Data Sheet

INTEGRATED CIRCUITS
DATA SHEET
TDA3608Q; TDA3608TH
Multiple voltage regulators with
switch
Product specification
Supersedes data of 2001 Jun 29
2003 Nov 28
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
• Delayed foldback current limit protection for power
switch (at short-circuit); delay time fixed by reset delay
capacitor
FEATURES
General
• Two VP-state controlled regulators (regulator 1 and
regulator 3) and a power switch
• All regulator outputs and power switch are
DC short-circuited safe to ground and VP.
• Regulator 2 and reset circuit operate during load dump
and thermal shutdown
GENERAL DESCRIPTION
• Separate control pins for switching regulator 1,
regulator 3 and power switch
The TDA3608 is a multiple output voltage regulator with a
power switch, intended for use in car radios with or without
a microcontroller. It contains:
• Supply voltage range from −18 to +50 V
• Low reverse current of regulator 2
• Two fixed output voltage regulators with a foldback
current protection (regulator 1 and regulator 3) and one
fixed output voltage regulator (regulator 2) intended to
supply a microcontroller, which also operates during
load dump and thermal shutdown
• Low quiescent current (when regulator 1, regulator 3
and power switch are switched off)
• Hold output circuit for regulator 1 (only valid when
regulator 3 output voltage >1.3 V)
• A power switch with protections, operated by an enable
input
• Reset and hold outputs (open-collector outputs)
• Adjustable reset delay time
• Reset and hold outputs that can be used to interface
with the microcontroller; the reset output can be used to
call up the microcontroller and the hold output indicates
that the regulator 1 output voltage is available and within
the range
• High ripple rejection
• Backup capacitor connection to supply regulator 2 and
reset circuit up to 25 V.
Protections
• A supply pin which can withstand load dump pulses and
negative supply voltages
• Reverse polarity safe (down to −18 V without high
reverse current)
• Regulator 2 which is switched on at a backup voltage
higher than 6.5 V and switched off when the regulator 2
output drops below 1.9 V
• Able to withstand voltages up to 18 V at the outputs
(supply line may be short circuited)
• A provision for the use of a reserve (backup) supply
capacitor that will hold enough energy for regulator 2
(5 V continuous) to allow a microcontroller to prepare for
loss of voltage.
• ESD protection on all pins
• Thermal protection
• Load dump protection
• Foldback current limit protection for regulator 1,
regulator 2 and regulator 3
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA3608Q
DBS13P
plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
TDA3608TH
HSOP20
plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
2003 Nov 28
2
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP
supply voltage
Iq
quiescent supply current
Tj
junction temperature
operating
9.5
14.4
18
V
regulator 2 on
2.4
14.4
18
V
reverse polarity; non-operating
−
−
−18
V
jump start for t ≤ 10 minutes
−
−
30
V
load dump protection for
t ≤ 50 ms and tr ≥ 2.5 ms
−
−
50
V
standby mode; VP = 12.4 V
−
500
600
µA
−40
−
+150
°C
Voltage regulators
VREG1
output voltage of regulator 1
1 mA ≤ IREG1 ≤ 600 mA
8.15
8.5
8.85
V
VREG2
output voltage of regulator 2
0.5 mA ≤ IREG2 ≤ 150 mA
4.75
5.0
5.25
V
VREG3
output voltage of regulator 3
1 mA ≤ IREG3 ≤ 400 mA
4.75
5.0
5.25
V
Vdrop
dropout voltage
ISW = 1 A
−
0.45
0.7
V
ISW = 1.8 A
−
1.0
1.8
V
IM
peak current
2
−
−
A
Power switch
2003 Nov 28
3
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
BLOCK DIAGRAM
handbook, full pagewidth
(14.4 V)
VP
ENSW
POWER SWITCH
1 (3)
7 (10)
(17) 13 SW
(14.2 V/1.8 A)
TEMPERATURE
AND LOAD DUMP
PROTECTION
&
BACKUP SWITCH
(16) 12 BU
(14.2 V/100 mA)
BACKUP CONTROL
REGULATOR 2
REGULATOR 3
&
EN3
REG2
(5) 3
REG3
(4) 2
REG1
(11) 8
HOLD
REGULATOR 1
6 (9)
hold enable
TDA3608Q
(TDA3608TH)
CRES
(8) 5
9 (12)
(1, 2, 7, 13, 18, 19, 20)
10 (14)
GND
n.c.
Numbers in parenthesis refer to type number TDA3608TH.
Fig.1 Block diagram.
2003 Nov 28
(5 V/150 mA)
(5 V/400 mA)
4 (6)
&
EN1
(15) 11
4
MGK602
RES
(8.5 V/600 mA)
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
PINNING
PIN
SYMBOL
DESCRIPTION
TDA3608Q
TDA3608TH
VP
1
3
supply voltage
REG1
2
4
regulator 1 output
REG3
3
5
regulator 3 output
EN3
4
6
regulator 3 enable input
RES
5
8
reset output
EN1
6
9
regulator 1 enable input
ENSW
7
10
power switch enable input
HOLD
8
11
hold output
CRES
9
12
reset delay capacitor connection
GND
10
14
ground
REG2
11
15
regulator 2 output
BU
12
16
backup capacitor connection
SW
13
17
power switch output
n.c.
−
1, 2, 7, 13, 18,19 not connected
and 20
handbook, halfpage
VP
1
REG1
2
REG3
3
EN3
4
RES
5
EN1
6
ENSW
7
HOLD
8
CRES
9
handbook, halfpage
1 n.c.
n.c. 19
2 n.c.
n.c. 18
3 VP
SW 17
4 REG1
BU 16
TDA3608Q
5 REG3
TDA3608TH
GND 10
REG2
n.c. 20
11
REG2 15
6 EN3
GND 14
7 n.c.
n.c. 13
8 RES
CRES 12
9 EN1
HOLD 11
BU 12
10 ENSW
MGT566
SW 13
MGK601
Fig.2 Pin configuration of TDA3608Q.
2003 Nov 28
Fig.3 Pin configuration of TDA3608TH.
5
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
FUNCTIONAL DESCRIPTION
TDA3608Q; TDA3608TH
The hold output is only activated when VREG3 > 1.3 V.
When pin HOLD is connected via a pull-up resistor to the
output of regulator 3 spikes will be minimized to 1.3 V
(maximum value) because the hold output is only disabled
when VREG3 < 1.3 V.
The TDA3608 is a multiple output voltage regulator with a
power switch, intended for use in car radios with or without
a microcontroller. Because of low-voltage operation of the
car radio, low-voltage drop regulators are used in the
TDA3608.
Pin HOLD will be forced LOW when the load dump
protection is activated and also in the standby mode.
Backup supply
Power switch
The charge of the backup capacitor connected to pin BU
can be used to supply regulator 2 for a short period when
the supply voltage VP drops to 0 V (the time depends on
the value of the capacitor).
The power switch can be controlled by means of enable
pin ENSW (see Fig.6).
Protections
Regulator 1
All output pins are fully protected.
When the output voltage of regulator 2 and the supply
voltage (VP > 4.5 V) are both available, regulator 1 can be
operated by means of enable pin EN1 (see Fig.4).
The regulators are protected against load dump
(regulator 1 and regulator 3 switch off at VP > 18 V) and
short-circuit (foldback current protection).
Regulator 2
The power switch contains a foldback current protection,
but this protection is delayed at a short-circuit condition by
the reset delay capacitor. During this time the output
current is limited to at least 2 A (peak value) and
1.8 A (continuous value) at VP ≤ 18 V. During the foldback
mode the current is limited to 0.5 A (typical value).
Regulator 2 switches on (see Fig.5) when the backup
voltage exceeds 6.5 V for the first time and switches off
when the output voltage of regulator 2 drops below 1.9 V
(this is far below an engine start).
Regulator 3
The timing diagram is shown in Fig.7.
When the output voltage of regulator 2 and the supply
voltage (VP > 4.5 V) are both available, regulator 3 can be
operated by means of enable pin EN3 (see Fig.4).
The foldback protection is activated when VSW < 4 V.
When regulator 2 is out-of-regulation and generates a
reset, the power switch is in the foldback mode
immediately when VSW < 4 V.
Reset
In the standby mode the voltage on the reset delay
capacitor is about 4 V and the voltage on the power switch
output is VP − 0.45 V (typical value) at ISW = 1 A. During
an overload condition or short-circuit the reset delay
capacitor will be charged to a higher voltage. The power
switch is in the high current mode while the capacitor is
charged, after this the switch is in the foldback mode
(VSW < 4 V). While the reset delay capacitor is charged the
power switch output can reach its correct output voltage.
Now the voltage on the reset delay capacitor is decreased
rapidly to 4 V. The reset output voltage is not influenced by
this change of voltages. The time of the high current mode
depends on the value of the reset delay capacitor.
When regulator 2 is switched on and the output voltage of
this regulator is within its voltage range, the reset output
(see Fig.5) will be enabled (pin RES goes HIGH through
an external pull-up resistor) to generate a reset to the
microcontroller.
The reset cycles can be extended by means of an external
capacitor connected to pin CRES. This start-up feature is
included to secure a smooth start-up of the microcontroller
at first connection, without uncontrolled switching of
regulator 2 during the start-up sequence.
Hold
At VP > 18 V the power switch is clamped at maximum
17.2 V (to avoid that external connected circuitry is being
damaged by an overvoltage) and the power switch will
switch off at load dump.
Regulator 1 has an open-collector hold output (see Fig.4)
indicating that the output voltage is settled at 8.5 V.
Pin HOLD is held HIGH by an external pull-up resistor.
When the supply voltage VP drops or during high load, the
output voltage drops out-of-regulation and pin HOLD goes
LOW.
2003 Nov 28
6
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
handbook, full pagewidth
TDA3608Q; TDA3608TH
load dump
18.0 V
9.5 V
4.5 V
4.0 V
VP
≥2.2 V
enable
regulator 1 ≤2.0 V
8.5 V
regulator 1
0V
≥2.2 V
enable
regulator 3 ≤2.0 V
5.0 V
regulator 3
0V
hold output
MGT568
Fig.4 Timing diagram of regulator 1, regulator 3 and hold output.
handbook, full pagewidth
load dump
18.0 V
VP
4.0 V
backup
6.5 V
5.4 V
regulator 2
5.0 V
1.9 V
0V
reset
delay
capacitor
5.0 V
3.0 V
0V
reset
output
5.0 V
MGT567
t d(res)
Fig.5 Timing diagram of backup, regulator 2 and reset output.
2003 Nov 28
7
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
handbook, full pagewidth
TDA3608Q; TDA3608TH
load dump
18.0 V
VP
4.5 V
4.0 V
enable
power
switch
≥2.2 V
≤2.0 V
16.2 V
power
switch
output
0V
MGT569
Fig.6 Timing diagram of power switch output.
handbook, full pagewidth
regulator 2
5V
t d(sw)
t d(res)
6.4 V
reset
delay
voltage
4V
3V
0V
reset
output
5V
enable
power
switch
> 2.2 V
power
switch
voltage
0V
< 2.0 V
14 V
4V
0V
2A
power
switch
current
0.5 A
0A
foldback mode
foldback mode
current limit mode
MGT570
Fig.7 Timing diagram of current protection of power switch.
2003 Nov 28
8
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VP
PARAMETER
supply voltage
CONDITIONS
MIN.
MAX.
UNIT
operating
−
18
V
reverse polarity; non-operating
−
−18
V
jump start for t ≤ 10 minutes
−
30
V
load dump protection for t ≤ 50 ms and
tr ≥ 2.5 ms
−
50
V
−
62
W
Ptot
total power
dissipation
Tstg
storage temperature
non-operating
−55
+150
°C
Tamb
ambient temperature
operating
−40
+85
°C
Tj
junction temperature
operating
−40
+150
°C
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-c)
Rth(j-a)
PARAMETER
CONDITIONS
VALUE
UNIT
thermal resistance from junction to case
TDA3608Q
2
K/W
TDA3608TH
3.5
K/W
50
K/W
thermal resistance from junction to ambient
in free air
CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; measured in test circuit of Fig.12; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP
Iq
supply voltage
quiescent supply
current
operating
9.5
14.4
18
V
regulator 2 on; note 1
2.4
14.4
18
V
jump start for t ≤ 10 minutes
−
−
30
V
load dump protection for
t ≤ 50 ms and tr ≥ 2.5 ms
−
−
50
V
VP = 12.4 V
−
500
600
µA
VP = 14.4 V
−
520
−
µA
standby mode; note 2
Schmitt trigger supply voltage for regulator 1, regulator 3 and power switch
Vthr
rising threshold
voltage
4.0
4.5
5.0
V
Vthf
falling threshold
voltage
3.5
4.0
4.5
V
Vhys
hysteresis voltage
−
0.5
−
V
6.0
6.5
7.1
V
Schmitt trigger supply voltage for regulator 2
Vthr
rising threshold
voltage
2003 Nov 28
9
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
SYMBOL
PARAMETER
CONDITIONS
TDA3608Q; TDA3608TH
MIN.
TYP.
MAX.
UNIT
Vthf
falling threshold
voltage
1.7
1.9
2.2
V
Vhys
hysteresis voltage
−
4.6
−
V
Schmitt trigger voltage for enable input (regulator 1, regulator 3 and power switch)
Vthr
rising threshold
voltage
1.7
2.2
2.7
V
Vthf
falling threshold
voltage
1.5
2.0
2.5
V
Vhys
hysteresis voltage
IREG = ISW = 1 mA
0.1
0.2
0.5
V
ILI
input leakage current
VEN = 5 V
1
5
10
µA
Schmitt trigger voltage for reset
Vthr
rising threshold
voltage of regulator 2
VP rising; IREG2 = 50 mA; note 3 −
VREG2 − 0.15
VREG2 − 0.075 V
Vthf
falling threshold
voltage of regulator 2
VP falling; IREG2 = 50 mA; note 3 4.3
VREG2 − 0.35
−
V
Vhys
hysteresis voltage
0.1
0.2
0.3
V
Schmitt trigger voltage for hold
Vthr
rising threshold
voltage of regulator 1
VP rising; note 3
−
VREG1 − 0.15
VREG1 − 0.075 V
Vthf
falling threshold
voltage of regulator 1
VP falling; note 3
7.7
VREG1 − 0.35
−
V
Vhys
hysteresis voltage
0.1
0.2
0.3
V
Reset and hold output
IsinkL
LOW-level sink
current
Vo ≤ 0.8 V
2
−
−
mA
ILO
output leakage
current
Vo = 5 V; VP = 14.4 V
−
−
2
µA
tr
rise time
note 4
−
7
50
µs
tf
fall time
note 4
−
1
50
µs
2
3
4
µA
Reset delay capacitor circuit
Ich
charge current
Idch
discharge current
500
800
−
µA
Vthr(res)
rising threshold
voltage for delayed
reset pulse
2.8
3.0
3.2
V
Vthr(sw)
rising threshold
note 5
voltage for delayed
power switch foldback
mode
−
6.4
−
V
td(res)
reset delay time
32
47
70
ms
2003 Nov 28
C7 = 47 nF; note 6
10
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
SYMBOL
PARAMETER
CONDITIONS
TDA3608Q; TDA3608TH
MIN.
TYP.
MAX.
UNIT
Regulator 1; IREG1 = 5 mA; unless otherwise specified
VREG1(off)
output voltage with
regulator off
VREG1
output voltage
−
1
400
mV
1 mA ≤ IREG1 ≤ 600 mA
8.15
8.5
8.85
V
9.5 V ≤ VP ≤ 18 V
8.15
8.5
8.85
V
∆Vline
line regulation
9.5 V ≤ VP ≤ 18 V
−
2
75
mV
∆Vload
load regulation
1 mA ≤ IREG1 ≤ 600 mA
−
20
50
mV
Iq
quiescent current
IREG1 = 600 mA
−
25
60
mA
SVRR
supply voltage ripple
rejection
fi = 3 kHz; Vi = 2 V (p-p)
60
70
−
dB
Vdrop
dropout voltage
VP = 8.5 V; IREG1 = 550 mA;
note 7
−
0.4
0.7
V
Im
current limit
VREG1 > 7.5 V; see Fig.8; note 8 0.65
1.2
−
A
Isc
short-circuit current
RL ≤ 0.5 Ω; see Fig.8; note 9
250
800
−
mA
0.5 mA ≤ IREG2 ≤ 150 mA
4.75
5.0
5.25
V
IREG2 = 300 mA; note 10
4.75
5.0
5.25
V
Regulator 2; IREG2 = 5 mA; unless otherwise specified
VREG2
output voltage
∆Vline
line regulation
∆Vload
load regulation
7 V ≤ VP ≤ 18 V
4.75
5.0
5.25
V
18 V ≤ VP ≤ 50 V;
IREG2 ≤ 150 mA
4.75
5.0
5.25
V
6 V ≤ VP ≤ 18 V
−
2
50
mV
18 V ≤ VP ≤ 50 V
−
15
75
mV
1 mA ≤ IREG2 ≤ 150 mA
−
20
50
mV
1 mA ≤ IREG2 ≤ 300 mA
−
−
100
mV
60
70
−
dB
VP = 4.75 V; IREG2 = 100 mA
−
0.4
0.6
V
VP = 5.75 V; IREG2 = 200 mA
−
0.8
1.2
V
VBU = 4.75 V; IREG2 = 100 mA −
0.2
0.5
V
SVRR
supply voltage ripple
rejection
fi = 3 kHz; Vi = 2 V (p-p)
Vdrop
dropout voltage
normal supply; note 7
backup supply; note 11
VBU = 5.75 V; IREG2 = 200 mA −
0.8
1.0
V
Im
current limit
VREG2 > 4.5 V; see Fig.9; note 8 0.32
0.37
−
A
Isc
short-circuit current
RL ≤ 0.5 Ω; see Fig.9; note 9
20
100
−
mA
−
1
400
mV
1 mA ≤ IREG3 ≤ 400 mA
4.75
5.0
5.25
V
7 V ≤ VP ≤ 18 V
4.75
5.0
5.25
V
Regulator 3; IREG3 = 5 mA; unless otherwise specified
VREG3(off)
output voltage with
regulator off
VREG3
output voltage
∆Vline
line regulation
7 V ≤ VP ≤ 18 V
−
2
50
mV
∆Vload
load regulation
1 mA ≤ IREG3 ≤ 400 mA
−
20
50
mV
2003 Nov 28
11
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
SYMBOL
PARAMETER
CONDITIONS
TDA3608Q; TDA3608TH
MIN.
TYP.
MAX.
UNIT
Iq
quiescent current
IREG3 = 400 mA
−
15
40
mA
SVRR
supply voltage ripple
rejection
fi = 3 kHz; Vi = 2 V (p-p)
60
70
−
dB
Vdrop
dropout voltage
VP = 5.75 V; IREG3 = 400 mA;
note 7
−
1
1.5
V
Im
current limit
VREG3 > 4.5 V; see Fig.10;
note 8
0.45
0.70
−
A
Isc
short-circuit current
RL ≤ 0.5 Ω; see Fig.10; note 9
100
400
−
mA
ISW = 1 A; note 12
−
0.45
0.7
V
Power switch
Vdrop
dropout voltage
ISW = 1.8 A; note 12
−
1.0
1.8
V
Vcl
clamping voltage
VP ≥ 18 V
15
16.2
17.2
V
Vfb
flyback voltage
behaviour
ISW = −100 mA
−
VP + 3
22
V
Idc
continuous current
VP = 16 V; VSW = 13.5 V
1.8
2.0
−
A
IM
peak current
VP = 17 V; see Fig.11; note 13
2
−
−
A
Isc
short-circuit current
VP = 14.4 V; VSW < 3.5 V;
see Fig.11; note 14
−
0.5
−
A
0.3
0.35
−
A
Backup switch
Idc
continuous current
Vcl
clamping voltage
VP ≥ 16.7 V
−
−
16
V
Ir
reverse current
VP = 0; VBU = 12.4 V; note 15
−
−
900
mA
Notes
1. The minimum value is the minimum operating voltage, only if VP has exceeded 6.5 V.
2. The quiescent current is measured in the standby mode. Therefore, the enable inputs of regulator 1, regulator 3 and
the power switch are grounded and RL(REG2) = ∞.
3. The voltage of the regulator drops as a result of a VP drop.
4. The rise and fall time is measured with a 10 kΩ pull-up resistor and CL = 50 pF.
5. This is the threshold voltage for the delay time of the power switch. The voltage on the reset delay capacitor increases
only at low output voltage of the power switch (for example at short circuit). When the voltage on this capacitor
exceeds this threshold voltage, the power switch is set to the foldback mode. The power switch is also protected by
the temperature protection.
6. Delay time calculation:
C
3
a) Reset pulse delay: t d(res) = ------ × V C(th1) = C × 1000 × 10 [sec] The delay time is 47 ms for C = 47 nF.
I ch
C
3
b) Power switch delay: t d(sw) = ------ × V C(th2) = C × 500 × 10 [sec] The delay time is 23.5 ms for C = 47 nF.
I ch
7. The dropout voltage of regulator 1, regulator 2 and regulator 3 is measured between pin VP and pins REG1, REG2
or REG3 respectively.
8. During current limit, current Im is held constant.
9. The foldback current protection limits the dissipated power at short-circuit.
2003 Nov 28
12
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
10. The peak current of 300 mA can only be applied for short periods (t < 100 ms).
11. The dropout voltage is measured between pins BU and REG2.
12. The dropout voltage of the power switch is measured between pins VP and SW.
13. The maximum output current of the power switch is limited to 1.8 A when VP > 18 V.
14. During short-circuit, current Isc of the power switch is held constant to a lower value than the continuous current after
a delay of at least 10 ms. Furthermore, a foldback function is activated after the delay. When VSW < 3.5 V, the
short-circuit current is reduced to 0.5 A (typical value). The short-circuit protection of the power switch functions best
when C1 = 220 µF and C2 = 10 µF.
15. The reverse current of the backup switch is the current which is flowing out of pin VP at VP = 0 V.
MGT571
handbook, halfpage
8.5
handbook, halfpage
MGT572
VREG2
VREG1
(V)
(V)
5.0
2
1
≥300
Isc
I sc
Im
≥50
I REG1 (mA)
Fig.8 Foldback current protection of regulator 1.
Im
I REG2 (mA)
Fig.9 Foldback current protection of regulator 2.
handbook, halfpage
MGT573
MGT574
handbook, halfpage
VREG3
14.2
(V)
5.0
VSW
(V)
(1)
3
1
I sc
≥200
Im
0.5
I REG3 (mA)
I SW (A)
(1) Delayed; time depends on value of capacitor C7.
Fig.10 Foldback current protection of regulator 3.
2003 Nov 28
Fig.11 Current protection of power switch.
13
2
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
TEST AND APPLICATION INFORMATION
Test information
VP
VP
C1
220 nF
(1)
(17) 13
1 (3)
SW
14.2 V
C9 (2)
>10 µF
RL(SW)
R4
2.2 Ω
1 kΩ
C2
220 nF
ENSW
(15) 11
7 (10)
5V
REG2
C3
10 µF
VENSW
EN1
6 (9)
VEN1
(4) 2
4 (6)
C4
10 µF
(5) 3
RL(REG1)
1 kΩ
5V
REG3
C5
10 µF
VEN3
CRES
9 (12)
(8) 5
RES
C7
47 nF
R1
Vbu
1 kΩ
8.5 V
REG1
TDA3608Q
(TDA3608TH)
EN3
RL(REG2)
1 kΩ
R3
10 kΩ
HOLD
12 (16)
C8
220 nF
1 kΩ
R2
10 kΩ
C6
50 pF
BU
RL(REG3)
(11) 8
10
C10
50 pF
GND
mgk605
Numbers in parenthesis refer to type number TDA3608TH.
(1) Capacitor not required for stability.
(2) Value depends on application.
Fig.12 Test circuit.
2003 Nov 28
14
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
Application information
Solution
NOISE
Use a tantalum capacitor of 10 µF or a larger electrolytic
capacitor. The use of tantalum capacitors is recommended
to avoid problems with stability at low temperatures.
The noise on the supply line depends on the value of the
supply capacitor and is caused by a current noise (the
output noise of the regulators is translated into a current
noise by means of the output capacitors). Table 1 shows
the noise figure with the corresponding output capacitor Co
for each regulator. The noise is minimal when a high
frequency capacitor of 220 nF in parallel with an
electrolytic capacitor of 100 µF is connected directly to
pins VP and GND.
Table 1
handbook, halfpage
MBK100
4
maximum ESR
R
(Ω) 3
Noise figure; note 1
NOISE FIGURE (µV)
REGULATOR
1
2
3
Co = 10 µF
Co = 47 µF
Co = 100 µF
225
150
135
225
255
150
200
stable region
2
1
minimum ESR
0
135
1
10
100
C (µF)
180
Note
1. Measured at a bandwidth of 200 kHz.
Fig.13 Curves for selecting value of output
capacitor for regulator 1 and regulator 3.
STABILITY
The regulators are made stable with the externally
connected output capacitors. The output capacitors can be
selected using the graphs of Figs 13 and 14. When an
electrolytic capacitor is used, the temperature behaviour of
this output capacitor can cause oscillations at low
temperature. The next two examples show how an output
capacitor value is selected.
handbook, halfpage
MBK099
14
maximum ESR
R 12
(Ω)
10
Example 1
8
The regulator 1 is made stable with an electrolytic output
capacitor of 220 µF with ESR = 0.15 Ω. At Tamb = −30 °C
the capacitor value is decreased to 73 µF and the ESR is
increased to 1.1 Ω. The regulator remains stable at
Tamb = −30 °C (see Fig.13).
stable region
6
4
2
minimum ESR
0
0.22
Example 2
10
100
C (µF)
The regulator 2 is made stable with an electrolytic
capacitor of 10 µF with ESR = 3 Ω. At Tamb = −30 °C the
capacitor value is decreased to 3 µF and the ESR is
increased to 23.1 Ω. The regulator will be instable at
Tamb = −30 °C (see Fig.14).
2003 Nov 28
1
Fig.14 Curves for selecting value of output
capacitor for regulator 2.
15
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
PACKAGE OUTLINES
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
non-concave
Dh
x
D
Eh
view B: mounting base side
d
A2
B
j
E
A
L3
L
Q
c
1
v M
13
e1
Z
e
e2
m
w M
bp
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A2
bp
c
D (1)
d
Dh
E (1)
e
e1
e2
Eh
j
L
L3
m
Q
v
w
x
Z (1)
mm
17.0
15.5
4.6
4.4
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
3.4
1.7
5.08
6
3.4
3.1
12.4
11.0
2.4
1.6
4.3
2.1
1.8
0.8
0.25
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
99-12-17
03-03-12
SOT141-6
2003 Nov 28
EUROPEAN
PROJECTION
16
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
E
D
A
x
X
c
E2
y
HE
v M A
D1
D2
10
1
pin 1 index
Q
A
A2
E1
(A3)
A4
θ
Lp
detail X
20
11
Z
w M
bp
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
A2
max.
3.5
3.5
3.2
A3
0.35
A4(1)
D1
D2
E(2)
E1
E2
e
HE
Lp
Q
+0.08 0.53 0.32 16.0 13.0
−0.04 0.40 0.23 15.8 12.6
1.1
0.9
11.1
10.9
6.2
5.8
2.9
2.5
1.27
14.5
13.9
1.1
0.8
1.7
1.5
bp
c
D(2)
v
w
x
y
0.25 0.25 0.03 0.07
Z
θ
2.5
2.0
8°
0°
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
02-02-12
03-07-23
SOT418-3
2003 Nov 28
EUROPEAN
PROJECTION
17
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended. Driven by legislation and environmental
forces the worldwide use of lead-free solder pastes is
increasing.
• below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
– for all the BGA, HTSSON..T and SSOP-T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Surface mount packages
REFLOW SOLDERING
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
2003 Nov 28
18
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
MANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 °C.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
2003 Nov 28
TDA3608Q; TDA3608TH
19
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
PACKAGE(1)
MOUNTING
WAVE
Through-hole mount CPGA, HCPGA
REFLOW(2) DIPPING
suitable
−
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable(3)
−
−
Through-holesurface mount
PMFP(4)
not suitable
not suitable
−
Surface mount
BGA, HTSSON..T(5), LBGA, LFBGA, SQFP,
SSOP-T(5), TFBGA, USON, VFBGA
not suitable
suitable
−
DHVQFN, HBCC, HBGA, HLQFP, HSO,
HSOP, HSQFP, HSSON, HTQFP, HTSSOP,
HVQFN, HVSON, SMS
not suitable(6)
suitable
−
PLCC(7), SO, SOJ
suitable
suitable
−
not
recommended(7)(8)
suitable
−
SSOP, TSSOP, VSO, VSSOP
not
recommended(9)
suitable
−
CWQCCN..L(11), PMFP(10), WQCCN32L(11)
not suitable
not suitable
−
LQFP, QFP, TQFP
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. Hot bar soldering or manual soldering is suitable for PMFP packages.
5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
7. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
2003 Nov 28
20
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Nov 28
21
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected]
SCA75
© Koninklijke Philips Electronics N.V. 2003
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R32/04/pp22
Date of release: 2003
Nov 28
Document order number:
9397 750 12339
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