INTEGRATED CIRCUITS DATA SHEET TDA3608Q; TDA3608TH Multiple voltage regulators with switch Product specification Supersedes data of 2001 Jun 29 2003 Nov 28 Philips Semiconductors Product specification Multiple voltage regulators with switch TDA3608Q; TDA3608TH • Delayed foldback current limit protection for power switch (at short-circuit); delay time fixed by reset delay capacitor FEATURES General • Two VP-state controlled regulators (regulator 1 and regulator 3) and a power switch • All regulator outputs and power switch are DC short-circuited safe to ground and VP. • Regulator 2 and reset circuit operate during load dump and thermal shutdown GENERAL DESCRIPTION • Separate control pins for switching regulator 1, regulator 3 and power switch The TDA3608 is a multiple output voltage regulator with a power switch, intended for use in car radios with or without a microcontroller. It contains: • Supply voltage range from −18 to +50 V • Low reverse current of regulator 2 • Two fixed output voltage regulators with a foldback current protection (regulator 1 and regulator 3) and one fixed output voltage regulator (regulator 2) intended to supply a microcontroller, which also operates during load dump and thermal shutdown • Low quiescent current (when regulator 1, regulator 3 and power switch are switched off) • Hold output circuit for regulator 1 (only valid when regulator 3 output voltage >1.3 V) • A power switch with protections, operated by an enable input • Reset and hold outputs (open-collector outputs) • Adjustable reset delay time • Reset and hold outputs that can be used to interface with the microcontroller; the reset output can be used to call up the microcontroller and the hold output indicates that the regulator 1 output voltage is available and within the range • High ripple rejection • Backup capacitor connection to supply regulator 2 and reset circuit up to 25 V. Protections • A supply pin which can withstand load dump pulses and negative supply voltages • Reverse polarity safe (down to −18 V without high reverse current) • Regulator 2 which is switched on at a backup voltage higher than 6.5 V and switched off when the regulator 2 output drops below 1.9 V • Able to withstand voltages up to 18 V at the outputs (supply line may be short circuited) • A provision for the use of a reserve (backup) supply capacitor that will hold enough energy for regulator 2 (5 V continuous) to allow a microcontroller to prepare for loss of voltage. • ESD protection on all pins • Thermal protection • Load dump protection • Foldback current limit protection for regulator 1, regulator 2 and regulator 3 ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION TDA3608Q DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 TDA3608TH HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-3 2003 Nov 28 2 Philips Semiconductors Product specification Multiple voltage regulators with switch TDA3608Q; TDA3608TH QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP supply voltage Iq quiescent supply current Tj junction temperature operating 9.5 14.4 18 V regulator 2 on 2.4 14.4 18 V reverse polarity; non-operating − − −18 V jump start for t ≤ 10 minutes − − 30 V load dump protection for t ≤ 50 ms and tr ≥ 2.5 ms − − 50 V standby mode; VP = 12.4 V − 500 600 µA −40 − +150 °C Voltage regulators VREG1 output voltage of regulator 1 1 mA ≤ IREG1 ≤ 600 mA 8.15 8.5 8.85 V VREG2 output voltage of regulator 2 0.5 mA ≤ IREG2 ≤ 150 mA 4.75 5.0 5.25 V VREG3 output voltage of regulator 3 1 mA ≤ IREG3 ≤ 400 mA 4.75 5.0 5.25 V Vdrop dropout voltage ISW = 1 A − 0.45 0.7 V ISW = 1.8 A − 1.0 1.8 V IM peak current 2 − − A Power switch 2003 Nov 28 3 Philips Semiconductors Product specification Multiple voltage regulators with switch TDA3608Q; TDA3608TH BLOCK DIAGRAM handbook, full pagewidth (14.4 V) VP ENSW POWER SWITCH 1 (3) 7 (10) (17) 13 SW (14.2 V/1.8 A) TEMPERATURE AND LOAD DUMP PROTECTION & BACKUP SWITCH (16) 12 BU (14.2 V/100 mA) BACKUP CONTROL REGULATOR 2 REGULATOR 3 & EN3 REG2 (5) 3 REG3 (4) 2 REG1 (11) 8 HOLD REGULATOR 1 6 (9) hold enable TDA3608Q (TDA3608TH) CRES (8) 5 9 (12) (1, 2, 7, 13, 18, 19, 20) 10 (14) GND n.c. Numbers in parenthesis refer to type number TDA3608TH. Fig.1 Block diagram. 2003 Nov 28 (5 V/150 mA) (5 V/400 mA) 4 (6) & EN1 (15) 11 4 MGK602 RES (8.5 V/600 mA) Philips Semiconductors Product specification Multiple voltage regulators with switch TDA3608Q; TDA3608TH PINNING PIN SYMBOL DESCRIPTION TDA3608Q TDA3608TH VP 1 3 supply voltage REG1 2 4 regulator 1 output REG3 3 5 regulator 3 output EN3 4 6 regulator 3 enable input RES 5 8 reset output EN1 6 9 regulator 1 enable input ENSW 7 10 power switch enable input HOLD 8 11 hold output CRES 9 12 reset delay capacitor connection GND 10 14 ground REG2 11 15 regulator 2 output BU 12 16 backup capacitor connection SW 13 17 power switch output n.c. − 1, 2, 7, 13, 18,19 not connected and 20 handbook, halfpage VP 1 REG1 2 REG3 3 EN3 4 RES 5 EN1 6 ENSW 7 HOLD 8 CRES 9 handbook, halfpage 1 n.c. n.c. 19 2 n.c. n.c. 18 3 VP SW 17 4 REG1 BU 16 TDA3608Q 5 REG3 TDA3608TH GND 10 REG2 n.c. 20 11 REG2 15 6 EN3 GND 14 7 n.c. n.c. 13 8 RES CRES 12 9 EN1 HOLD 11 BU 12 10 ENSW MGT566 SW 13 MGK601 Fig.2 Pin configuration of TDA3608Q. 2003 Nov 28 Fig.3 Pin configuration of TDA3608TH. 5 Philips Semiconductors Product specification Multiple voltage regulators with switch FUNCTIONAL DESCRIPTION TDA3608Q; TDA3608TH The hold output is only activated when VREG3 > 1.3 V. When pin HOLD is connected via a pull-up resistor to the output of regulator 3 spikes will be minimized to 1.3 V (maximum value) because the hold output is only disabled when VREG3 < 1.3 V. The TDA3608 is a multiple output voltage regulator with a power switch, intended for use in car radios with or without a microcontroller. Because of low-voltage operation of the car radio, low-voltage drop regulators are used in the TDA3608. Pin HOLD will be forced LOW when the load dump protection is activated and also in the standby mode. Backup supply Power switch The charge of the backup capacitor connected to pin BU can be used to supply regulator 2 for a short period when the supply voltage VP drops to 0 V (the time depends on the value of the capacitor). The power switch can be controlled by means of enable pin ENSW (see Fig.6). Protections Regulator 1 All output pins are fully protected. When the output voltage of regulator 2 and the supply voltage (VP > 4.5 V) are both available, regulator 1 can be operated by means of enable pin EN1 (see Fig.4). The regulators are protected against load dump (regulator 1 and regulator 3 switch off at VP > 18 V) and short-circuit (foldback current protection). Regulator 2 The power switch contains a foldback current protection, but this protection is delayed at a short-circuit condition by the reset delay capacitor. During this time the output current is limited to at least 2 A (peak value) and 1.8 A (continuous value) at VP ≤ 18 V. During the foldback mode the current is limited to 0.5 A (typical value). Regulator 2 switches on (see Fig.5) when the backup voltage exceeds 6.5 V for the first time and switches off when the output voltage of regulator 2 drops below 1.9 V (this is far below an engine start). Regulator 3 The timing diagram is shown in Fig.7. When the output voltage of regulator 2 and the supply voltage (VP > 4.5 V) are both available, regulator 3 can be operated by means of enable pin EN3 (see Fig.4). The foldback protection is activated when VSW < 4 V. When regulator 2 is out-of-regulation and generates a reset, the power switch is in the foldback mode immediately when VSW < 4 V. Reset In the standby mode the voltage on the reset delay capacitor is about 4 V and the voltage on the power switch output is VP − 0.45 V (typical value) at ISW = 1 A. During an overload condition or short-circuit the reset delay capacitor will be charged to a higher voltage. The power switch is in the high current mode while the capacitor is charged, after this the switch is in the foldback mode (VSW < 4 V). While the reset delay capacitor is charged the power switch output can reach its correct output voltage. Now the voltage on the reset delay capacitor is decreased rapidly to 4 V. The reset output voltage is not influenced by this change of voltages. The time of the high current mode depends on the value of the reset delay capacitor. When regulator 2 is switched on and the output voltage of this regulator is within its voltage range, the reset output (see Fig.5) will be enabled (pin RES goes HIGH through an external pull-up resistor) to generate a reset to the microcontroller. The reset cycles can be extended by means of an external capacitor connected to pin CRES. This start-up feature is included to secure a smooth start-up of the microcontroller at first connection, without uncontrolled switching of regulator 2 during the start-up sequence. Hold At VP > 18 V the power switch is clamped at maximum 17.2 V (to avoid that external connected circuitry is being damaged by an overvoltage) and the power switch will switch off at load dump. Regulator 1 has an open-collector hold output (see Fig.4) indicating that the output voltage is settled at 8.5 V. Pin HOLD is held HIGH by an external pull-up resistor. When the supply voltage VP drops or during high load, the output voltage drops out-of-regulation and pin HOLD goes LOW. 2003 Nov 28 6 Philips Semiconductors Product specification Multiple voltage regulators with switch handbook, full pagewidth TDA3608Q; TDA3608TH load dump 18.0 V 9.5 V 4.5 V 4.0 V VP ≥2.2 V enable regulator 1 ≤2.0 V 8.5 V regulator 1 0V ≥2.2 V enable regulator 3 ≤2.0 V 5.0 V regulator 3 0V hold output MGT568 Fig.4 Timing diagram of regulator 1, regulator 3 and hold output. handbook, full pagewidth load dump 18.0 V VP 4.0 V backup 6.5 V 5.4 V regulator 2 5.0 V 1.9 V 0V reset delay capacitor 5.0 V 3.0 V 0V reset output 5.0 V MGT567 t d(res) Fig.5 Timing diagram of backup, regulator 2 and reset output. 2003 Nov 28 7 Philips Semiconductors Product specification Multiple voltage regulators with switch handbook, full pagewidth TDA3608Q; TDA3608TH load dump 18.0 V VP 4.5 V 4.0 V enable power switch ≥2.2 V ≤2.0 V 16.2 V power switch output 0V MGT569 Fig.6 Timing diagram of power switch output. handbook, full pagewidth regulator 2 5V t d(sw) t d(res) 6.4 V reset delay voltage 4V 3V 0V reset output 5V enable power switch > 2.2 V power switch voltage 0V < 2.0 V 14 V 4V 0V 2A power switch current 0.5 A 0A foldback mode foldback mode current limit mode MGT570 Fig.7 Timing diagram of current protection of power switch. 2003 Nov 28 8 Philips Semiconductors Product specification Multiple voltage regulators with switch TDA3608Q; TDA3608TH LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VP PARAMETER supply voltage CONDITIONS MIN. MAX. UNIT operating − 18 V reverse polarity; non-operating − −18 V jump start for t ≤ 10 minutes − 30 V load dump protection for t ≤ 50 ms and tr ≥ 2.5 ms − 50 V − 62 W Ptot total power dissipation Tstg storage temperature non-operating −55 +150 °C Tamb ambient temperature operating −40 +85 °C Tj junction temperature operating −40 +150 °C THERMAL CHARACTERISTICS SYMBOL Rth(j-c) Rth(j-a) PARAMETER CONDITIONS VALUE UNIT thermal resistance from junction to case TDA3608Q 2 K/W TDA3608TH 3.5 K/W 50 K/W thermal resistance from junction to ambient in free air CHARACTERISTICS VP = 14.4 V; Tamb = 25 °C; measured in test circuit of Fig.12; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP Iq supply voltage quiescent supply current operating 9.5 14.4 18 V regulator 2 on; note 1 2.4 14.4 18 V jump start for t ≤ 10 minutes − − 30 V load dump protection for t ≤ 50 ms and tr ≥ 2.5 ms − − 50 V VP = 12.4 V − 500 600 µA VP = 14.4 V − 520 − µA standby mode; note 2 Schmitt trigger supply voltage for regulator 1, regulator 3 and power switch Vthr rising threshold voltage 4.0 4.5 5.0 V Vthf falling threshold voltage 3.5 4.0 4.5 V Vhys hysteresis voltage − 0.5 − V 6.0 6.5 7.1 V Schmitt trigger supply voltage for regulator 2 Vthr rising threshold voltage 2003 Nov 28 9 Philips Semiconductors Product specification Multiple voltage regulators with switch SYMBOL PARAMETER CONDITIONS TDA3608Q; TDA3608TH MIN. TYP. MAX. UNIT Vthf falling threshold voltage 1.7 1.9 2.2 V Vhys hysteresis voltage − 4.6 − V Schmitt trigger voltage for enable input (regulator 1, regulator 3 and power switch) Vthr rising threshold voltage 1.7 2.2 2.7 V Vthf falling threshold voltage 1.5 2.0 2.5 V Vhys hysteresis voltage IREG = ISW = 1 mA 0.1 0.2 0.5 V ILI input leakage current VEN = 5 V 1 5 10 µA Schmitt trigger voltage for reset Vthr rising threshold voltage of regulator 2 VP rising; IREG2 = 50 mA; note 3 − VREG2 − 0.15 VREG2 − 0.075 V Vthf falling threshold voltage of regulator 2 VP falling; IREG2 = 50 mA; note 3 4.3 VREG2 − 0.35 − V Vhys hysteresis voltage 0.1 0.2 0.3 V Schmitt trigger voltage for hold Vthr rising threshold voltage of regulator 1 VP rising; note 3 − VREG1 − 0.15 VREG1 − 0.075 V Vthf falling threshold voltage of regulator 1 VP falling; note 3 7.7 VREG1 − 0.35 − V Vhys hysteresis voltage 0.1 0.2 0.3 V Reset and hold output IsinkL LOW-level sink current Vo ≤ 0.8 V 2 − − mA ILO output leakage current Vo = 5 V; VP = 14.4 V − − 2 µA tr rise time note 4 − 7 50 µs tf fall time note 4 − 1 50 µs 2 3 4 µA Reset delay capacitor circuit Ich charge current Idch discharge current 500 800 − µA Vthr(res) rising threshold voltage for delayed reset pulse 2.8 3.0 3.2 V Vthr(sw) rising threshold note 5 voltage for delayed power switch foldback mode − 6.4 − V td(res) reset delay time 32 47 70 ms 2003 Nov 28 C7 = 47 nF; note 6 10 Philips Semiconductors Product specification Multiple voltage regulators with switch SYMBOL PARAMETER CONDITIONS TDA3608Q; TDA3608TH MIN. TYP. MAX. UNIT Regulator 1; IREG1 = 5 mA; unless otherwise specified VREG1(off) output voltage with regulator off VREG1 output voltage − 1 400 mV 1 mA ≤ IREG1 ≤ 600 mA 8.15 8.5 8.85 V 9.5 V ≤ VP ≤ 18 V 8.15 8.5 8.85 V ∆Vline line regulation 9.5 V ≤ VP ≤ 18 V − 2 75 mV ∆Vload load regulation 1 mA ≤ IREG1 ≤ 600 mA − 20 50 mV Iq quiescent current IREG1 = 600 mA − 25 60 mA SVRR supply voltage ripple rejection fi = 3 kHz; Vi = 2 V (p-p) 60 70 − dB Vdrop dropout voltage VP = 8.5 V; IREG1 = 550 mA; note 7 − 0.4 0.7 V Im current limit VREG1 > 7.5 V; see Fig.8; note 8 0.65 1.2 − A Isc short-circuit current RL ≤ 0.5 Ω; see Fig.8; note 9 250 800 − mA 0.5 mA ≤ IREG2 ≤ 150 mA 4.75 5.0 5.25 V IREG2 = 300 mA; note 10 4.75 5.0 5.25 V Regulator 2; IREG2 = 5 mA; unless otherwise specified VREG2 output voltage ∆Vline line regulation ∆Vload load regulation 7 V ≤ VP ≤ 18 V 4.75 5.0 5.25 V 18 V ≤ VP ≤ 50 V; IREG2 ≤ 150 mA 4.75 5.0 5.25 V 6 V ≤ VP ≤ 18 V − 2 50 mV 18 V ≤ VP ≤ 50 V − 15 75 mV 1 mA ≤ IREG2 ≤ 150 mA − 20 50 mV 1 mA ≤ IREG2 ≤ 300 mA − − 100 mV 60 70 − dB VP = 4.75 V; IREG2 = 100 mA − 0.4 0.6 V VP = 5.75 V; IREG2 = 200 mA − 0.8 1.2 V VBU = 4.75 V; IREG2 = 100 mA − 0.2 0.5 V SVRR supply voltage ripple rejection fi = 3 kHz; Vi = 2 V (p-p) Vdrop dropout voltage normal supply; note 7 backup supply; note 11 VBU = 5.75 V; IREG2 = 200 mA − 0.8 1.0 V Im current limit VREG2 > 4.5 V; see Fig.9; note 8 0.32 0.37 − A Isc short-circuit current RL ≤ 0.5 Ω; see Fig.9; note 9 20 100 − mA − 1 400 mV 1 mA ≤ IREG3 ≤ 400 mA 4.75 5.0 5.25 V 7 V ≤ VP ≤ 18 V 4.75 5.0 5.25 V Regulator 3; IREG3 = 5 mA; unless otherwise specified VREG3(off) output voltage with regulator off VREG3 output voltage ∆Vline line regulation 7 V ≤ VP ≤ 18 V − 2 50 mV ∆Vload load regulation 1 mA ≤ IREG3 ≤ 400 mA − 20 50 mV 2003 Nov 28 11 Philips Semiconductors Product specification Multiple voltage regulators with switch SYMBOL PARAMETER CONDITIONS TDA3608Q; TDA3608TH MIN. TYP. MAX. UNIT Iq quiescent current IREG3 = 400 mA − 15 40 mA SVRR supply voltage ripple rejection fi = 3 kHz; Vi = 2 V (p-p) 60 70 − dB Vdrop dropout voltage VP = 5.75 V; IREG3 = 400 mA; note 7 − 1 1.5 V Im current limit VREG3 > 4.5 V; see Fig.10; note 8 0.45 0.70 − A Isc short-circuit current RL ≤ 0.5 Ω; see Fig.10; note 9 100 400 − mA ISW = 1 A; note 12 − 0.45 0.7 V Power switch Vdrop dropout voltage ISW = 1.8 A; note 12 − 1.0 1.8 V Vcl clamping voltage VP ≥ 18 V 15 16.2 17.2 V Vfb flyback voltage behaviour ISW = −100 mA − VP + 3 22 V Idc continuous current VP = 16 V; VSW = 13.5 V 1.8 2.0 − A IM peak current VP = 17 V; see Fig.11; note 13 2 − − A Isc short-circuit current VP = 14.4 V; VSW < 3.5 V; see Fig.11; note 14 − 0.5 − A 0.3 0.35 − A Backup switch Idc continuous current Vcl clamping voltage VP ≥ 16.7 V − − 16 V Ir reverse current VP = 0; VBU = 12.4 V; note 15 − − 900 mA Notes 1. The minimum value is the minimum operating voltage, only if VP has exceeded 6.5 V. 2. The quiescent current is measured in the standby mode. Therefore, the enable inputs of regulator 1, regulator 3 and the power switch are grounded and RL(REG2) = ∞. 3. The voltage of the regulator drops as a result of a VP drop. 4. The rise and fall time is measured with a 10 kΩ pull-up resistor and CL = 50 pF. 5. This is the threshold voltage for the delay time of the power switch. The voltage on the reset delay capacitor increases only at low output voltage of the power switch (for example at short circuit). When the voltage on this capacitor exceeds this threshold voltage, the power switch is set to the foldback mode. The power switch is also protected by the temperature protection. 6. Delay time calculation: C 3 a) Reset pulse delay: t d(res) = ------ × V C(th1) = C × 1000 × 10 [sec] The delay time is 47 ms for C = 47 nF. I ch C 3 b) Power switch delay: t d(sw) = ------ × V C(th2) = C × 500 × 10 [sec] The delay time is 23.5 ms for C = 47 nF. I ch 7. The dropout voltage of regulator 1, regulator 2 and regulator 3 is measured between pin VP and pins REG1, REG2 or REG3 respectively. 8. During current limit, current Im is held constant. 9. The foldback current protection limits the dissipated power at short-circuit. 2003 Nov 28 12 Philips Semiconductors Product specification Multiple voltage regulators with switch TDA3608Q; TDA3608TH 10. The peak current of 300 mA can only be applied for short periods (t < 100 ms). 11. The dropout voltage is measured between pins BU and REG2. 12. The dropout voltage of the power switch is measured between pins VP and SW. 13. The maximum output current of the power switch is limited to 1.8 A when VP > 18 V. 14. During short-circuit, current Isc of the power switch is held constant to a lower value than the continuous current after a delay of at least 10 ms. Furthermore, a foldback function is activated after the delay. When VSW < 3.5 V, the short-circuit current is reduced to 0.5 A (typical value). The short-circuit protection of the power switch functions best when C1 = 220 µF and C2 = 10 µF. 15. The reverse current of the backup switch is the current which is flowing out of pin VP at VP = 0 V. MGT571 handbook, halfpage 8.5 handbook, halfpage MGT572 VREG2 VREG1 (V) (V) 5.0 2 1 ≥300 Isc I sc Im ≥50 I REG1 (mA) Fig.8 Foldback current protection of regulator 1. Im I REG2 (mA) Fig.9 Foldback current protection of regulator 2. handbook, halfpage MGT573 MGT574 handbook, halfpage VREG3 14.2 (V) 5.0 VSW (V) (1) 3 1 I sc ≥200 Im 0.5 I REG3 (mA) I SW (A) (1) Delayed; time depends on value of capacitor C7. Fig.10 Foldback current protection of regulator 3. 2003 Nov 28 Fig.11 Current protection of power switch. 13 2 Philips Semiconductors Product specification Multiple voltage regulators with switch TDA3608Q; TDA3608TH TEST AND APPLICATION INFORMATION Test information VP VP C1 220 nF (1) (17) 13 1 (3) SW 14.2 V C9 (2) >10 µF RL(SW) R4 2.2 Ω 1 kΩ C2 220 nF ENSW (15) 11 7 (10) 5V REG2 C3 10 µF VENSW EN1 6 (9) VEN1 (4) 2 4 (6) C4 10 µF (5) 3 RL(REG1) 1 kΩ 5V REG3 C5 10 µF VEN3 CRES 9 (12) (8) 5 RES C7 47 nF R1 Vbu 1 kΩ 8.5 V REG1 TDA3608Q (TDA3608TH) EN3 RL(REG2) 1 kΩ R3 10 kΩ HOLD 12 (16) C8 220 nF 1 kΩ R2 10 kΩ C6 50 pF BU RL(REG3) (11) 8 10 C10 50 pF GND mgk605 Numbers in parenthesis refer to type number TDA3608TH. (1) Capacitor not required for stability. (2) Value depends on application. Fig.12 Test circuit. 2003 Nov 28 14 Philips Semiconductors Product specification Multiple voltage regulators with switch TDA3608Q; TDA3608TH Application information Solution NOISE Use a tantalum capacitor of 10 µF or a larger electrolytic capacitor. The use of tantalum capacitors is recommended to avoid problems with stability at low temperatures. The noise on the supply line depends on the value of the supply capacitor and is caused by a current noise (the output noise of the regulators is translated into a current noise by means of the output capacitors). Table 1 shows the noise figure with the corresponding output capacitor Co for each regulator. The noise is minimal when a high frequency capacitor of 220 nF in parallel with an electrolytic capacitor of 100 µF is connected directly to pins VP and GND. Table 1 handbook, halfpage MBK100 4 maximum ESR R (Ω) 3 Noise figure; note 1 NOISE FIGURE (µV) REGULATOR 1 2 3 Co = 10 µF Co = 47 µF Co = 100 µF 225 150 135 225 255 150 200 stable region 2 1 minimum ESR 0 135 1 10 100 C (µF) 180 Note 1. Measured at a bandwidth of 200 kHz. Fig.13 Curves for selecting value of output capacitor for regulator 1 and regulator 3. STABILITY The regulators are made stable with the externally connected output capacitors. The output capacitors can be selected using the graphs of Figs 13 and 14. When an electrolytic capacitor is used, the temperature behaviour of this output capacitor can cause oscillations at low temperature. The next two examples show how an output capacitor value is selected. handbook, halfpage MBK099 14 maximum ESR R 12 (Ω) 10 Example 1 8 The regulator 1 is made stable with an electrolytic output capacitor of 220 µF with ESR = 0.15 Ω. At Tamb = −30 °C the capacitor value is decreased to 73 µF and the ESR is increased to 1.1 Ω. The regulator remains stable at Tamb = −30 °C (see Fig.13). stable region 6 4 2 minimum ESR 0 0.22 Example 2 10 100 C (µF) The regulator 2 is made stable with an electrolytic capacitor of 10 µF with ESR = 3 Ω. At Tamb = −30 °C the capacitor value is decreased to 3 µF and the ESR is increased to 23.1 Ω. The regulator will be instable at Tamb = −30 °C (see Fig.14). 2003 Nov 28 1 Fig.14 Curves for selecting value of output capacitor for regulator 2. 15 Philips Semiconductors Product specification Multiple voltage regulators with switch TDA3608Q; TDA3608TH PACKAGE OUTLINES DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L Q c 1 v M 13 e1 Z e e2 m w M bp 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e e1 e2 Eh j L L3 m Q v w x Z (1) mm 17.0 15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 3.4 1.7 5.08 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 99-12-17 03-03-12 SOT141-6 2003 Nov 28 EUROPEAN PROJECTION 16 Philips Semiconductors Product specification Multiple voltage regulators with switch TDA3608Q; TDA3608TH HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-3 E D A x X c E2 y HE v M A D1 D2 10 1 pin 1 index Q A A2 E1 (A3) A4 θ Lp detail X 20 11 Z w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) D1 D2 E(2) E1 E2 e HE Lp Q +0.08 0.53 0.32 16.0 13.0 −0.04 0.40 0.23 15.8 12.6 1.1 0.9 11.1 10.9 6.2 5.8 2.9 2.5 1.27 14.5 13.9 1.1 0.8 1.7 1.5 bp c D(2) v w x y 0.25 0.25 0.03 0.07 Z θ 2.5 2.0 8° 0° Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 02-02-12 03-07-23 SOT418-3 2003 Nov 28 EUROPEAN PROJECTION 17 Philips Semiconductors Product specification Multiple voltage regulators with switch TDA3608Q; TDA3608TH type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. • below 225 °C (SnPb process) or below 245 °C (Pb-free process) – for all the BGA, HTSSON..T and SSOP-T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Surface mount packages REFLOW SOLDERING The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor 2003 Nov 28 18 Philips Semiconductors Product specification Multiple voltage regulators with switch During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 2003 Nov 28 TDA3608Q; TDA3608TH 19 Philips Semiconductors Product specification Multiple voltage regulators with switch TDA3608Q; TDA3608TH Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD PACKAGE(1) MOUNTING WAVE Through-hole mount CPGA, HCPGA REFLOW(2) DIPPING suitable − suitable DBS, DIP, HDIP, RDBS, SDIP, SIL suitable(3) − − Through-holesurface mount PMFP(4) not suitable not suitable − Surface mount BGA, HTSSON..T(5), LBGA, LFBGA, SQFP, SSOP-T(5), TFBGA, USON, VFBGA not suitable suitable − DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable(6) suitable − PLCC(7), SO, SOJ suitable suitable − not recommended(7)(8) suitable − SSOP, TSSOP, VSO, VSSOP not recommended(9) suitable − CWQCCN..L(11), PMFP(10), WQCCN32L(11) not suitable not suitable − LQFP, QFP, TQFP Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 4. Hot bar soldering or manual soldering is suitable for PMFP packages. 5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 7. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 10. Hot bar or manual soldering is suitable for PMFP packages. 11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 2003 Nov 28 20 Philips Semiconductors Product specification Multiple voltage regulators with switch TDA3608Q; TDA3608TH DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Nov 28 21 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA75 © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R32/04/pp22 Date of release: 2003 Nov 28 Document order number: 9397 750 12339