AOS Semiconductor Product Reliability Report AOD474, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOD474. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD474 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AOD474 combines advanced trench MOSFET technology with a low resistance package to provide extremely low RDS(ON). This device is ideal for boost converters and synchronous rectifiers for consumer, telecom, industrial power supplies and LED backlighting. - RoHS Compliant - Halogen-Free Details refer to the datasheet. II. Die / Package Information: AOD474 Standard sub-micron 75V N channel process Package Type TO252 Lead Frame Bare Cu Die Attach Soft solder Bonding Al & Au wire Mold Material Epoxy resin with silica filler Moisture Level Up to Level 1 * Note * based on info provided by assembler and mold compound supplier Process 2 III. Result of Reliability Stress for AOD474 Test Item Test Condition Time Point MSL Precondition 168hr 85° c /85%RH +3 cycle reflow@260° c Temp = 150° c, Vgs=100% of Vgsmax - 9 lots 1210pcs 0 JESD22A113 168hrs 500 hrs 1000 hrs 1 lot 308pcs 0 JESD22A108 Temp = 150° c, Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 0 JESD22A108 495pcs 0 JESD22A110 0 JESD22A102 0 JESD22A104 HTGB HTRB Lot Attribution Total Sample size 3 lots (Note A*) Reference Standard 77 pcs / lot 1 lot 308pcs 3 lots (Note A*) 77 pcs / lot HAST 130 ° c , 85%RH, 33.3 psi, Vgs = 100% of Vgs max 100 hrs 9 lots Pressure Pot 121° c , 29.7psi, RH=100% 96 hrs (Note A*) 5 lots 55 pcs / lot 275pcs (Note A*) 55 pcs / lot -65° c to 150° c, air to air, 250 / 500 cycles Temperature Cycle Number of Failures 8 lots 440pcs (Note A*) 55 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 7 MTTF = 15704 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOD474). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (2x77x168+6x77x1000) x258] = 7 9 MTTF = 10 / FIT =1.38 x 108hrs = 15704 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 3