Data Sheet

Pressure
Freescale Semiconductor
+
MPX4100A
Rev 9, 1/2009
Integrated Silicon Pressure Sensor
for Manifold Absolute Pressure
Applications On-Chip Signal
Conditioned, Temperature
Compensated and Calibrated
The MPX4100A series Manifold Absolute Pressure (MAP) sensor for
engine control is designed to sense absolute air pressure within the intake
manifold. This measurement can be used to compute the amount of fuel
required for each cylinder. The small form factor and high reliability of on-chip
integration makes the MAP sensor a logical and economical choice for
automotive system designers.
The MPX4100A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output
signal that is proportional to applied pressure.
MPX4100A
Series
20 to 105 kPa (2.9 to 15.2 psi)
0.3 to 4.9 V Output
Application Examples
• Manifold Sensing for Automotive
Systems
• Also Ideal for Non-Automotive
Applications
Features
•
•
•
•
•
•
•
•
1.8% Maximum Error Over 0° to 85°C
Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems
Ideally Suited for Microprocessor Interfacing or Microcontroller Based Systems
Temperature Compensated Over -40°C to +125°C
Durable Epoxy Unibody Element
Ideal for Non-Automotive Applications
Available as Standard Fluorosilicone Gel (MPXA4100A, MPX4100A) or Media Resistant Gel (MPXAZ4100A)
Durable Thermoplastic (PPS) Surface Mount Package
ORDERING INFORMATION
Package
Device Name
Options
Unibody Package (MPX4100A Series)
MPX4100A
Trays
MPX4100AP
Trays
Case
No.
None
867-08
•
# of Ports
Single
Dual
•
•
867B-04
MPX4100AS
Trays
867E-03
Small Outline Package (MPXAZ4100A Series) (Media Resistant Gel)
MPXAZ4100A6U
Rails
482
•
MPXAZ4100AC6U
Rails
482A
•
Small Outline Package (MPXA4100A Series)
MPXA4100A6T1
Tape and Reel
482
MPXA4100AC6U
Rails
482A
MPXA4100A6U
Rails
482
•
•
•
© Freescale Semiconductor, Inc., 2005-2009. All rights reserved.
Gauge
Pressure Type
Differential
Absolute
Device Marking
•
•
•
MPX4100A
•
•
MPXAZ4100A
•
•
•
MPXA4100A
MPX4100AP
MPX4100AS
MPXAZ4100A
MPXA4100A
MPXA4100A
Pressure
UNIBODY PACKAGES
MPX4100A
CASE 867-08
MPX4100AP
CASE 867B-04
MPX4100AS
CASE 867E-03
SMALL OUTLINE PACKAGES
MPXAZ4100A6U
MPXA4100A6U/T1
CASE 482-01
MPXAZ4100AC6U
MPXA4100AC6U
CASE 482A-01
MPX4100A
2
Sensors
Freescale Semiconductor
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 3 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
POP
20
—
105
kPa
Supply Voltage(2)
VS
4.85
5.1
5.35
Vdc
Supply Current
Io
—
7.0
10
mAdc
Pressure Range
(1)
Minimum Pressure Offset
@ VS = 5.1 Volts(3)
(0 to 85°C)
Voff
0.225
0.306
0.388
Vdc
Full Scale Output
@ VS = 5.1 Volts(4)
(0 to 85°C)
VFSO
4.816
4.897
4.978
Vdc
Full Scale Span
@ VS = 5.1 Volts(5)
(0 to 85°C)
VFSS
—
4.59
—
Vdc
Accuracy(6)
(0 to 85°C)
—
—
—
±1.8
%VFSS
V/P
—
54
—
mV/kPa
Response Time(7)
tR
—
1.0
—
ms
Output Source Current at Full Scale Output
Io+
—
0.1
—
mAdc
Warm-Up Time(8)
—
—
20
—
ms
—
—
±0.5
—
%VFSS
Sensitivity
Offset Stability
(9)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
Linearity:
Temperature Hysteresis:
Pressure Hysteresis:
TcSpan:
TcOffset:
Variation from Nominal:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX4100A
Sensors
Freescale Semiconductor
3
Pressure
Maximum Ratings
Table 2. MAXIMUM RATINGS(1)
Rating
Symbol
Value
Unit
PMAX
400
kPa
Storage Temperature
Tstg
-40 to +125
°C
Operating Temperature
TA
-40 to +125
°C
Maximum Pressure (P1 > P2)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
3 (Unibody)
2 (Small Outline Package)
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
2 (Unibody)
3 (Small Outline Package)
VOUT
1 (Unibody)
4 (Small Outline Package)
Pins 4, 5, and 6 are NO CONNECTS
for unibody package devices.
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package devices.
Figure 1. Fully Integrated Pressure Sensor Schematic
for Unibody Package and Small Outline Package
MPX4100A
4
Sensors
Freescale Semiconductor
Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates an absolute sensing chip in the basic
chip carrier (Case 867). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the sensor
diaphragm. The MPX4100A series pressure sensor
operating characteristics, and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse effects on
sensor performance and long-term reliability. Contact the
factory for information regarding media compatibility in your
application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 3.
(The output will saturate outside of the specified pressure
range.)
Fluoro Silicone
Gel Die Coat
Stainless Steel
Metal Cover
Epoxy Plastic
Case
Wire Bond
Lead Frame
Die
Bond
Absolute Element
P2
Figure 2. Cross-Sectional Diagram (not to scale)
+5 V
Output
Vout
Vs
IPS
1.0 μF
0.01 μF
GND
470 pF
Figure 3. Recommended Power Supply Decoupling and Output Filtering
(For output filtering recommendations, refer to Application Note AN1646.)
5.0
4.5
4.0
3.5
Output (Volts)
3.0
Transfer Function:
VOUT = VS* (.01059*P-0.1518) ± Error
VS = 5.1 Vdc
TEMP = 0 to 85°C
20 kPa to 105 kPa
MAX
MPX4100A
TYP
2.5
2.0
1.5
MIN
1.0
0.5
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
0
Pressure (ref. to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
MPX4100A
Sensors
Freescale Semiconductor
5
Pressure
Transfer Function (MPX4100A)
Nominal Transfer Value:
Vout = VS (P x 0.01059 - 0.1518)
± (Pressure Error x Temp. Factor x 0.01059 x VS)
VS = 5.1 V ± 0.25 Vdc
Temperature Error Band
MPX4100A Series
4.0
3.0
Temperature
Error
Factor
2.0
Temp
Multiplier
- 40
0 to 85
+125
3
1
3
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0°C to-40°C and from 85°C to 125°C.
Pressure Error Band
Error Limits for Pressure
3.0
Pressure Error (kPa)
2.0
1.0
0.0
-1.0
20
40
60
80
100
120
Pressure (in kPa)
-2.0
-3.0
Pressure
20 to 105 (kPa)
Error (Max)
±1.5 (kPa)
MPX4100A
6
Sensors
Freescale Semiconductor
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
The two sides of the pressure sensor are designated as
the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel,
which protects the die from harsh media. The MPX pressure
Part Number
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table:
Case Type
MPX4100A
867
Pressure (P1) Side Identifier
Stainless Steel Cap
MPX4100AP
867B
Side with Part Marking
MPX4100AS
867E
Side with Port Attached
MPXAZ4100A6U, MPXA4100A6U/TI
482
Side with Part Marking
MPXAZ4100AC6U, MPXA4100AC6U
482A
Side with Port Attached
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
SCALE 2:1
Figure 5. SOP Footprint (Case 482)
MPX4100A
Sensors
Freescale Semiconductor
7
Pressure
PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
5
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
N
H
C
J
-TSEATING
PLANE
PIN 1 IDENTIFIER
K
M
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.212 0.230
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.405 0.415
0.709 0.725
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
5.38
5.84
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
10.29
10.54
18.01
18.41
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
-A-
D
4
0.25 (0.010)
5
N
8 PL
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
W
V
C
H
J
-TK
M
PIN 1 IDENTIFIER
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
SEATING
PLANE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX4100A
8
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
C
R
POSITIVE PRESSURE
(P1)
M
B
-AN
PIN 1
SEATING
PLANE
1
2
3
4
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
DIM
A
B
C
D
F
G
J
L
M
N
R
S
L
6
-TG
J
S
F
D 6 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
OPEN
GROUND
-VOUT
VSUPPLY
+VOUT
OPEN
M
T A
M
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
INCHES
MILLIMETERS
MAX
MIN
MAX MIN
16.00
0.595
0.630 15.11
13.56
0.514
0.534 13.06
5.59
0.200
0.220
5.08
0.84
0.027
0.033
0.68
1.63
0.048
0.064
1.22
0.100 BSC
2.54 BSC
0.40
0.014
0.016
0.36
18.42
0.695
0.725 17.65
30˚ NOM
30˚ NOM
12.57
0.475
0.495 12.07
11.43
0.430
0.450 10.92
0.090
0.105
2.29
2.66
OPEN
GROUND
+VOUT
+VSUPPLY
-VOUT
OPEN
CASE 867-08
ISSUE N
BASIC ELEMENT
MPX4100A
Sensors
Freescale Semiconductor
9
Pressure
PACKAGE DIMENSIONS
-B-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A
C
DIM
A
B
C
D
E
F
G
J
K
N
S
V
V
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
6
K
J
N
5
-T-
3
2
1
S
G
F
E
4
D 6 PL
0.13 (0.005)
M
T B
M
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
0.690
0.720 17.53
18.28
0.245
0.255
6.22
6.48
0.780
0.820 19.81
20.82
0.027
0.033
0.69
0.84
0.178
0.186
4.52
4.72
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.41
0.345
0.375
8.76
9.53
0.300
0.310
7.62
7.87
0.220
0.240
5.59
6.10
0.182
0.194
4.62
4.93
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867E-O3
ISSUE D
STOVE PIPE PORT (AS)
MPX4100A
10
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 867B-04
ISSUE G
PORTED (AP)
MPX4100A
Sensors
Freescale Semiconductor
11
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 867B-04
ISSUE G
PORTED (AP)
MPX4100A
12
Sensors
Freescale Semiconductor
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MPX4100A
Rev. 9
1/2009
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