internal logic bias and power stage
4
SB
Driver output return B
5
OUTB
Driver output B
6
INB
Driver input B
7
INA
Driver input A
8
OUTA
Driver output A
Document Number: 63949
S12-2801-Rev. B, 10-Dec-12
For technical questions, contact: [email protected]
www.vishay.com
3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
New Product
SiP2100
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
300
VDD = 5.5 V,100 kHz
250
VIN = 5.5 V
IDD - Supply Current (µA)
VOUT - Output Voltage (V)
5
4.5
4
3.5
200
150
VDD = 5.5 V, 20 kHz
100
VDD = 5.5 V,10 kHz
50
VIN = 3.8 V
3
- 60
VDD = 3.8 V,100 kHz
- 40
- 20
0
20
40
60
VDD = 3.8 V,10 kHz
80
0
- 60
100
- 40
0
20
40
60
80
100
Temperature (°C)
Temperature (°C)
Fig 1. Output Voltage vs. Temperature (at 1.5 A Load)
Fig 2. Supply Current IDD vs. Temperature
19
50
18
45
TPLH, VDD = 3.8 V
17
VDD = 5.5 V
16
Delay Time (ns)
Current (µA)
- 20
VDD = 3.8 V, 20 kHz
40
35
TPLH, VDD = 5.5 V
15
14
13
TPHL, VDD = 3.8 V
12
11
30
VDD = 3.8 V
25
- 60
- 40
- 20
0
20
40
60
TPHL, VDD = 5.5 V
10
80
9
- 60
100
- 40
- 20
Temperature (°C)
0
20
Fig 3. Quiescent Current vs. Temperature
60
80
100
Fig 4. Propagation Delay vs. Temperature
1.8
0.35
1.7
VDD = 5.5 V
0.3
1.6
VIN = 5.5 V
VIH (V)
0.25
ROUT (Ω)
40
Temperature (°C)
VIN = 3.8 V
0.2
VDD = 5 V
1.5
1.4
1.3
VDD = 3.8 V
0.15
1.2
0.1
- 60
- 40
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4
- 20
0
20
40
60
80
100
1.1
- 60
- 40
- 20
0
20
40
60
80
100
Temperature (°C)
Temperature (°C)
Fig 5. ROUT vs. Temperature
Fig 6. PWM Rising Threshold vs. Temperature
For technical questions, contact: [email protected]
Document Number: 63949
S12-2801-Rev. B, 10-Dec-12
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
New Product
SiP2100
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1.1
1.05
1
VDD = 5.5 V
VIL (V)
0.95
VDD = 5 V
0.9
0.85
VDD = 3.8 V
0.8
0.75
0.7
- 60
- 40
- 20
0
20
40
Temperature (°C)
60
80
100
Fig 7. PWM Falling Threshold vs. Temperature
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?63949.
Document Number: 63949
S12-2801-Rev. B, 10-Dec-12
For technical questions, contact: [email protected]
www.vishay.com
5
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
Vishay Siliconix
SOIC (NARROW): 8-LEAD
JEDEC Part Number: MS-012
8
6
7
5
E
1
3
2
H
4
S
h x 45
D
C
0.25 mm (Gage Plane)
A
e
B
All Leads
q
A1
L
0.004"
MILLIMETERS
INCHES
DIM
Min
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.20
0.004
0.008
B
0.35
0.51
0.014
0.020
C
0.19
0.25
0.0075
0.010
D
4.80
5.00
0.189
0.196
E
3.80
4.00
0.150
e
0.101 mm
1.27 BSC
0.157
0.050 BSC
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.50
0.93
0.020
0.037
q
0°
8°
0°
8°
S
0.44
0.64
0.018
0.026
ECN: C-06527-Rev. I, 11-Sep-06
DWG: 5498
Document Number: 71192
11-Sep-06
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Revision: 02-Oct-12
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Document Number: 91000