AOS Semiconductor Product Reliability Report AOD454A, rev c Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOD454A. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD454A passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation Appendix I. Product Description: The AOD454A uses advanced trench technology and design to provide excellent RDS(ON) with low gate charge. With the excellent thermal resistance of the DPAK package, this device is well suited for high current load applications. -RoHS Compliant -Halogen Free Detailed information refers to datasheet. II. Die / Package Information: AOD454A Standard sub-micron Low voltage N channel process Package Type 3 leads TO252 Lead Frame Bare Cu Die Attach Soft solder Bond wire Al & Au wire Mold Material Epoxy resin with silica filler Moisture Level Up to Level 1 * Note * based on info provided by assembler and mold compound supplier Process 2 III. Result of Reliability Stress for AOD454A Test Item Test Condition Time Point MSL Precondition 168hr 85° c /85%RH +3 cycle reflow@260° c Temp = 150° c, Vgs=100% of Vgsmax Temp = 150° c, Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs HTGB Lot Attribution Total Sample size - 9 lots 1210pcs 0 168hrs 500 hrs 1000 hrs 231pcs 0 3 lots (Note A*) HTRB Pressure Pot Temperature Cycle 77pcs / lot 231pcs 0 3 lots (Note A*) HAST Number of Failures 130 +/- 2° c , 85%RH, 33.3 psi, Vgs = 100% of Vgs max 121° c , 29.7psi, RH=100% 100 hrs 9 lots 96 hrs -65° c to 150° c, air to air, 250 / 500 cycles 77pcs / lot 495pcs 0 (Note A*) 5 lots 55 pcs / lot 275pcs 0 (Note A*) 55 pcs / lot 8 lots (Note A*) 440pcs 0 55 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 15 MTTF = 7435 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOD454A). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10 9 7 MTTF = 10 / FIT = 6.51 x 10 hrs = 7435 years / [2x (3x2x77x500) x258] = 15 Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 3