Reliability Report

AOS Semiconductor
Product Reliability Report
AON7405,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
495 Mercury Drive
Sunnyvale, CA 94085
U.S.
Tel: (408) 830-9742
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AON7405.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AON7405
passes AOS quality and reliability requirements. The released product will be categorized by
the process family and be monitored on a quarterly basis for continuously improving the
product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AON7405 uses advanced trench technology to provide excellent RDS(ON) with low gate
charge. This device is ideal for load switch and battery protection applications.
-RoHS Compliant
-Halogen Free
Detailed information refers to datasheet.
II. Die / Package Information:
AON7405
Standard sub-micron
Low voltage P channel
Package Type
DFN 3.3x3.3
Lead Frame
Copper
Die Attach
Solder paste
Bonding Wire
Copper clip
Mold Material
Epoxy resin with silica filler
Flammability Rating
UL-94 V-0
Backside Metallization
Ti / Ni / Ag
MSL (moisture sensitive level) Level 1 based on J-STD-020
Process
Note * based on information provided by assembler and mold compound supplier
III. Result of Reliability Stress for AON7405
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
[email protected]°c
-
HTGB
Temp = 150 °c,
Vgs=100% of
Vgsmax
168hrs
500 hrs
1000 hrs
HTRB
Temp = 150 °c,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
HAST
130 +/- 2°°c,
85%RH, 33.3 psi,
Vgs = 80% of Vgs
max
121°°c, 29.7psi,
RH=100%
-65°°c to 150°°c,
air to air
250 / 500
cycles
Pressure Pot
Temperature
Cycle
Lot
Attribution
Total
Sample
size
Number
of
Failures
11 lots
1815pcs
0
JESD22A113
77pcs
0
JESD22A108
(Note A*)
1 lot
77pcs / lot
77pcs
0
JESD22A108
100 hrs
(Note A*)
11 lots
77pcs / lot
605pcs
0
JESD22A110
96 hrs
(Note A*)
11 lots
55 pcs / lot
605pcs
0
JESD22A102
(Note A*)
11 lots
55 pcs / lot
605pcs
0
JESD22A104
(Note A*)
55 pcs / lot
1 lot
Standard
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 137
MTTF = 833 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AON7405). Failure Rate Determination is based
on JEDEC Standard JESD 85. FIT means one failure per billion hours.
2
9
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10
9
6
MTTF = 10 / FIT = 7.30 x 10 hrs = 833 years
/ [2x2x77x168x258] = 137
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s )]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
K = Boltzmann’s constant, 8.617164 X 10-5eV / K