handling instruction

Handling Instructions
Instruction
for all flowSCREW
SCREW 4w package types:
flowSCREW4w, 2xflowSCREW4w,
SCREW4w, 3xflowSCREW4w
3x
Date:
23.06.2015
Revision:
Created by:
Zs. Gyimóthy
Rev. 04
Proprietary data, company confidential.
confidential All rights reserved.
Table of Contents
1
General instructions ................................................................
........................................................................................... 5
2
Specification for the driver PCB ................................................................
........................................... 6
2.1
Specification for modules with Press-fit
Press
pins ..........................................................
................................
7
2.2
Specification for modules with Press-fit
Press
pins
s that are soldered to the PCB ................. 8
3
Specifications for baseplate ................................................................
................................................. 8
4
Specifications for heat sink ................................................................
................................................. 9
5
Specification for thermal interface materials..........................................................
................................
9
5.1
OPTION 1: Thermal paste ................................................................
..................................................10
5.2
OPTION 2: Pre-applied
applied thermal interface material .................................................
................................
10
6
Specifications for fastening screws to the heat sink ...............................................
................................
10
7
Screw specification for fastening main terminals to bus bars ..................................
................................ 11
8
flowSCREW
SCREW 4w modules in parallel mode .............................................................
.............................12
8.1
Mounting the m4 hex nut holder for side connection .............................................
................................
12
8.2
Interconn PCB ................................................................................................
................................
..................................12
9
Press in process of modules with Press-fit
Press
pins .....................................................
................................
13
9.1
Press-in construction ................................................................
.........................................................................................13
9.1.1
Press-in tool................................................................................................
................................
.....................................14
9.1.2
Support plate ................................................................................................
................................
...................................14
9.2
Press-fit parameters ................................................................
.........................................................................................14
9.2.1
The basic requirement for the press in process .....................................................
................................
15
9.3
Process control parameters ................................................................
................................................15
9.4
Disassembling a driver PCB ................................................................
................................................16
10
Recommendation for soldering ................................................................
...........................................17
10.1
Wave soldering of modules with solder pins .........................................................
................................
17
10.2
Hand soldering parameters ................................................................
................................................17
11
Accessories and application support ................................................................
....................................18
12
ESD protection ................................................................................................
................................
.................................18
13
Environmental conditions ................................................................
...................................................18
13.1
Parameters of environment classes ................................................................
.....................................18
13.1.1
Climatic conditions ............................................................................................
................................
............................19
13.1.2
Biological conditions ................................................................
..........................................................................................19
13.1.3
Chemically active substances ................................................................
.............................................19
13.1.4
Mechanically active substances ................................................................
...........................................20
13.1.5
Mechanical Conditions ................................................................
.......................................................................................20
14
Disclaimer ................................................................................................
................................
.......................................21
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Table of Figures
Figure 1: Module with driver PCB and heat sink ................................................................
................................. 5
Figure 2: Height of the pinhead’s center line from the bottom of the baseplate ..................... 6
Figure 3: Recommended hole and cutout sizes on the driver PCB ........................................
................................
6
Figure 4: Chemical tin plating (for illustration only, no real proportions) ............................... 7
Figure 5: HAL tin plating (for illustration only, no real proportions) ......................................
................................
7
Figure 6: Scratch dimensions ................................................................
.......................................................................................... 8
Figure 7: Polished surface................................
...............................................................................................
............................... 9
Figure 8: Surface discoloration ................................................................
........................................................................................ 9
Figure 9: Fingerprint on the surface ................................................................
................................................. 9
Figure 10: Screw positions in sequence ................................................................
.......................................... 11
Figure 11: Mounting an M4 hex nut holder................................................................
...................................... 12
Figure 12: Interconn PCB .............................................................................................
................................
............................. 13
Figure 13: Recommended setup for press-fitting
press
.............................................................
............................. 13
Figure 14: Recommended dimensions for the press-in
press
tool ...............................................
................................
14
Figure 15: Press-in
in depth in PCB ................................................................
................................................... 15
Figure 16: Typical press-in
in diagram of a 20 pin module ....................................................
................................
16
Figure 17: Cutting edge ...............................................................................................
................................
............................... 16
Figure 18: Plated through hole, well soldered ................................................................
.................................. 17
Figure 19: Typical profile for wave soldering ................................................................
................................... 17
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Revision History
Date
Revision
Level
Description
Page
Number(s)
New template;
all;
23.06.2015
04
29.09.2014.
03
Remove section 5.2; Modification at section 5.1
14.05.2014
02
Remove section 6.2
20.02.2014
01
New document
Change/extend Sections: 2.1, 10.1, 13
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Zs. Gyimóthy
7, 17, 18
Rev. 04
page 4
1
General instructions
Figure 1 shows the basic structure of the flowSCREW 4w type module. It is attached to a heat
sink with the driver PCB that
hat is mounted on the top of the module. Electrical connections
between the module
e and driver PCB are soldered or press-fitted.
press fitted. Fasten main terminals to bus
bars using the screw types specified in section 7. The hex nut holders shown in Figure 1 are
used for applications where modules operate in multiphase systems or in parallel. An optional
connector PCB is available on demand for such applications. See section 9 for details.
details
Figure 1: Module with driver PCB and heat sink
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The distance between the top of the heat sink and the center plane of the driver PCB is
20.68 mm ±0.2 mm centered on the pinhead as shown in Figure 2.
Figure 2:: Height of the pinhead’s center line from the bottom of the baseplate
During PCB assembly,, do not pull or push auxiliary press-fit
fit or soldered pins more than
±0.2 mm, nor exert a force greater than 35 N except when press-fitting pins. Press-fit pins are
designed to prevent pin deformations
deformation greater than 0.1 mm when they are pressed in.
After mounting, pin tension may
m
not exceed ±5 N at a maximum substrate temperature of
100 C.
2
Specification for the driver PCB
•
Printed board material must comply with IEC 61249-2-7.
•
There
re is no limit as to the maximum number of conductive layers.
The driver PCB attaches to the module with four BN82428 type screws (D=2.5 mm and
L=6 mm). The recommended mounting torque is 0.4 Nm. Figure 3 shows the recommended
holes and cutouts on the driver PCB.
Figure 3:: Recommended hole and cutout sizes on the driver PCB
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2.1
•
•
•
•
Specification for modules with Press-fit
Press
pins
Printed board thickness must not be less than 1.6 mm (thinner PCBs require additional
testing and will be performed upon request).
PCB should be covered with solder mask on both sides.
Plated through-hole
hole specifications for Press-fit
Press
pin:
o Hole diameter before plating: 1.6 mm ± 0.025 mm
o Thickness of the PTH wall > 25 µm Cu
o Plated hole final dimension: 1.45 mm +0.09 mm / 0.06 mm
o Minimum Cu width of the annular ring > 0.1 mm
Plating material:
o for chemical tin plating (Sn): 0.5 µm to 10 µm
The PCB can be disassembled and reused 2 more times.
Figure 4:: Chemical tin plating (for illustration only, no real proportions)
o
for HAL tin plating (Sn): 0.5 µm to 50 µm
The PCB can be disassembled and reused 2 more times.
Figure 5:: HAL tin plating (for illustration only, no real proportions)
•
•
o Au: not generally released; individual release of PCB system required
Minimum distance between the edge of the PCB and the centre of the pin hole: 4 mm
Minimum distance between
een the centre of the pin hole and the component on the PCB:
4 mm
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2.2
Specification for modules with Press-fit
Press fit pins that are soldered to
the PCB
In cases where the Press-fit
fit pins are soldered instead of pressed into the PCB the
recommended PCB hole diameter is 1.85 mm ± 0.1 mm. In these cases, the annular ring must
be designed according to the standards for through hole components to ensure proper
soldering of the Press-fit pins.
Please read section 10 Recommendation for soldering also.
3
Specifications for baseplate
The thermal properties are not affected if the dimensions of the surface imperfections are
within the following values.
•
•
Polishing is allowed on the whole nickel plated surface if copper doesn’t become visible.
If copper becomes visible, the unit is scratched and following acceptance criteria should
be used. The depth and width of the scratch can’t exceed 200 µm and 800 µm,
respectively. The length of the scratch does not matter but the total area of scratches
must not exceed 5 % of the total substrate surface.
Discolorations and fingerprints are only surface imperfections
imperfections and do not affect the module's
functionality.
Substrate surface imperfections can be seen on the figures below.
Figure 6: Scratch dimensions
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Figure 7: Polished surface
Figure 8: Surface discoloration
Figure 9: Fingerprint on the surface
4
Specifications for heat sink
The whole heat sink surface under the module must be plane, clean and free of particles.
•
The flatness tolerance should be: <50 µm in general.
(A flatness tolerance specifies a tolerance zone defined by two parallel planes within
which the surface must lie.)
•
•
5
The surface roughness should be less than: Rz < 10 µm.
Heat sink surface imperfections should be within the values described for the module
baseplate surface (please refer to section 3 Specifications for baseplate).
baseplate
Specification for thermal interface materials
The recommended means of applying paste is screen printing. Thermal
hermal resistance (Rth)
increases if the paste is thicker than recommended. Modules are also available with phase
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change material (OPTION 2), whereby the Rthc-h is guaranteed, provided that the heat sink
specification remains
s unchanged.
5.1
OPTION 1: Thermal paste
A. Apply a homogeneous layer of thermal conductive paste over the whole backside of the
module, with a roller or spatula.
B. Apply thermal paste in a honeycomb pattern. The preferred technology for paste
application is screen printing. For a drawing of the pattern
pattern please contact your local sales
representative.
The recommended thermal paste thickness is 110 µm ± 15 µm
m in both cases.
Thermal paste thicker than recommended will increase thermal resistance (Rth).
5.2
OPTION 2: Pre-applied
applied thermal interface material
flowSCREW
SCREW 4w modules family is offered with pre-applied
pre applied phase change material as well.
(bottom surface of the module under the active area is covered with a honeycomb pattern).
In order to receive flowSCREW
SCREW 4w products with applied phase change material please
pleas write:
-/3/
at the end of the product ordering code.
Ordering example:
70-W212NMA600SC-M200P-/3/
/3/
6
Specifications for fastening screws to the heat sink
•
•
•
•
Screws
crews M5 (recommended screw type DIN 7984)
Flat washer D=max. 10 mm ISO 7092 (DIN 433)
Spring washer D=max. 10 mm DIN127 or DIN 128
Mounting torque: 4 Nm < Ma < 6 Nm
•
Thread length into the heat sink:
sink min. 9 mm (depending on the material
mat
properties of
the heat sink and screw)
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Tighten screws in the sequence given below and shown in Figure 10.
1) Attach the module loosely with two diagonal screws,
screws e.g. 1&3, 1&4
4 or 1&5.
1
2) Tighten screws with 0.5 Nm torque in the following sequence:
•
flowSCREW 4w:
screw 1 – 4 – 2 – 3
•
2x flowSCREW 4w: screw 2 – 5 – 1 – 6 – 3 – 4
•
3x flowSCREW 4w: screw 2 – 7 – 3 – 6 – 1 – 8 – 4 – 5
3) Tighten the screws with 5 Nm torque in the same sequence.
Figure 10: Screw positions in sequence
7
Screw specification for fastening main terminals to bus
bars
•
•
•
•
M6 screw: The threaded hole's
hole depth in the module is 12 mm max. from the main
terminal's topside. (See
See the package drawing for
or detailed dimensions.)
dimensions
Mounting torque: 2.5 Nm < Ma < 5 Nm
Flat washer: ISO 7092 (DIN 433)
Spring washer: DIN127 or DIN 128
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8
flowSCREW
SCREW 4w modules in parallel mode
8.1
Mounting the m4 hex nut holder for side connection
Push in the M4 hex nut-holders
holders from the side of the module and clip the mounting clips into
the PCB cutouts (see Figure 11). The shape of the cutout may vary for different PCB
thicknesses. M4 hex nut: The hole's depth in the holder is 8 mm max. from the module's
m
topside. (See the outline drawing for detailed dimensions.)
Figure 11: Mounting an M4 hex nut holder
8.2
Interconn PCB
If you wish to operate modules in parallel, mount an Interconn PCB to the side connectors (see
Figure 12) after the modules are attached to the heat sink. Use M4 hex nut holders with the
following components and torque to fasten it to modules' side connectors::
•
•
•
•
M4 screws
Mounting torque: 2 < Ma < 2.2 Nm
Flat washer: ISO 7092 (DIN 433)
Spring washer: DIN 127 or DIN 128
Please contact the local sales or distribution office to learn more about Interconn PCBs and
ordering codes.
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Figure 12: Interconn PCB
9
Press in process of modules with Press-fit
fit pins
9.1
Press-in
in construction
We recommend pressing the driver PCB onto the module from the top down as shown in Figure
13.
Figure 13: Recommended setup for press-fitting
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9.1.1
Press-in tool
Make sure the press-in tool is larger than the driver PCB.
PCB
•
The recommended diameter of holes/ cutouts for the pins is 1.7 mm to 4 mm,
depending on positioning accuracy,
accuracy as shown on Figure 14. Allow for at least 2 mm
supporting space
pace around the pin (Figure 14). An elongated cutout for several pins may
be made iff the pins are close together.
to
The PCB and module must also be positioned.
positioned
The size and position
ition of holes and cutouts will be determined by the components on the
PCB. Cutouts for pins are to be 6 mm deep.
Figure 14:
14 Recommended dimensions for the press-in tool
Recommended material for the press-in
press
tool:
•
•
9.1.2
•
•
9.2
•
•
Tempered aluminum alloy grade 7075-T6
7075
with 430 MPa
a yield strength and 160 HB
hardness or
Steel-grade
grade 21 MnCr 5 with 660 MPa yield strength and 330 HB or better hardness
Support plate
The support plate positions and supports the module during press-fitting
press fitting.
The recommended
ecommended material for the support plate is:
o ESD-proof
proof POM (polyoxymethylene) or any metal alloy
Press-fit
fit parameters
Press-in
in force: 90 N / pin – 150 N / pin
Press-in
in speed: 5 mm/s – 10 mm/sThe total press-in
in force depends on the number of
pins, hole diameter and plating (type/quality) of the PCB.
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9.2.1
The basic requirement for the press in process
The Press-fit
fit pins have to be pressed to the correct depth into the holes of the PCB. The center
of the Press-fit
fit pin head has to be at least 0.5 mm below the top surface and at least 0.5 mm
above the bottom surface of the PCB. (Figure
(
15).
Figure 15: Press-in depth in PCB
9.3
Process control parameters
If the press machine is equipped with the possibility to record the forceforce-stroke values during
the process, the following quality relevant values should be taken into consideration. Figure
16: Typical press-in
in diagram of a 20 pin module shows a normal press-in
in diagram.
Three different sections can be seen on the diagram:
•
•
•
First raising section (blue): The heads of the Press-fit
Press fit pins slide into the holes and
deform to fitt in the holes. This section ends with a local maximum.
Second section (green): The pin slides in the holes to reach the final position. The
centre of the pin heads are inside the holes and do not deform any longer. This section
ends with a local minimum.
Second raising section (red): press-in
press in tool touches the PCB and the sliding of the pins is
stopped. The press-in
in tool starts to bend the PCB.
The pressing-in
in has to be stopped at the beginning of the second raising section, not
exceeding the actual max force
ce of the first rising section, to avoid damaging the PCB or the
deformation of the plastic housing. The press-in
press in force or the motion stroke of the tool has to
be controlled to stop at the beginning of the second raising section.
Possible process control parameter
arameter settings are as follows:
•
•
The local maximum value (end of blue section) of the force-stroke
force stroke diagram has to be:
o higher than 90 N x number of the pins,
o smaller than 150 N x number of the pins.
These limits are marked on the diagram. If the press-in
press
force
orce does not fit in the interval
defined above, it can indicate faulty plating, or improper diameter of the holes.
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Figure 16:
16 Typical press-in diagram of a 20 pin module
9.4
Disassembling a driver PCB
If the driver PCB is no larger than the module,
module the PCB cannot be disassembled
disassemble by pressing it
out. In this case, the only way to remove the PCB is to cut the pin ends.
Manual disassembly with pliers is an option if
i the Press-fit
fit pinhead is overlapped by the PCB so
that the spring-end projects out of the PCB. Ensure you cut at level A as indicated in Figure 17
below where the two parts of the pinhead come together. Remove
emove the driver PCB from the
module after clipping off all pinheads.
Figure 17: Cutting edge
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10
Recommendation for soldering
Figure 18: Plated through hole, well soldered
Plated through holes should exhibit a vertical solder fill of 100 %, with a fully formed fillet on
the solder side and evidence of 100 % wetting on the component side lead, barrel and pad.
10.1
Wave soldering of modules with solder pins
T
T3
250 °C
K
s
2s
2
260 °C
150 °C
K
3
s
10 s
T2
T1
t1
t2 t3 t4
t
Figure 19: Typical profile for wave soldering
Soldering of certain modules with Press-fit
Press fit pins is also possible using the wave soldering
process. Wave soldering cannot be performed on all type of Press-fit
fit modules.
10.2
•
•
•
Hand soldering parameters
Max. solder iron temperature: 350 °C
Max. contact time with component lead: 10 s
Number of heat cycles: 3
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11
Accessories and application support
Vincotech offers the following application boards for products with flowSCREW
SCREW 4w packaging:
•
•
Interconn-M200-P2
P2 (mounted with 4 screws)
Interconn-M200-P4
P4 (mounted with 8 screws)
•
•
GD-M200-MASTER
MASTER (master driver board)
GD-M200-SLAVE
SLAVE (slave driver board)
Please contact the local sales or distribution office for samples of and documentation
ocumentation on these
adapter boards.
12
ESD protection
Modules are sensitive to electrostatic discharge which can damage or destroy sensitive
semiconductors. All modules are ESD protected in the shipment box by semi conductive plastic
trays. During the handling and assembly of the modules it is recommended to wear a
conductive grounded wrist band and ensure a conductive grounded working place.
The modules have the following ESD sensitivity levels according the ESD Association
classification:
ESD STM5.1-1998
998 Human Body Model:
Class 0
ESD STM5.2-1999
1999 Machine Model:
Class M1
ESD STM5.3.1-1999
1999 Charged Device Model:
Class C1
Please take into consideration the following standards for handling electrostatic-sensitive
electrostatic
devices: EN61340-5-1,
1, ANSI S20.20
13
Environmental
al conditions
The modules can be subjected to environmental conditions characterized by the following
classes:
Storage:
1K2 / 1B1 / 1C1 / 1S2 / 1M2
Transportation:
2K2 / 2B1 / 2C1 / 2S1 / 2M2
These classes are defined in the IEC 60721-3-1 and IEC 60721-3-2 standards. The modules
with Press-fit
fit pins have 2 years shelf life with the given storage conditions.
Flammability classification of the plastic material for all flowSCREW
SCREW 4w are V-0
V and 5-VA (selfextinguishing, no dripping of flaming particles) according
according to UL 94, IEC 60695-11-10 and
IEC 60695-11-20
20 test methods.
13.1
Parameters of environment classes
The parameters detailed below are for informative purposes only. This section does not
substitute the above mentioned standards. Please read the IEC 60721-3--1 and IEC 60721-3-2
standards for the description of the environment classes.
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13.1.1 Climatic conditions
1K2
Air temperature:
5 °C to 40 °C
Humidity:
5 % to 85 % RH but max. 1 g/m3 to 25 g/m3 absolute
Rate of change of temperature:
0.5 °C/min
Air pressure:
70 kPa to 106 kPa
Solar radiation:
700 W/m2
Movement of surrounding air:
1 m/s
Condensation:
No
Precipitation:
No
Water from other sources than rain:
No
Formation of ice and frost:
No
2K2
Temperature:
−25 °C to 60 °C
Change of temperature air/air:
±25 °C
Relative
e humidity not combined
with rapid temperature changes:
max. 75 % (at 30 °C temperature)
Relative humidity combined
with rapid temperature changes:
No
Low air pressure:
70 kPa
Change of air pressure:
No
Solar radiation:
700 W/m2
Movement of surrounding air:
No
Precipitation:
No
Heat radiation:
No
Water from other sources than rain:
No
Wetness:
No
13.1.2 Biological conditions
1B1
Flora and fauna:
Negligible
2B1
Flora and fauna:
No
13.1.3 Chemically active substances
1C1
Sea and road salts:
No (Salt mist may be present in sheltered locations of coastal areas.)
Sulphur dioxide:
0.1 mg/m3
Hydrogen sulphide:
0.01 mg/m3
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Chlorine:
0.01 mg/m3
Hydrogen chloride:
0.01 mg/m3
Hydrogen fluoride:
0.003 mg/m3
Ammonia:
0.3 mg/m3
Ozone:
0.01 mg/m3
Nitrogen oxides:
0.1 mg/m3 (Expressed in equivalent values of Nitrogen dioxide.)
2C2
Sea salts:
none
Sulphur dioxide:
0.1 mg/m3
Hydrogen sulphide:
0.01 mg/m3
Nitrogen oxides:
0.1 mg/m3 (Expressed in the equivalent values of Nitrogen dioxide.)
Ozone:
0.01 mg/m3
Hydrogen chloride:
0.1 mg/m3
Hydrogen fluoride:
0.003 mg/m3
Ammonia:
0.3 mg/m3
13.1.4 Mechanically active substances
1S2
Sand:
30 mg/m3
Dust (suspension):
0.2 mg/m3
Dust (sedimentation):
1.5 mg/(m2h)
2S1
Sand in air:
No
Dust (sedimentation):
No
13.1.5 Mechanical Conditions
1M2
Stationary vibration, sinusoidal
Frequency range:
displacement amplitude:
Frequency range:
peak acceleration:
2 Hz to 9 Hz
1.5 mm
9 Hz to 200 Hz
5 m/s2
Non stationary vibration, including shock
Shock response spectrum type L
peak acceleration:
40 m/s2
Static load:
5 kPa
2M2
Stationary vibration, sinusoidal
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Frequency range:
2 Hz to 9 Hz
displacement amplitude:
3.5 mm
Frequency range:
peak acceleration:
9 Hz to 200 Hz
10 m/s2
Frequency range:
peak acceleration:
200 Hz to 500 Hz
15 m/s2
Stationary vibration, random
Acceleration
spectral density:
1 m2/s3
Frequency range:
10 Hz to 200 Hz
and
Acceleration
spectral density:
0.3 m2/s3
Frequency range:
200 Hz to 2000 Hz
The later range can be neglected transporting with vehicles with high damping.
Non stationary vibration, including shock
Shock response spectrum type I.
peak acceleration:
100 m/s2
and
Shock response spectrum type II.
peak acceleration:
300 m/s2
Free fall
1.2 m (mass of the object is less than or equal to 20 kg)
or
1 m (mass of the object is between 20 kg and 100 kg)
or
0.25 m (mass of the object is higher than or equal to 100 kg)
Toppling
Around any of the edges.
Rolling, pitching
Angle:
±35°
Period:
8s
35° may occur for short time periods but 22.5° may persist permanently.
Acceleration
Static load
14
20 m/s2
10 kPa
Disclaimer
The information and recommendations in this document are based on standards and common
engineering practices. Customer specific applications and specifications may require additional
add
processes and tests that may supersede those recommended in this
this document.
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