Handling Instructions for flow 0B packages This document is valid for all type of flow 0B modules with solder pins Date: 05.06.2015 Revision: Created by: Zs. Gyimóthy Rev. 03 Proprietary data, company confidential. All rights reserved. Table of Contents 1 General assembly instructions ............................................................................. 5 2 Specification for PCBs......................................................................................... 6 2.1 Specification for modules with solder pins ............................................................. 6 2.2 Required PCB cutouts for screwing holes .............................................................. 7 3 Specification for module backside surface ............................................................. 8 4 Specification for heat sink ................................................................................... 9 5 Specification for thermal interface materials.........................................................10 5.1 OPTION 1: Thermal paste: .................................................................................10 5.2 OPTION 2: Thermal foil: ....................................................................................10 5.3 OPTION 3: Pre-applied thermal interface material .................................................11 6 Specification for fastening screws to the heat sink ................................................11 6.1 Screw with pre-assembled washers .....................................................................11 7 Recommendation for soldering ...........................................................................12 7.1 Wave soldering of modules with solder pins .........................................................12 7.2 Hand soldering parameters ................................................................................12 8 ESD protection .................................................................................................13 9 Environmental conditions ...................................................................................13 9.1 Vibration resistance ..........................................................................................13 9.2 Parameters of environment classes .....................................................................13 9.2.1 Climatic conditions ............................................................................................13 9.2.2 Biological conditions ..........................................................................................14 9.2.3 Chemically active substances .............................................................................14 9.2.4 Mechanically active substances ...........................................................................15 9.2.5 Mechanical Conditions .......................................................................................15 10 Disclaimer .......................................................................................................16 05.06.2015 Zs. Gyimóthy Rev. 03 page 2 Table of Figures 1. Figure: Module with PCB and heat sink ......................................................................... 5 2. Figure: Solder pin diameter......................................................................................... 6 3. Figure: PCB cutouts for two-clip modules with solder pins ............................................... 7 4. Figure: Scratch and etching hole dimensions ................................................................. 8 5. Figure: Polished surface.............................................................................................. 8 6. Figure: Discoloration of substrate ................................................................................ 9 7. Figure: Fingerprint on the surface ................................................................................ 9 8. Figure: Thermal paste honeycomb pattern .................................................................. 10 9. Figure: Recommended thermal foil dimensions ............................................................ 10 10. Figure: Plated through hole, good soldering .............................................................. 12 26. Figure: Typical profile for wave soldering .................................................................. 12 05.06.2015 Zs. Gyimóthy Rev. 03 page 3 Revision History Date Revision Level Description 12.11.2013 01 New document 04.07.2014 02 Change on housing design 05.06.2015 03 Change format; change preliminary to final ver. 05.06.2015 Page Number(s) 3,4,5 Zs. Gyimóthy all Rev. 03 page 4 1 General assembly instructions The flow0B type modules have to be mounted first to PCB, and afterwards fixed to heat sink. The electrical connections between module and PCB are made by soldering. It is also required to fix the PCB to the heat sink with threaded spacers. The number and the position of the fixing points depend on the design of the circuit and location of different masses like capacitors or inductors and the environment of the system. General recommendation cannot be given. The recommended height of the spacers is: 17-0.1 mm. PCB Module Module backside Heat sink 1. Figure: Module with PCB and heat sink During assembly the pins are not to be drawn or pushed more than ±0.2 mm or loaded with a force bigger than 35 N. The tension of the pin must not exceed ±5 N at a maximum substrate temperature of 100 C. 05.06.2015 Zs. Gyimóthy Rev. 03 page 5 2 Specification for PCBs 2.1 Printed board material meets the requirements of IEC 61249-2-7; The number of conductive layers is not limited. Specification for modules with solder pins The module must be fixed to the PCB with 2 screws (type BN82428, D=2.5 mm and L=6 mm) before soldering the pins into the PCB. Mounting torque: 0.4 Nm. After screwing, all pins must be soldered into the PCB. The hole diameters on the PCB has to be designed according to the soldering pin diameter which is 1±0.05 mm. For further dimensions or 3D model please contact your local sales manager. 2. Figure: Solder pin diameter 05.06.2015 Zs. Gyimóthy Rev. 03 page 6 2.2 Required PCB cutouts for screwing holes 3. Figure: PCB cutouts for two-clip modules with solder pins In the keepout area it is not allowed to be any PCB component between module and PCB. 05.06.2015 Zs. Gyimóthy Rev. 03 page 7 3 Specification for module backside surface The thermal properties are not affected if the dimensions of the surface imperfections are within the following values. Polishing is allowed on the whole nickel plated surface if copper doesn’t become visible. If copper becomes visible, the unit is scratched and the following acceptance critera should be used. The depth and width of the scratch can’t exceed 200 μm and 800 μm, respectively. The length of the scratch does not matter but the total area of scratches must not exceed 5 % of the total substrate surface. The diameter and depth of etching holes have to be below 1000 μm and 200 μm, respectively. 4. Figure: Scratch and etching hole dimensions 5. Figure: Polished surface 05.06.2015 Zs. Gyimóthy Rev. 03 page 8 6. Figure: Discoloration of substrate 7. Figure: Fingerprint on the surface 4 Specification for heat sink The whole heat sink surface under the module must be plane, clean and free of particles. The flatness tolerance should be: < 25 µm in general. In case the thermal paste thicker than 50 µm the flatness tolerance can be < 50 µm. (A flatness tolerance specifies a tolerance zone defined by two parallel planes within which the surface must lie.) The surface roughness should be less than: Rz < 10 µm. Heat sink surface imperfections should be within the values described for the module backside surface (please refer to section 3). 05.06.2015 Zs. Gyimóthy Rev. 03 page 9 5 Specification for thermal interface materials 5.1 OPTION 1: Thermal paste: A. Apply a homogeneous layer of thermal conductive paste over the whole backside of the module, with a roller or spatula. B. Apply thermal paste in a honeycomb pattern, seen on 8. Figure:. The preferred technology for paste application is screen printing. For a drawing of the pattern please contact your local sales representative. The recommended thermal paste thickness is 55 µm ± 15 µm in this case. Thermal paste thicker than recommended will increase thermal resistance ( Rth). 8. Figure: Thermal paste honeycomb pattern 5.2 OPTION 2: Thermal foil: A thermal foil comprising of an aluminium core layer and two outer layers of phase change material should be used. The total thickness of the foil has to be less than 80 µm. Thicker foils could cause the ceramic substrate to break and increase the thermal resistance. Recommended foil type: Kunze Folien KU-ALC5 or ALF5 Recommended foil dimensions: see below. 9. Figure: Recommended thermal foil dimensions The thickness of the foil is less than 80 µm. Material of the foil is aluminum, covered with a phase change material. 05.06.2015 Zs. Gyimóthy Rev. 03 page 10 5.3 6 OPTION 3: Pre-applied thermal interface material The modules may have already been pre-printed with thermal interface material. Specification for fastening screws to the heat sink Screws M4 (recommended screw type DIN 7984) Min. depth of the screw in the heat sink: 6 mm Flat washer ISO 7092 (DIN 433) Spring washer DIN127 or DIN 128 Mounting torque: 2 Nm < Ms < 2.2 Nm A torque wrench shall be used to tighten the mounting screws at the specified torque as excessive torque may result in damage or degradation of the device. The inaccuracy of torque wrench tightening method can range up to ±12 %. This has to be taken into account to prevent over-tightening the fastener. Due to excessive temperature fluctuations washers should be used to prevent the loosening of the screws. After accurate tightening of the screws the spring washer exerts a constant force on the joint. The flat washer distributes this force on the plastic surface. 6.1 Screw with pre-assembled washers Screws with pre-assembled washers (SEMS or kombi screws) combine the screw and the washers into a single component. These screws eliminate the need to slip the washers into place by hand, boosting the speed and efficiency of the assembly process. The specifications of these screws are provided below: Screw size M4 according to DIN 6900 (ISO 10644; JIS B1188) Flat washer according to DIN 6902 Type C (ISO 10673 Type S; JIS B1256) Split lock spring washer according to DIN 6905 (JIS B1251) Mounting torque range: 2 Nm < Ms < 2.2 Nm 05.06.2015 Zs. Gyimóthy Rev. 03 page 11 7 Recommendation for soldering 10. Figure: Plated through hole, good soldering Plated through holes should exhibit a vertical solder fill of 100 %, with a fully formed fillet on the solder side and evidence of 100 % wetting on the component side lead, barrel and pad. 7.1 Wave soldering of modules with solder pins T T3 250 °C < 𝑇3 < 260 °C 𝑇3 − 𝑇2 < 150 °C K 𝑇2 − 𝑇1 K 2 < <3 s 𝑡2 − 𝑡1 s 2 s < 𝑡4 − 𝑡3 < 10 s T2 T1 t1 t2 t3 t4 t 11. Figure: Typical profile for wave soldering Soldering of certain modules with Press-fit pins is also possible using the wave soldering process. Wave soldering cannot be performed on all type of Press-fit modules. 7.2 Hand soldering parameters Max. solder iron temperature: 350 °C Max. contact time with component lead: 10 s Number of heat cycles: 3 05.06.2015 Zs. Gyimóthy Rev. 03 page 12 8 ESD protection Modules are sensitive to electrostatic discharge which can damage or destroy sensitive semiconductors. All modules are ESD protected in the shipment box by semi conductive plastic trays. During the handling and assembly of the modules it is recommended to wear a conductive grounded wrist band and ensure a conductive grounded working place. The modules have the following ESD sensitivity levels according the ESD Association classification: ESD STM5.1-1998 Human Body Model: Class 0 ESD STM5.2-1999 Machine Model: Class M1 ESD STM5.3.1-1999 Charged Device Model: Class C1 Please take into consideration the following standards for handling electrostatic-sensitive devices: EN61340-5-1, ANSI S20.20 9 Environmental conditions The modules can be subjected to environmental conditions characterized by the following classes: Storage: 1K2 / 1B1 / 1C1 / 1S2 / 1M2 Transportation: 2K2 / 2B1 / 2C1 / 2S1 / 2M2 These classes are defined in the IEC 60721-3-1 and IEC 60721-3-2 standards. The modules with wire pins have 1 year shelf life and the modules with Press-fit pins have 2 years shelf life with the given storage conditions. Flammability classification of the plastic material for flow 1B are V-0 and 5-VA (selfextinguishing, no dripping of flaming particles) according to UL 94, IEC 60695-11-10 and IEC 60695-11-20 test methods. 9.1 Vibration resistance In addition to the vibration parameters defined in 1M2 and 2M2 classes, the flow 1 package modules are qualified with the environmental test in accordance to the standard IEC 60068-2-6:2007 standard with the following severity: Frequency range: displacement amplitude: Frequency range: peak acceleration: Duration: Number of axes: 10 Hz to 26.6 Hz 3.5 mm (7 mm peak-to-peak) 26.6 Hz to 500 Hz 10 G (98.1 m/s2) 2 hours 3 These parameters are more severe than the parameters of the 1M2 and 2M2 classes. 9.2 Parameters of environment classes The parameters detailed below are for informative purposes only. This section does not substitute the above mentioned standards. Please read the IEC 60721-3-1 and IEC 60721-3-2 standards for the description of the environment classes. 9.2.1 Climatic conditions 05.06.2015 Zs. Gyimóthy Rev. 03 page 13 1K2 Air temperature: 5 °C to 40 °C Humidity: 5 % to 85 % RH but max. 1 g/m3 to 25 g/m3 absolute Rate of change of temperature: 0.5 °C/min Air pressure: 70 kPa to 106 kPa Solar radiation: 700 W/m2 Movement of surrounding air: 1 m/s Condensation: No Precipitation: No Water from other sources than rain: No Formation of ice and frost: No 2K2 Temperature: −25 °C to 60 °C Change of temperature air/air: ±25 °C Relative humidity not combined with rapid temperature changes: max. 75 % (at 30 °C temperature) Relative humidity combined with rapid temperature changes: No Low air pressure: 70 kPa Change of air pressure: No Solar radiation: 700 W/m2 Movement of surrounding air: No Precipitation: No Heat radiation: No Water from other sources than rain: No Wetness: No 9.2.2 Biological conditions 1B1 Flora and fauna: Negligible 2B1 Flora and fauna: 9.2.3 No Chemically active substances 1C1 Sea and road salts: No (Salt mist may be present in sheltered locations of coastal areas.) Sulphur dioxide: 0.1 mg/m3 Hydrogen sulphide: 0.01 mg/m3 Chlorine: 0.01 mg/m3 05.06.2015 Zs. Gyimóthy Rev. 03 page 14 Hydrogen chloride: 0.01 mg/m3 Hydrogen fluoride: 0.003 mg/m3 Ammonia: 0.3 mg/m3 Ozone: 0.01 mg/m3 Nitrogen oxides: 0.1 mg/m3 (Expressed in equivalent values of Nitrogen dioxide.) 2C2 Sea salts: none Sulphur dioxide: 0.1 mg/m3 Hydrogen sulphide: 0.01 mg/m3 Nitrogen oxides: 0.1 mg/m3 (Expressed in the equivalent values of Nitrogen dioxide.) Ozone: 0.01 mg/m3 Hydrogen chloride: 0.1 mg/m3 Hydrogen fluoride: 0.003 mg/m3 Ammonia: 0.3 mg/m3 9.2.4 Mechanically active substances 1S2 Sand: 30 mg/m3 Dust (suspension): 0.2 mg/m3 Dust (sedimentation): 1.5 mg/(m2h) 2S1 Sand in air: No Dust (sedimentation): No 9.2.5 Mechanical Conditions 1M2 Stationary vibration, sinusoidal Please see section 9.1. Non stationary vibration, including shock Shock response spectrum type L peak acceleration: 40 m/s2 Static load: 5 kPa 05.06.2015 Zs. Gyimóthy Rev. 03 page 15 2M2 Stationary vibration sinusoidal Please see section 9.1. Stationary vibration, random Acceleration spectral density: 1 m2/s3 Frequency range: 10 Hz to 200 Hz and Acceleration spectral density: 0.3 m2/s3 Frequency range: 200 Hz to 2000 Hz The later range can be neglected transporting with vehicles with high damping. Non stationary vibration, including shock Shock response spectrum type I. peak acceleration: 100 m/s2 and Shock response spectrum type II. peak acceleration: 300 m/s2 Free fall 1.2 m (mass of the object is less than or equal to 20 kg) or 1 m (mass of the object is between 20 kg and 100 kg) or 0.25 m (mass of the object is higher than or equal to 100 kg) Toppling Around any of the edges. Rolling, pitching Angle: ±35° Period: 8s 35° may occur for short time periods but 22.5° may persist permanently. Acceleration 20 m/s2 Static load: 10 kPa 10 Disclaimer The information and recommendations in this document are based on standards and common engineering practices. Customer specific applications and specifications may require additional processes and tests than may differ of supersede those recommended in this document. 05.06.2015 Zs. Gyimóthy Rev. 03 page 16