Reliability Report

AOS Semiconductor
Product Reliability Report
AOH3106,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AOH3106.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AOH3106
passes AOS quality and reliability requirements.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AOH3106 combines advanced trench MOSFET technology with a low resistance
package to provide extremely low RDS(ON). This device is ideal for boost converters and
synchronous rectifiers for consumer, telecom, industrial power supplies and LED backlighting.
Detailed information refers to datasheet.
II. Die / Package Information:
AOH3106
Standard sub-micron
100V N channel
Package Type
SOT223
Lead Frame
Cu Alloy
Die Attach
Ag epoxy
Bonding
Au wire
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Process
Note * based on information provided by assembler and mold compound supplier
III. Result of Reliability Stress for AOH3106
Test Item
Test Condition
Time
Point
Lot
Attribution
Total
Sample
size
Number
of
Failures
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
[email protected]°c
HTGB
-
3 lots
495pcs
0
JESD22A113
Temp = 150 °c,
Vgs=100% of
Vgsmax
168hrs
500 hrs
1000 hrs
308pcs
0
1 lot
3 lots
JESD22A108
Temp = 150 °c,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
77pcs / lot
308pcs
0
1 lot
3 lots
JESD22A108
130 +/- 2°°c,
85%RH, 33.3 psi,
Vgs = 100% of
Vgs max
121°°c, 29.7psi,
RH=100%
100 hrs
(Note A*)
3 lots
77pcs / lot
165pcs
0
JESD22A110
96 hrs
(Note A*)
3 lots
55pcs / lot
165pcs
0
JESD22A102
-65°°c to 150°°c,
air to air
250 / 500
cycles
(Note A*)
3 lots
55pcs / lot
165pcs
0
JESD22A104
(Note A*)
55pcs / lot
(Note A*)
HTRB
HAST
Pressure Pot
Temperature
Cycle
Standard
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 7
MTTF = 17349 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AOH3106). Failure Rate Determination is based
on JEDEC Standard JESD 85. FIT means one failure per billion hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)]
9
= 1.83 x 10 / [2x (2x77x500+6x77x1000) x258] = 7
9
8
MTTF = 10 / FIT =1.52 x 10 hrs = 17349 years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
-5
K = Boltzmann’s constant, 8.617164 X 10 eV / K