Data Sheet

Pressure
MPX5700
Rev 10, 10/2012
Freescale Semiconductor
Data Sheet: Technical Data
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MPX5700
Series
0 to 700 kPa (0 to 101.5 psi)
15 to 700 kPa (2.18 to 101.5 psi)
0.2 to 4.7 V Output
The MPX5700 series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
Features
•
•
•
•
•
2.5% Maximum Error over 0 to 85C
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Available in Absolute, Differential and Gauge Configurations
Patented Silicon Shear Stress Strain Gauge
Durable Epoxy Unibody Element
ORDERING INFORMATION
Case
Device Name
No.
Unibody Package (MPX5700 Series)
MPX5700A
MPX5700AP
MPX5700AS
MPX5700ASX
MPX5700D
MPX5700DP
MPX5700GP
MPX5700GP1(1)
MPX5700GS
867
867B
867E
867F
867
867C
867B
867B
867E
None
# of Ports
Single
Dual
Gauge
Pressure Type
Differential
•
Absolute
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Device
Name
MPX5700A
MPX5700AP
MPX5700A
MPX5700A
MPX5700D
MPX5700DP
MPX5700GP
MPX5700GP
MPX5700D
1. MPX5700GP1 has 90 degree lead form.
UNIBODY PACKAGES
MPX5700A/D
CASE 867-08
MPX5700AP/GP/GP1
CASE 867B-04
MPX5700DP
CASE 867C-05
© 2007-2009, 2012 Freescale Semiconductor, Inc. All rights reserved.
MPX5700AS/GS
CASE 867E-03
MPX5700ASX
CASE 867F-03
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
POP
0
15
—
—
700
700
kPa
Supply Voltage(2)
VS
4.75
5.0
5.25
Vdc
Supply Current
IO
—
7.0
10
mAdc
Voff
0.088
0.184
0.2
—
0.313
0.409
Vdc
(0 to 85C)
VFSO
4.587
4.7
4.813
Vdc
(0 to 85C)
VFSS
—
4.5
—
Vdc
(0 to 85C)
—
—
—
2.5
%VFSS
Pressure Range(1)
Zero Pressure Offset(3)
Full Scale Output(4)
(5)
Full Scale Span
(6)
Accuracy
Sensitivity
Gauge, Differential: MPX5700D
Absolute: MPX5700A
Gauge, Differential (0 to 85C)
Absolute (0 to 85C)
V/P
—
6.4
—
mV/kPa
Response Time(7)
tR
—
1.0
—
ms
Output Source Current at Full Scale Output
IO+
—
0.1
—
mAdc
—
—
20
—
ms
(8)
Warm-Up Time
1.
2.
3.
4.
5.
1.0 kPa (kiloPascal) equals 0.145 psi.
Device is ratiometric within this specified excitation range.
Offset (Voff) is defined as the output voltage at the minimum rated pressure.
Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8. Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized.
MPX5700
2
Sensors
Freescale Semiconductor, Inc.
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Maximum
Pressure(2)
Parametrics
Symbol
(P2  1 Atmosphere)
Value
Unit
P1max
2800
kPa
Storage Temperature
Tstg
-40 to +125
C
Operating Temperature
TA
-40 to +125
C
1. Maximum Ratings apply to Case 867 only. Extended exposure at the specified limits may cause permanent damage or degradation to the
device.
2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
3
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
2
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
1
Vout
Pins 4, 5, and 6 are no connects
Figure 1. Fully Integrated Pressure Sensor Schematic
MPX5700
Sensors
Freescale Semiconductor, Inc.
3
Pressure
On-chip Temperature Compensation and Calibration
Figure 3. illustrates both the Differential/Gauge and the
Absolute Sensing Chip in the basic chip carrier (Case 867).
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the sensor diaphragm. (For use of the
MPX5700D in a high-pressure cyclic application, consult the
factory.)
The MPX5700 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
5.0
Transfer Function:
Vout = VS*(0.0012858*P+0.04) ± Error
VS = 5.0 Vdc
Temperature = 0 to 85°C
4.5
4.0
3.5
Output (V)
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2. shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0 to 85C using the decoupling circuit shown in . The output
will saturate outside of the specified pressure range.
shows the recommended decoupling circuit for interfacing
the output of the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Typical
3.0
2.5
Maximum
2.0
Minimum
1.5
1.0
0.5
0
0
100
200
500
400
300
Differential Pressure (kPa)
600
700
800
Figure 2. Output vs. Pressure Differential
Fluoro Silicone
Die Coat
Fluoro Silicone
Die Coat
Stainless Steel
Metal Cover
Die
P1
Wire Bond
Lead Frame
Epoxy Case
Die
P1
Wire Bond
Lead Frame
RTV Die
Bond
P2
Stainless Steel
Metal Cover
P2
Epoxy Case
DIFFERENTIAL/GAUGE ELEMENT
RTV Die
Bond
ABSOLUTE ELEMENT
Figure 3. Cross-Sectional Diagrams (not to scale)
+5 V
Vout
Output
Vs
IPS
1.0 F
0.01 F
GND
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
MPX5700
4
Sensors
Freescale Semiconductor, Inc.
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The Freescale MPX
Part Number
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table.
Case Type
Pressure (P1)
Side Identifier
MPX5700A/D
867
Stainless Steel Cap
MPX5700DP
867C
Side with Part Marking
MPX5700GP/AP
867B
Side with Port Attached
MPX5700GS/AS
867E
Side with Port Attached
MPX5700ASX
867F
Side with Port Attached
MPX5700
Sensors
Freescale Semiconductor, Inc.
5
Pressure
PACKAGE DIMENSIONS
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
R
POSITIVE PRESSURE
(P1)
M
B
-AN
PIN 1
SEATING
PLANE
1
2
3
4
5
DIM
A
B
C
D
F
G
J
L
M
N
R
S
L
6
-TG
J
S
F
D 6 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
M
T A
M
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
OPEN
GROUND
-VOUT
VSUPPLY
+VOUT
OPEN
INCHES
MILLIMETERS
MAX
MIN
MAX MIN
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.027
0.033
0.68
0.84
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.090
0.105
2.29
2.66
OPEN
GROUND
+VOUT
+VSUPPLY
-VOUT
OPEN
CASE 867-08
ISSUE N
BASIC ELEMENT
P
0.25 (0.010)
M
T Q
-A-
M
U
W
X
R
PORT #1
POSITIVE
PRESSURE
(P1)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
L
V
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PRESSURE (P1)
N
-Q-
PORT #2
VACUUM
(P2)
B
PIN 1
1
C
SEATING
PLANE
-T-
-TJ
2
3
4
5
K
6
S
SEATING
PLANE
G
F
D 6 PL
0.13 (0.005)
M
A
M
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
W
X
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.405
0.435
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.063
0.083
0.220
0.240
0.910 BSC
0.182
0.194
0.310
0.330
0.248
0.278
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
10.29
11.05
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
1.60
2.11
5.59
6.10
23.11 BSC
4.62
4.93
7.87
8.38
6.30
7.06
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867C-05
ISSUE F
PRESSURE AND VACUUM SIDES PORTED (DP)
MPX5700
6
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 867B-04
ISSUE G
PRESSURE SIDE PORTED (AP, GP)
MPX5700
Sensors
Freescale Semiconductor, Inc.
7
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 867B-04
ISSUE G
PRESSURE SIDE PORTED (AP, GP)
MPX5700
8
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
-B-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A
C
DIM
A
B
C
D
E
F
G
J
K
N
S
V
V
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
6
K
4
3
2
1
S
J
N
5
G
F
E
D 6 PL
-T-
0.13 (0.005)
M
T B
M
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
0.720 17.53
18.28
0.690
6.22
6.48
0.245
0.255
20.82
0.780
0.820 19.81
0.84
0.027
0.033
0.69
0.178
0.186
4.52
4.72
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.41
0.345
0.375
8.76
9.53
0.310
7.62
7.87
0.300
0.240
5.59
6.10
0.220
0.194
4.62
4.93
0.182
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867E-03
ISSUE D
PRESSURE SIDE PORTED (AS, GS)
-TC
A
E
-Q-
U
N
V
B
R
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
-P0.25 (0.010)
T Q
M
6
M
5
4
3
2
1
S
K
J
0.13 (0.005)
M
T P
S
D 6 PL
Q S
G
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
27.43
28.45
1.080 1.120
19.30
18.80
0.740 0.760
16.00
16.51
0.630 0.650
0.68
0.84
0.027 0.033
4.57
4.06
0.160 0.180
1.22
1.63
0.048 0.064
0.100 BSC
2.54 BSC
0.41
0.36
0.014 0.016
0.220 0.240
5.59
6.10
2.03
0.070 0.080
1.78
4.06
3.81
0.150 0.160
3.81
4.06
0.150 0.160
0.440 0.460
11.18
11.68
17.65
18.42
0.695 0.725
21.34
21.84
0.840 0.860
0.182 0.194
4.62
4.93
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867F-03
ISSUE D
PRESSURE SIDE AXIAL PORT (ASX)
MPX5700
Sensors
Freescale Semiconductor, Inc.
9
Pressure
Table 3. Revision History
Revision
number
Revision
date
10
10/2012
Description of changes
• On page 1, added a table note to the Ordering Information table indicating that the device
MPX5700GP1 has 90 degree lead form.
MPX5700
10
Sensors
Freescale Semiconductor, Inc.
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MPX5700
Rev. 10
10/2012
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