Application Brochure Battery Powered Applications

Selection Guide for
Battery Powered Motor Drives
Designed to Drive Your Innovation
www.infineon.com/motorcontrol
Ictam quodita dolorep
300W Motor Control Application Kit
A High Efficiency Demonstrator Driving Your Innovation
The 300W Motor Control Application Kit features Infineon’s OptiMOS™ technology,
providing a simple to use Evaluation Board for testing and analyzing any brushless DC motor
equipped with hall sensors. The components of the board include 6 pieces of OptiMOS™
(BSC016N06N3 G), an EiceDRIVER™ (6ED003L02-F2) and a Microcontroller (XC836).
Together they enable brushless DC motors to run up to 300W without additional cooling.
Key features and benefits
n High efficiency MOSFETs and MCU
n Easy plug and play software with Graphical User Interface
for fast testing of the board
n Suitable for any BLDC motors with hall sensors
n Optimized thermal management
n Voltage, current and speed control possible
For further information please visit our website:
www.infineon.com/motorcontrolapplicationkit
2
Watch the Video!
Solution Matrix
Solution Matrix for Battery Powered Motor Drives
Offering Industry’s Leading High Performance Products
Based on Industry Leading Technology, highest quality
and manufacturing expertise Infineon provides a variety
of innovative power semiconductors which enables
Cordless Tools
MOSFET
designers to develop highly reliable and efficient
solutions for all kinds of drive applications.
Light
Electric
Vehicle
OptiMOS™ 20V-60V
Forklift
OptiMOS™ 60V-150V
Small Signal (SOT-363, TSOP-6)
Driver ICs
EiceDRIVER™ Compact (2EDL23N06)
EiceDRIVER™ Compact
(2EDL05N06, 6EDL04N02PR, 6ED003L02-F2)
Microcontroller
XMC 4000
XMC 1000
Showing only drives dedicated devices. For complete portfolio, please check our homepage www.infineon.com
3
Forklift Solution
Forklift Solution
Highest Performance and Innovative Solutions
Requirements such as highest current capability, optimized
thermal performance and reliable operation in harsh
environments are essential for all kinds of Forklift designs.
Therefore, Infineon offers a broad range of products
demonstrating lowest RDS(on), highest current capability up to
300A and a wide selection of innovative package solutions.
XMC-Microcontroller
Sensor
Controller
OptiMOS™
Brushless
DC Motor
EiceDRIVER™
Driver Stage
Sensor
Sensor
DC /DC
Regulators
Infineon’s OptiMOS™ for Forklift Applications
4
System Voltage Class
Voltage Class
D2PAK
D2PAK 7pin
TO-Leadless
24V
60V
IPB029N06N3 G
IPB010N06N
IPT007N06N
36V
80V
IPB025N08N3 G
IPB019N08N3 G
48V
100V
IPB027N10N3 G
IPB025N10N3 G
IPT020N10N3
72V/ 80V
150V
IPB 072N15N3 G
IPB065N15N3 G
IPT059N15N3
Forklift Solution
Infineon’s EiceDRIVER™ for Forklift Applications
Topology
DSO-8
DSO-14
Halfbridge
2EDL05N06PF
2EDL23N06PJ
Infineon’s ARM® Cortex™ based Microcontroller Family
XMC4100
System
XMC4200
Core
CPU Frequency
80MHz
80MHz
Co-Processor
Timers
Signal Processing
Communication
XMC4400
XMC4500
ARM® Cortex™ M4
120MHz
120MHz
Floating Point Unit
Flash Size
128kB
256kB
512kB
1MB
RAM Size
20kB
40kB
80kB
160kB
Cache
4kB
4kB
4kB
4kB
POSIF
1x
1x
2x
2x
CCU4 (4ch)
2x
2x
4x
4x
CCU8 (4ch)
1x
1x
2x
2x
High-resolution PWM (150ps) Channels
4x
4x
4x
-
ADC 12-bit
2x
2x
4x
4x
Δ∑ Demodulator
-
-
4x
4x
DAC
2x
2x
2x
2x
IEEE 15BB Ethernet MAC
-
-
1x
1x
USB
FS DEV
FS DEV
FS OTG
FS OTG
-
-
-

SDIO/SD/MMC
Serial Channels (UART, SPI, I C, I S)
4x
4x
4x
4x
External Memory I/F
-
-
-

CAN
2x
2x
2x
3x
2
2
5
Cordless Tool Solution
Cordless Tool Solution
Highest Power Density and System Efficiency
Depending on the topology, cordless tools require either
space optimized designs for system miniaturization or
cost optimized solutions to decrease total system costs.
For both requirements Infineon offers the right products
with low RDS(on) in compact packages such as SuperSO8 and
products at an excellent price/performance ratio without
sacrificing product performance and reliability.
XMC-Microcontroller
OptiMOS™
Sensor
Controller
Brushless
DC Motor
Driver Stage
OptiMOS™
Brushed
DC Motor
Sensor
EiceDRIVER™
EiceDRIVER™
Driver Stage
Sensor
DC /DC
Regulators
Infineon’s OptiMOS™ for Cordless Tools
6
System Voltage Class
Voltage Class
< 18V
30V
≥ 18V - 24V
40V
36V
60V
TO-220
SuperSO8
CanPAK™
BSC011N03LS
BSB012N03LX3 G
IPP015N04N G
BSC010N04LS
BSB014N04LX3 G
IPP024N06N3 G
BSC014N06NS
BSB028N06NN3 G
Cordless Tool Solution
Infineon’s EiceDRIVER™ for Cordless Tools
Topology
DSO-8
DSO-14
Halfbridge
2EDL05N06PF
2EDL05N06PJ
3-Phase (B6)
TSSOP-28
6EDL04N02PR
6ED003L06-F2
Infineon’s ARM® Cortex™ based Microcontroller Family
XMC1300
System Performance
Timers
Signal Processing
Core
ARM® Cortex™ M0
CPU Frequency
32 MHz
Co-Processor
MATH
Flash Size
8-200kB
RAM Size
16kB
POSIF
1x
CCU4 (4ch)
1x
CCU8 (4ch)
1x
ADC 12-bit
1x (2x S&H)
Coparator
3x
Communication
Serial Channels (UART, SPI, I2, I2S)
2 Channel
Application Specific
LED Dimming & Color Control

7
Light Electric Vehicle Solution
Light Electric Vehicle Solution
Performance Leadership and System Solution
With a broad portfolio of Microcontrollers and power
devices Infineon is able to meet a wide range of
requirements for Light Electric Vehicles such as e-Scooters,
Pedelecs or Microcars. Our products demonstrate
outstanding reliability and quality as well as a very high
current capability and excellent thermal performance.
XMC-Microcontroller
Sensor
Controller
OptiMOS™
Brushless
DC Motor
EiceDRIVER™
Driver Stage
Sensor
Sensor
DC /DC
Regulators
Infineon’s OptiMOS™ for Light Electric Vehicles
8
System Voltage Class
Voltage Class
24V
60V
D2PAK
D2PAK 7pin
TO-Leadless
TO-220
IPP032N06N3 G
75V
IPB020NE7N3
36V
80V
IPB025N08N3 G
IPB019N08N3 G
48V
100V
IPB027N10N3 G
IPB025N10N3 G
IPT020N10N3
72V
150V
IPB072N15N3 G
IPB065N15N3 G
IPT059N15N3
IPP034NE7N3
IPP037N08N3
IPP045N10N3
Light Electric Vehicle Solution
Infineon’s EiceDRIVER™ for Light Electric Vehicles
Topology
DSO-8
DSO-14
Halfbridge
2EDL05N06PF
2EDL05N06PJ
TSSOP-28
3-Phase (B6)
6EDL04N02PR
6ED003L06-F2
Infineon’s ARM® Cortex™ based Microcontroller Family
XMC4100
System
XMC4200
Core
CPU Frequency
80MHz
80MHz
Co-Processor
Timers
Signal Processing
Communication
XMC4500
120MHz
120MHz
Floating Point Unit
Flash Size
128kB
256kB
512kB
1MB
RAM Size
20kB
40kB
80kB
160kB
Cache
4kB
4kB
4kB
4kB
POSIF
1x
1x
2x
2x
CCU4 (4ch)
2x
2x
4x
4x
CCU8 (4ch)
1x
1x
2x
2x
High-resolution PWM (150ps) Channels
4x
4x
4x
-
ADC 12-bit
2x
2x
4x
4x
Δ∑ Demodulator
-
-
4x
4x
DAC
2x
2x
2x
2x
IEEE 15BB Ethernet MAC
-
-
1x
1x
USB
FS DEV
FS DEV
FS OTG
FS OTG
-
-
-

SDIO/SD/MMC
Serial Channels (UART, SPI, I C, I S)
4x
4x
4x
6x
External Memory I/F
-
-
-

2
Application Specific
XMC4400
ARM® Cortex™ M4
2
CAN
2x
2x
2x
3x
Touch Control / LED Display Matrix




9
MOSFETs
Always a Step Ahead with Infineon
Leverage your Performance
Within the motor control market segment low voltage applications include
the sub segment battery powered applications. These are high current
applications such as Forklift, e-Scooter, Pedelecs or Cordless Power Tools with
a wide range of system power from 1W to 50kW.
These applications require:
„„ extension of battery lifetime and range
„„ reliable operation in harsh environments
„„ system miniaturization and cost reduction
Features
„„ optimized thermal management
„„ High current capability
„„ Lowest RDS(on)
„„ Easy-to-design products
„„ Outstanding product quality
Benefits
„„ Enables optimized
thermal management
Infineon offers a comprehensive motor control and drives solution portfolio
containing leading edge technologies in low voltage Power MOSFETs,
Driver ICs, position sensors (hall and angle sensors) and the newest ARM®
Cortex™-M4 based MCU. These products enable efficient, robust and costeffective designs for all types of motors.
„„ Enables system cost reduction & system
miniaturization
„„ Extending battery lifetime
OptiMOS™ – the right switch for each battery powered drive application
„„ Reliable operation in
harsh environments
300
250
200
HOTTER
MOSFET Voltage [V]
150
120
100
75/80
60
40
30
25
0
www.infineon.com/optimos
10
12
24
36
48
72
System Voltage [V]
80
100
150
Soloreiust cone pratende
TO-Leadless
A Package Optimized for High Current Applications
Infineon’s new TO-Leadless package is especially designed for high current applications such as
Forklift, Light Electric Vehicles, e-fuse, PoL (Point of Load) and Telecom where highest efficiency
and reliability are required. 300A continuous current can now be handled using just one single
part. Furthermore, compared to D2PAK 7pin, this significantly smaller package with 60% size
reduction offers a very compact design and a substantial reduction of 30% in the footprint.
Key features and benefits
n Industry’s lowest RDS(on), reduced footprint and space
– Enables highest efficiency and system cost reduction
n
n
Highest current capability up to 300A
– Requires less cooling
Reduced package parasitics
– Enables improved EMI-performance
– Lower package losses
For further information please visit our Website:
www.infineon.com/toll
Watch the Video!
11
MOSFETs
Power MOSFETs OptiMOS™ 20V-300V
The Right MOSFET for Each System
Highest efficiency with SuperSO8
Moving from TO-220 to SuperSO8 reduces
space consumption drastically and offers
lower parasitic, highest efficiency and lowest design effort due to reduced spikes.
Infineon provides a comprehensive portfolio of low voltage MOSFETs
supporting all requirements for Battery Powered Applications. The Power
MOSFET family - OptiMOS™ 20V up to 300V is consistently setting the
benchmark in key specifications for drives system designs, including leading
on-state resistance or highest current capability which lead to reduced power
losses and improved system reliability.
Infineon’s OptiMOS™ is available in innovative packages which are either
optimized for space saving such as CanPAK™ or SuperSO8 or optimized for
high current such as TO-Leadless.
D²PAK optimized for
high power applications
A change from TO-220 to D2PAK 7pin gives
several advantages and offers an ideal
combination of industry’s lowest RDS(on)
and high current capability. Furthermore,
it comes with very low package parasitics
and enables highest system reliability due
to no hot spot.
Thermal Resistance [K/W]
2.5
2.0
HOTTER
S308
DPAK
1.5
1.0
SuperSO8
0.5
0
CanPAK™ S/M
COOLER
SMALLER
25
50
100
D2PAK 7pin
D2PAK
TO-Leadless
150
200
TO-220
LARGER
250
300
350
Package Area [mm²]
Benefits of Infineon components
Reliable and robust products for highest system durability and reliability
„„ Lowest RDS(on) 0.7mΩ in TOLL and highest current 300A capability for
highest system efficiency
„„ Small form factors for compact design e.g. SuperS08 30mm², TOLL 115mm²
TO-Leadless – industry’s highest
current capability
TO-Leadless is a package optimized for
high current applications with a current
capability of 300A. It enables compact designs due to reduced footprint and height
compact designs.
12
leading to reduction of overall system size and cost
„„ Evaluation boards for fast prototyping and testing and in-depth system
support enable reduction of development time and cost
MOSFETs
Small Signal
The Perfect Fit for your Battery Powered Application
SOT-223
TSOP6
SOT-89
SC-59
SOT-23
SOT-323
SOT-363
Voltage
-250
P-Channel MOSFETs
-100
-60
BSP317P
4Ω, -0.43A, LL
BSP92P
12Ω, -0.26A, LL
BSP321P
900mΩ, -0.98A, NL
BSP322P
800mΩ, -1.0A, LL
BSP316P
1.8Ω, -0.68A, LL
BSP612P 1)
120mΩ, 3A, LL
BSP613P
130mΩ, 2.9A, NL
BSP170P
300mΩ, -1.9A, NL
BSP171P
300mΩ, -1.9A, LL
BSP315P
800mΩ, -1.17A, LL
-30
BSR92P
11Ω, -0.14A, LL
BSR316P
1.8Ω, -0.36A, LL
BSS83P
2Ω, -0.33A, LL
BSS84P
8Ω, -0.17A, LL
BSR315P
800mΩ, -0.62A, LL
BSR303PE 3)
~30mΩ, ~-3.3A, LL
BSR305PE 3)
~50mΩ, ~-2.7A, LL
BSL303SPE 1)
~30mΩ, ~-6.6A, LL
BSL305SPE 1)
~50mΩ, ~-5.3A, LL
BSL307SP
43mΩ, -5.5A, LL
BSL308PE
80mΩ, -2.1A, LL, dual, ESD
BSL314PE
140mΩ, -1.5A, LL, ESD, dual
BSL207SP
41mΩ, -6A, SLL
BSL211SP
67mΩ, -4.7A, SLL
-20
Complementary
BSS192P
12Ω, -0.19A, LL
BSS215P
150mΩ, -1.5A, SLL
BSL215C
N: 140mΩ, 1.5A, SLL
P: 150mΩ, -1.5A, SLL
BSL316C
N: 160mΩ, 1.4A, LL
P: 150mΩ, -1.5A, LL
BSL308C
N: 57mΩ, A, LL
P: 80mΩ, A, LL,
BSL802SN
22mΩ, 7.5A, ULL
BSL202SN
22mΩ, 7.5A, SLL
BSL806N
57mΩ, 2.3A, ULL, dual
BSL205N
50mΩ, 2.5A, SLL, dual
BSL207N
70mΩ, 2.1A, SLL, dual
BSL214N
140mΩ, 1.5A, SLL, dual
BSL302SN
25mΩ, 7.1A, LL
BSL306N
57mΩ, 2.3A, LL, dual
-20/20
-30/30
20
30
BSR802N
23mΩ, 3.7A, ULL
BSR202N
21mΩ, 3.8A, SLL
BSR302N
23mΩ, 3.7A, LL
55
N-Channel MOSFETs
60
75
100
200
240
BSP318S
90mΩ, 2.6A, LL
BSP320S
120mΩ, 2.9A, NL
BSP295
300mΩ, 1.8A, LL
BSL606SN
60mΩ, 4.5A, LL
BSP716N
160mΩ, 2.3A, LL
BSP373N
240mΩ, 1.8A, NL
BSP372N
230mΩ, 1.8A, LL
BSL716SN 1)
150mΩ, 2.5A, LL
BSL373SN 1)
230mΩ, 2.0A, NL
BSL372SN 1)
220mΩ, 2.0A, LL
BSP296N
600mΩ, 1.2A, LL
BSL296SN 1)
460mΩ, 1.4A, LL
BSP297
1.8Ω, 0.66A, LL
BSP149
3.5Ω,0.14 A, depl.
BSP88
6Ω, 0.35A, 2.8V rated
BSP89
6Ω, 0.35A, LL
BSP129
6Ω, 0.05A, depl.
BSS606N
60mΩ, 3.2A, LL
500
600
800
1)
Coming Q2 2014
Coming Q3 2014
BSD314SPE
140mΩ, -1.5A, LL, ESD
BSD356PE 2)
~560mΩ, ~0.73A, LL
BSV236SP
175mΩ, -1.5A, SLL
BSD223P
1.2Ω, -0.39A, SLL, dual
BSD235C
N: 350mΩ, 0.95A, SLL
P: 1.2Ω, -0.53A, SLL
BSD356C 2)
N: 350mΩ, 0.95A, LL
P: ~560mΩ, ~0.73A, LL
BSS806NE
57mΩ, 2.3A, ULL, ESD
BSS806N
57mΩ, 2.3A, ULL
BSS205N
50mΩ, 2.5A, SLL
BSS214N
140mΩ, 1.5A, SLL
BSS306N
57mΩ, 2.3A, LL
BSS316N
160mΩ, 1.4A, LL
BSS670S2L
650mΩ, 0.54A, LL
BSS138N
3.5Ω, 0.23A, LL
BSS7728N
5Ω, 0.2A, LL
SN7002N
5Ω, 0.2A, LL
2N7002
3Ω, 0.3A, LL
BSS159N
8Ω, 0.13A, depl.
BSS816NW
160mΩ, 1.4A, ULL
BSS214NW
140mΩ, 1.5A, SLL
BSD816SN
160mΩ, 1.4A, ULL
BSD214SN
140mΩ, 1.5A, SLL
BSD840N
400mΩ, 0.88A, ULL, dual
BSD235N
350mΩ, 0.95A, SLL, dual
BSD316SN
160mΩ, 1.4A, LL
BSS138W
3.5Ω, 0.28A, LL
SN7002W
5Ω, 0.23A, LL
2N7002DW
3Ω, 0.3A, LL, dual
BSS123N
6Ω, 0.19A, LL
VGS(th) 0.8V to 1.8V
BSS87
6Ω, 0.26A, LL
BSS131
14Ω, 0.1A, LL
BSS139
30Ω, 0.03A, depl.
BSP298
3Ω, 0.5A, NL
BSP324
25Ω, 0.17A, LL
BSP299
4Ω, 0.4A, NL
BSP125
45Ω, 0.12A, LL
BSP135
60Ω, 0.02A, depl.
BSP300
20Ω, 0.19A, NL
2)
BSR606N
60mΩ, 2.3A, LL
BSS356PWE 2)
~560mΩ, ~0.73A, LL
BSS209PW
550mΩ, -0.58A, SLL
BSS223PW
1.2Ω, -0.39A, SLL
BSS169
12Ω, 0.09A, depl.
BSS119N
6Ω, 0.19A, LL
VGS(th) 1.8V to 2.3V
250
400
BSS308PE
80mΩ, -2.1A, LL, ESD
BSS314PE
140mΩ, -1.5A, LL, ESD
BSS315P
150mΩ, -1.5A, LL
BSS84PW
8Ω, -0.15, LL
BSS225
45Ω, 0.09A, LL
3)
BSS127
500Ω, 0.023A, LL
BSS126
700Ω, 0.007A, depl.
Coming Q4 2014
www.infineon.com/smallsignal
13
Driver ICs
EiceDRIVER™ Compact
600V Half Bridge Driver ICs for Battery Powered Applications
Developers of battery powered applications continuously strive for higher
efficiency of applications and smaller form factors. One area of interest is,
that the switching behavior and power losses of new Power MOSFETs can be
optimized by dedicated driver ICs.
Features
„„ High creepage distance in DSO-14
„„ Integrated low-ohmic bootstrap diode
„„ Specific undervoltage lockout levels
for MOSFET
„„ Rail-to-rail output
Applications
„„ Fans, Pumps
„„ Forklift and Low Speed Cars
Infineon’s new 2EDL EiceDRIVER™ Compact is a 600V half bridge gate
driver IC family. Its level-shift SOI (Silicon-On-Insulator) technology supports
both design goals. With the monolithic integrated low-ohmic and ultrafast
bootstrap diode this new generation 2EDL is a benchmark for driver ICs in the
market with more than 2A output current.
2EDL05N06PF (DSO-8) and 2EDL05N06PJ (DSO-14) are driver ICs with the
same features, but with undervoltage-logout for MOSFETs. These two parts are
recommended for low voltage drives such as e-Bikes.
2EDL23N06PJ (DSO-14) is a 2.3A half bridge driver ICs for MOSFETs. It provides
interlock, deadtime and in addition enable, fault and overcurrent protection.
It is well performed for e-Scooter and Forklift.
„„ e-Scooter, e-Bikes
VBUS
VDD
RLIM
DBS VB
CBS
HO
2EDL-family
VS
LO
GND
www.infineon.com/eicedriver
14
Sales Code and Package
(150mil)
2EDL05N06PF (DSO-8)
2EDL05N06PJ (DSO-14)
2EDL23N06PJ (DSO-14)
Applications
LV-Drives, e-Bike, Battery, Forklift,
Power Tools (Cordless)
Battery, e-Scooter, Forklift,
Power Tools (Cordless)
Blocking Voltage
600V
600V
Output Current
0.25A /-0.5A
1.8A / -2.3A
Integrated Bootsrap Function
Ultrafast BS diode and BS resistor
Ultrafast BS diode and BS resistor
UVLO (latest turn-off)
MOSFET (7.5V)
MOSFET (7.5V)
Features
Deadtime, interlock
Deadtime, interlock enable, fault, OCP
Microcontroller
XMC – 32-bit Industrial Microcontroller
Over 100 Devices Arranged in a Portfolio Optimized for Industrial Applications
XMC 32-bit MCU portfolio offers a wide and scalable set of products delivering
outstanding real-time performance, powerful features and high integration,
high quality standards and long-term product availability as well as high operating temperature.
New ARM® Cortex™ based Microcontroller Family
Performance
XMC4400
+ MEMORY
+ ETHERNET
XMC4100
Basic Series
ARM® Cortex™-M4
with DSP, FPU, MPU, DMA
XMC4200
+ MEMORY
+GPIOs
XMC1000 Family
es
vic
XMC1300
+ CORDIC
+ ERU
XMC1100
Basic Series
XMC1200
+ BCCU
+LEDTS
XMC4500
+SD Card
+ EBU
e
or
M
n
ha
00
de
1
t
Feature Integration
XMC MCUs are architectured for embedded industrial applications and characterize by
„„ Application specific feature – Delta-Sigma-(Δ∑)-Demodulator (DSD),
High Resolution PWM, Brightness Color Control Unit
„„ Precision and Control – Timer/PWM (CCU) can run up to 120MHz,
up to 64-bit width offering fault inputs and binary / floating clock prescaler
„„ Real-Time and Process Parallelization – Module Interconnect Matrix,
interaction between peripherals to offload CPU
„„ Quality and Robustness – Error Code Correction (ECC), Margin Check, Operating Temperature up to 125°C TAMBIENT, >=20 years Data, Retention,
Built-in Safety Feature (Window Watchdog, Broken Wire Detection) and
free IEC60730 Class B library
„„ Up to 32MHz ARM® Cortex™-M0
„„ 64MHz Math Co-Processor (CORDIC)
„„ 8kB to 200kB Flash
„„ 16kB SRAM
„„ Up to 32 general purpose IOs (GPIOs)
„„ Rich analog-mixed signal (ADC, CMP)
„„ Precision Timing/PWM (up to 64MHz)
„„ Configurable communication interfaces
„„ Application specific peripherals
„„ Brightness Color Control Unit (BCCU)
„„ LED Matrix and Touch (LEDTS)
„„ Position Interface (POSIF)
Operating Conditions
„„ Temperature: -40°C to 105°C TAMBIENT
„„ Voltage: 1.8V to 5.5V
XMC4000 Family
„„ Up to 120MHz ARM® Cortex™-M4
„„ DSP, FPU, DMA and MPU
„„ 64kB to 1MB Flash with ECC
Ecosystem
„„ The wide ARM® Ecosystem (Atollic, IAR, Keil MDK, Rowley, TASKING and others)
„„ Free Infineon DAVE™
„„ Eclipse CDT based IDE
„„ ARM® GNU compiler
„„ Free debugger and Flash loader
„„ Data visualization tool called xSPY
„„ Providing a resource solver
„„ DAVE™ Apps – a tailored and object-oriented software library of 170 Apps
to efficiently use the innovative set of peripherals of the XMC MCUs
„„ 20 to 160kB SRAM with up to 4kB Cache
„„ Up to 91 general purpose IOs (GPIOs)
„„ Rich analog-mixed signal (ADC, DAC)
„„ Precision Timing/PWM (up to 120MHz)
„„ Configurable communication interfaces
„„ Application specific peripherals
„„ Delta-Sigma-(Δ∑)-Demodulator
„„ High Resolution PMW (150ps, HRPWM)
„„ POSIF, EBU, USB, SD/MMC, Ethernet
Operating Conditions
„„ Temperature: -40°C to 125°C TAMBIENT
„„ Voltage: 3.13V to 3.63V
www.infineon.com/XMC
www.infineon.com/DAVE
www.infineon.com/IEC60730
15
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Infineon Technologies – innovative semiconductor solutions for energy efficiency, mobility and security.
Published by
Infineon Technologies Austria AG
9500 Villach, Austria
© 2014 Infineon Technologies AG.
All Rights Reserved.
Visit us:
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Order Number: B152-H9712-G1-X-7600-DB2014-0004
Date: 02 / 2014
Attention please!
The information given in this document shall in no event
be regarded as a guarantee of conditions or characteristics
(“Beschaffenheitsgarantie”). With respect to any examples
or hints given herein, any typical values stated herein and/
or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation
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