Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > 0201 MLA Series 0201 MLA Varistor Series RoHS Pb Description New 0201-size MLA Multi-Layer Varistor (MLV) series can protect small electronic products from electrostatic discharge (ESD) and electrically fast transients (EFT). It's ultra-compact 0201 size, the smallest form factor available for MLV devices, is ideal for compact handheld products. The MLA Series is manufactured from semiconducting ceramics, and is supplied in a leadless, surface mount package. Plating consists of Silver base material (which is fired on to the Zno dialectric), Nickel barrier plated under-layer and Matte-Tin outer surface plate. Features • Ultra-small 0201 size for minimal board space • Low capacitance (33pF) for high data rates to minimize signal distortion • Meets IEC 610004-2 for ESD • Low leakage (<25µa) • Multilayer ceramic construction technology Absolute Maximum Ratings Unit Steady State Applied Voltage: Maximum DC Voltage (VM(DC)) 5.5 V Maximum AC Voltage (VM(AC)RMS) 4.0 V 4.0 A Operating Ambient Temperature Range (TA) -40 to +85 ºC Storage Temperature Range (TSTG) -40 to +85 ºC Transient: Non-Repetitive Surge Current, 8/20µs Waveform, (ITM) • Inherently Bi-directional • Stable performance over wide operating and storage temperature range -40°C to +85°C • Operating voltage VM(DC) = 5.5V •Rated for surge current (8 x 20µs) • Pb-Free and RoHS Compliant Temperature: Applications • Portable / handheld • Data, diagnostic I/O ports electronic devices • Computer / DSP products • Mobile communications • Industrial instruments / cellular phones including non-life sustaing • USB, video and audio ports medical equipment • Analog signal / sensor lines Device Ratings and Specifications Maximum Ratings @ +85ºC Part Number V5.5MLA020133NR V5.5MLA020147NR V5.5MLA020164NR Maximum Continuous Working Voltage Maximum Nonrepetitive Surge Current (8/20µs) Specifications @ +25ºC Maximum Clamping Voltage at 1A (8/20µs) Nominal Voltage at 1mA DC Test Current Typical Capacitance at f = 1MHz VM(DC) VM(AC) ITM VC VN(DC) Min VN(DC) Max C (V) (V) (A) (V) (V) (V) (pF) 5.5 5.5 5.5 4.0 4.0 4.0 1 1 1 28.0* 26.0* 26.0* 8.0 8.0 8.0 14.0 14.0 14.0 33.0 47.0 64.0 Notes: - Typical leakage at 25ºC at VM(DC): 0201 size <10µA typical, <25µA maximum - End surface finish of Matte-Tin with Nickel under-layer on Silver base material - Standard packing quantity 15,000 per reel, 7" reel © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/17/15 Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > 0201 MLA Series 250 Reliability and Environmental Specifications MAXIMUM TEMPERATURE 230°C 200 Test Condition Solderability > 95% solder coverage 245 +/- ºC, 3 +/- 1 sec. Leaching Resistance > 95% solder coverage 245 +/- ºC, 3 +/- 1 sec. High Temperature Exposure ∆ Vv / Vv < 10% 1000 hours 100 85ºC, un-powered Thermal Shock ∆ Vv / Vv < 10% -45 to +85 ºC, 30 min. cycle, 5 PREHEAT cycles DWELL Operating Life ∆ Vv / Vv < 10% 85 ºC, DC working hours 50 voltage 1000 PREHEAT ZONE Bias Humidity ∆ Vv / Vv < 10% TEMPERATURE °C Judge Criteria 40-80 SECONDS ABOVE 183°C 150 RAMP RATE <2°C/s 40 ºC / 85% RH, DC working voltage 1000 hours 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 TIME (MINUTES) Lead–free (Pb-free) Soldering Recommendations Peak Pulse Current Test Waveform for Clamping Voltage FIGURE 14. REFLOW SOLDER PROFILE To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder 300 process should be rigidly controlled. MAXIMUM WAVE 260°C 50 0 T O1 TIME T1 T2 When250 using a reflow process, care should be taken to ensure200that the ML chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient 150 being 2 degrees per second. During the soldering SECOND PREHEAT process, preheating to within 100 degrees of the solder's 100 peak temperature is essential to minimize thermal shock. TEMPERATURE °C PERCENT OF PEAK VALUE 100 FIRST PREHEAT 01 = Virtual Origin of Wave T = Time from 10% to 90% of Peak T1FIGURE = Rise 2. Time = PULSE 1.25 x TCURRENT TEST WAVEFORM PEAK FOR CLAMPING VOLTAGE T2 = Decay Time Example - For an 8/20 µs Current Waveform: O1 =8µs VIRTUAL WAVE = T1 ORIGIN = RiseOF Time t = TIME FROM 10% TO 90% OF PEAK 20µs = T2 = Decay Time 50 soldering process has been completed, it is Once the still necessary to ensure that any further thermal shocks 0 are avoided. One possible cause of thermal shock is4.5 hot 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 printed circuit boards being removed TIME (MINUTES) from the solder process and subjected to cleaning solvents at room FIGURE 15. WAVE SOLDER PROFILE temperature. The boards must be allowed to cool gradually to less than 50º C before cleaning. t1 = VIRTUAL FRONT TIME = 1.25 x t t2 = VIRTUAL TIME TO HALF VALUE (IMPULSE DURATION) 300 Multilayer Internal Construction EXAMPLE: FOR AN 8/20 s CURRENT WAVEFORM 8 s = t1 = VIRTUAL FRONT TIME TEMPERATURE °C 20 s =FIRED t2 = VIRTUAL TIME TO CERAMIC DIELECTRIC HALF VALUE METAL ELECTRODES METAL END TERMINATION RAMP RATE <3˚C/s 200 60 - 150 SEC > 217˚C 150 100 PREHEAT ZONE 50 0 DEPLETION 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 TIME (MINUTES) REGION FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE DEPLETION REGION GRAINS FIGURE 11. MULTILAYER INTERNAL CONSTRUCTION © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/17/15 MAXIMUM TEMPERATURE 260˚C, TIME WITHIN 5˚C OF PEAK 20 SECONDS MAXIMUM 250 Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > 0201 MLA Series Product Dimensions (mm) PAD LAYOUT DIMENSIONS CHIP LAYOUT DIMENSIONS C E B NOTE D L W A NOTE : Avoid metal runs in this area, parts not NOTE: Avoid metal runs in this area. recommended for use in applications using Parts not recommended for use in Silver (Ag) epoxy paste. applications using silver epoxy paste. 0201 Size Dimension IN MM A 0.055 1.40 B 0.020 0.50 C 0.020 0.50 D (max.) 0.014 0.35 E 0.008 -/+0.004 0.20 -/+0.10 L 0.024 -/+0.002 0.60 -/+0.05 W 0.012 -/+0.002 0.30 -/+0.05 Part Numbering System V 5.5 MLA 0201 xx N R PACKING OPTIONS R = 7in (178mm) Diameter Reel, Paper Carrier Tape 15,000 items per reel DEVICE FAMILY Littelfuse TVSS Device MAXIMUM DC WORKING VOLTAGE END TERMINATION OPTION N = Nickel Barrier Option (Matte Tin outer surface, plated on Nickel underlayer plated on silver base metal) MULTILAYER SERIES DESIGNATOR CAPACITANCE OPTION 33 = 33pF 47 = 47pF 64 = 64pF DEVICE SIZE: 0201 = .024 inch x .012 inch (0.6 mm x 0.3 mm) Tape and Reel Specifications D0 PRODUCT IDENTIFYING LABEL P0 For T and H Pack Options: PLASTIC CARRIER TAPE For R Pack Options: EMBOSSED PAPER CARRIER TAPE P2 E F K0 W B0 t1 D1 P1 Symbol A0 EMBOSSMENT TOP TAPE Description Dimensions in Millimeters 8mm NOMINAL 178mm OR 330mm DIA. REEL 0201 A0 Width of Cavity 0.36 -/+0.02 B0 Length of Cavity 0.70 -/+0.02 W Width of Tape 8.0 -/+0.1 F Distance Between Drive Hole Centers and Cavity Centers 3.5 -/+0.05 E Distance Between Drive Hole Centers and Tape Edge 1.75 -/+0.05 P1 Distance Between Cavity Centers 2.0 -/+0.05 P2 Axial Drive Distance Between Drive Hole Centers & Cavity Centers 2.0 -/+0.05 P0 Axial Drive Distance Between Drive Hole Centers 4.0 -/+0.1 D0 Drive Hole Diameter 1.55 -/+0.05 T1 Top Tape Thickness 0.42 -/+0.02 NOTE: It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/17/15