Pressure Freescale Semiconductor + MPX4100A Rev 9, 1/2009 Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPX4100A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The small form factor and high reliability of on-chip integration makes the MAP sensor a logical and economical choice for automotive system designers. The MPX4100A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. MPX4100A Series 20 to 105 kPa (2.9 to 15.2 psi) 0.3 to 4.9 V Output Application Examples • Manifold Sensing for Automotive Systems • Also Ideal for Non-Automotive Applications Features • • • • • • • • 1.8% Maximum Error Over 0° to 85°C Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems Ideally Suited for Microprocessor Interfacing or Microcontroller Based Systems Temperature Compensated Over -40°C to +125°C Durable Epoxy Unibody Element Ideal for Non-Automotive Applications Available as Standard Fluorosilicone Gel (MPXA4100A, MPX4100A) or Media Resistant Gel (MPXAZ4100A) Durable Thermoplastic (PPS) Surface Mount Package ORDERING INFORMATION Package Device Name Options Unibody Package (MPX4100A Series) MPX4100A Trays MPX4100AP Trays Case No. None 867-08 • # of Ports Single Dual • • 867B-04 MPX4100AS Trays 867E-03 Small Outline Package (MPXAZ4100A Series) (Media Resistant Gel) MPXAZ4100A6U Rails 482 • MPXAZ4100AC6U Rails 482A • Small Outline Package (MPXA4100A Series) MPXA4100A6T1 Tape and Reel 482 MPXA4100AC6U Rails 482A MPXA4100A6U Rails 482 • • • © Freescale Semiconductor, Inc., 2005-2009. All rights reserved. Gauge Pressure Type Differential Absolute Device Marking • • • MPX4100A • • MPXAZ4100A • • • MPXA4100A MPX4100AP MPX4100AS MPXAZ4100A MPXA4100A MPXA4100A Pressure UNIBODY PACKAGES MPX4100A CASE 867-08 MPX4100AP CASE 867B-04 MPX4100AS CASE 867E-03 SMALL OUTLINE PACKAGES MPXAZ4100A6U MPXA4100A6U/T1 CASE 482-01 MPXAZ4100AC6U MPXA4100AC6U CASE 482A-01 MPX4100A 2 Sensors Freescale Semiconductor Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit POP 20 — 105 kPa Supply Voltage(2) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Pressure Range (1) Minimum Pressure Offset @ VS = 5.1 Volts(3) (0 to 85°C) Voff 0.225 0.306 0.388 Vdc Full Scale Output @ VS = 5.1 Volts(4) (0 to 85°C) VFSO 4.816 4.897 4.978 Vdc Full Scale Span @ VS = 5.1 Volts(5) (0 to 85°C) VFSS — 4.59 — Vdc Accuracy(6) (0 to 85°C) — — — ±1.8 %VFSS V/P — 54 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm-Up Time(8) — — 20 — ms — — ±0.5 — %VFSS Sensitivity Offset Stability (9) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: TcSpan: TcOffset: Variation from Nominal: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. Output deviation over the temperature range of 0 to 85°C, relative to 25°C. Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX4100A Sensors Freescale Semiconductor 3 Pressure Maximum Ratings Table 2. MAXIMUM RATINGS(1) Rating Symbol Value Unit PMAX 400 kPa Storage Temperature Tstg -40 to +125 °C Operating Temperature TA -40 to +125 °C Maximum Pressure (P1 > P2) 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 3 (Unibody) 2 (Small Outline Package) Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry 2 (Unibody) 3 (Small Outline Package) VOUT 1 (Unibody) 4 (Small Outline Package) Pins 4, 5, and 6 are NO CONNECTS for unibody package devices. Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package devices. Figure 1. Fully Integrated Pressure Sensor Schematic for Unibody Package and Small Outline Package MPX4100A 4 Sensors Freescale Semiconductor Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates an absolute sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4100A series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 3. (The output will saturate outside of the specified pressure range.) Fluoro Silicone Gel Die Coat Stainless Steel Metal Cover Epoxy Plastic Case Wire Bond Lead Frame Die Bond Absolute Element P2 Figure 2. Cross-Sectional Diagram (not to scale) +5 V Output Vout Vs IPS 1.0 μF 0.01 μF GND 470 pF Figure 3. Recommended Power Supply Decoupling and Output Filtering (For output filtering recommendations, refer to Application Note AN1646.) 5.0 4.5 4.0 3.5 Output (Volts) 3.0 Transfer Function: VOUT = VS* (.01059*P-0.1518) ± Error VS = 5.1 Vdc TEMP = 0 to 85°C 20 kPa to 105 kPa MAX MPX4100A TYP 2.5 2.0 1.5 MIN 1.0 0.5 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 0 Pressure (ref. to sealed vacuum) in kPa Figure 4. Output versus Absolute Pressure MPX4100A Sensors Freescale Semiconductor 5 Pressure Transfer Function (MPX4100A) Nominal Transfer Value: Vout = VS (P x 0.01059 - 0.1518) ± (Pressure Error x Temp. Factor x 0.01059 x VS) VS = 5.1 V ± 0.25 Vdc Temperature Error Band MPX4100A Series 4.0 3.0 Temperature Error Factor 2.0 Temp Multiplier - 40 0 to 85 +125 3 1 3 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to-40°C and from 85°C to 125°C. Pressure Error Band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 0.0 -1.0 20 40 60 80 100 120 Pressure (in kPa) -2.0 -3.0 Pressure 20 to 105 (kPa) Error (Max) ±1.5 (kPa) MPX4100A 6 Sensors Freescale Semiconductor Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE The two sides of the pressure sensor are designated as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel, which protects the die from harsh media. The MPX pressure Part Number sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table: Case Type MPX4100A 867 Pressure (P1) Side Identifier Stainless Steel Cap MPX4100AP 867B Side with Part Marking MPX4100AS 867E Side with Port Attached MPXAZ4100A6U, MPXA4100A6U/TI 482 Side with Part Marking MPXAZ4100AC6U, MPXA4100AC6U 482A Side with Port Attached INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) MPX4100A Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S DIM A B C D G H J K M N S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPX4100A 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS C R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30˚ NOM 30˚ NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN CASE 867-08 ISSUE N BASIC ELEMENT MPX4100A Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS -B- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A C DIM A B C D E F G J K N S V V PIN 1 PORT #1 POSITIVE PRESSURE (P1) 6 K J N 5 -T- 3 2 1 S G F E 4 D 6 PL 0.13 (0.005) M T B M INCHES MILLIMETERS MIN MAX MIN MAX 0.690 0.720 17.53 18.28 0.245 0.255 6.22 6.48 0.780 0.820 19.81 20.82 0.027 0.033 0.69 0.84 0.178 0.186 4.52 4.72 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.345 0.375 8.76 9.53 0.300 0.310 7.62 7.87 0.220 0.240 5.59 6.10 0.182 0.194 4.62 4.93 STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX CASE 867E-O3 ISSUE D STOVE PIPE PORT (AS) MPX4100A 10 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G PORTED (AP) MPX4100A Sensors Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G PORTED (AP) MPX4100A 12 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 010 5879 8000 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 [email protected] MPX4100A Rev. 9 1/2009 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved.