LITTELFUSE V5.5MLA020147NR

Varistor Products
Surface Mount Multilayer Varistors (MLVs) > 0201 MLA Series
RoHS
0201 MLA Varistor Series
Description
New 0201-size MLA Multi-Layer Varistor (MLV) series can
protect small electronic products from electrostatic discharge
(ESD) and electrically fast transients (EFT).
It's ultra-compact 0201 size, the smallest form factor available
for MLV devices, is ideal for compact handheld products.
The ML Series is manufactured from semiconducting ceramics,
and is supplied in a leadless, surface mount package.
Features
• Ultra-small 0201 size for
minimal board space
• Low capacitance (33pF)
for high data rates to
minimize signal distortion
• Meets IEC 610004-2 for ESD
• Low leakage (<25μa)
• Multilayer ceramic
construction technology
Absolute Maximum Ratings
Unit
Steady State Applied Voltage:
Maximum DC Voltage (VM(DC))
5.5
V
Maximum AC Voltage (VM(AC)RMS)
4.0
V
4.0
A
Operating Ambient Temperature Range (TA)
-40 to +85
ºC
Storage Temperature Range (TSTG)
-40 to +85
ºC
Transient:
Non-Repetitive Surge Current, 8/20μs
Waveform, (ITM)
• Inherently Bi-directional
• Stable performance
over wide operating and
storage temperature
range -40°C to +85°C
• Operating voltage
VM(DC) = 5.5V
• Rated for surge
current (8 x 20μs)
Temperature:
Applications
• Portable / handheld
• Data, diagnostic I/O ports
electronic devices
• Computer / DSP products
• Mobile communications
• Industrial instruments
/ cellular phones
including non-life sustaing
• USB, video and audio ports
medical equipment
• Analog signal / sensor lines
Device Ratings and Specifications
Maximum Ratings @ +85ºC
Part Number
V5.5MLA020133NR
V5.5MLA020147NR
V5.5MLA020164NR
Maximum Continuous
Working Voltage
Maximum Nonrepetitive Surge
Current (8/20μs)
Specifications @ +25ºC
Maximum
Clamping Voltage
at 1A (8/20μs)
Typical
Nominal Voltage at 1mA
Capacitance at
DC Test Current
f = 1MHz
VM(DC)
VM(AC)
ITM
VC
VN(DC) Min
VN(DC) Max
C
(V)
(V)
(A)
(V)
(V)
(V)
(pF)
5.5
5.5
5.5
4.0
4.0
4.0
1
1
1
28.0*
26.0*
26.0*
8.0
8.0
8.0
14.0
14.0
14.0
33.0
47.0
64.0
Notes:
- Typical leakage at 25ºC at VM(DC): 0201 size <10μA typical, <25μA maximum
- End surface finish of Matte-Tin with Nickel under-layer on Silver base material
- Standard packing quantity 15,000 per reel, 7" reel
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/0201MLA.html for current information.
0201 MLA Varistor Series
Revision: June 28, 2010
0201 MLA Series
Plating consists of Silver base material (which is fired on to the
Zno dialectric), Nickel barrier plated under-layer and Matte-Tin
outer surface plate.
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > 0201 MLA Series
Reliability and Environmental Specifications
Judge Criteria
Test Condition
Solderability
> 95% solder coverage
245 +/- ºC, 3 +/- 1 sec.
Leaching Resistance
> 95% solder coverage
245 +/- ºC, 3 +/- 1 sec.
High Temperature Exposure
Δ Vv / Vv < 10%
1000 hours 85ºC, un-powered
Thermal Shock
Δ Vv / Vv < 10%
-45 to +85 ºC, 30 min. cycle, 5 cycles
Operating Life
Δ Vv / Vv < 10%
85 ºC, DC working voltage 1000 hours
Bias Humidity
Δ Vv / Vv < 10%
40 ºC / 85% RH, DC working voltage 1000 hours
Peak Pulse Current Test Waveform for Clamping Voltage
Lead–free (Pb-free) Soldering Recommendations
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
PERCENT OF PEAK VALUE
100
50
0
T
O1
TIME
T1
T2
01 = Virtual Origin of Wave
T = Time from 10% to 90% of Peak
T1 = Rise Time = 1.25 x T
T2 = Decay Time
Example - For an 8/20 μs Current Waveform:
8μs = T1 = Rise Time
20μs = T2 = Decay Time
When using a reflow process, care should be taken to
ensure that the ML chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50º C before cleaning.
300
Multilayer Internal Construction
MAXIMUM TEMPERATURE 260˚C,
TIME WITHIN 5˚C OF PEAK
20 SECONDS MAXIMUM
TEMPERATURE °C
250
FIRED CERAMIC
DIELECTRIC
RAMP RATE
<3˚C/s
200
60 - 150 SEC
> 217˚C
150
100
PREHEAT ZONE
50
METAL
ELECTRODES
METAL END
TERMINATION
0
DEPLETION
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
TIME (MINUTES)
REGION
DEPLETION
REGION
GRAINS
0201 MLA Varistor Series
Revision: June 28, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/0201MLA.html for current information.
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > 0201 MLA Series
Product Dimensions (mm)
CHIP LAYOUT DIMENSIONS
E
B
NOTE
D
L
W
A
NOTE : Avoid metal runs in this area, parts not
recommended for use in applications using
Silver (Ag) epoxy paste.
0201 Size
Dimension
IN
MM
A
0.055
1.40
B
0.020
0.50
C
0.020
0.50
D (max.)
0.014
0.35
E
0.008 -/+0.004
0.20 -/+0.10
L
0.024 -/+0.002
0.60 -/+0.05
W
0.012 -/+0.002
0.30 -/+0.05
0201 MLA Series
PAD LAYOUT DIMENSIONS
C
Part Numbering System
V 5.5 MLA 0201 xx N R
PACKING OPTIONS
R = 7in (178mm) Diameter Reel, Paper Carrier Tape
15,000 items per reel
DEVICE FAMILY
Littelfuse TVSS Device
MAXIMUM DC
WORKING VOLTAGE
END TERMINATION OPTION
N = Nickel Barrier Option
(Matte Tin outer surface, plated on Nickel underlayer
plated on silver base metal)
MULTILAYER SERIES
DESIGNATOR
CAPACITANCE OPTION
33 = 33pF
47 = 47pF
64 = 64pF
DEVICE SIZE:
0201 = .024 inch x .012 inch
(0.6 mm x 0.3 mm)
Tape and Reel Specifications
D0
PRODUCT
IDENTIFYING
LABEL
P0
For T and H Pack Options: PLASTIC CARRIER TAPE
For R Pack Options: EMBOSSED PAPER CARRIER TAPE
P2
E
F
K0
W
B0
t1
D1
P1
Symbol
A0
EMBOSSMENT
TOP TAPE
Description
Dimensions in
Millimeters
8mm
NOMINAL
178mm
OR 330mm
DIA. REEL
0201
A0
Width of Cavity
0.36 -/+0.02
B0
Length of Cavity
0.70 -/+0.02
W
Width of Tape
8.0 -/+0.1
F
Distance Between Drive Hole Centers and Cavity Centers
3.5 -/+0.05
E
Distance Between Drive Hole Centers and Tape Edge
1.75 -/+0.05
P1
Distance Between Cavity Centers
2.0 -/+0.05
P2
Axial Drive Distance Between Drive Hole Centers & Cavity Centers
2.0 -/+0.05
P0
Axial Drive Distance Between Drive Hole Centers
D0
Drive Hole Diameter
1.55 -/+0.05
4.0 -/+0.1
T1
Top Tape Thickness
0.42 -/+0.02
NOTE: It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/0201MLA.html for current information.
0201 MLA Varistor Series
Revision: June 28, 2010