Application Note AN 2013-02 V1.1 June 2014 AN2013-02 MA3L120E12_EVAL Evaluation Adapter Board for EconoPACKTM 4 3-Level Modules in NPC2-Topology IFAG IPC APS Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules Application Note AN 2013-02 V1.1 June 2014 Edition 2011-05-15 Published by Infineon Technologies AG 59568 Warstein, Germany © Infineon Technologies AG 2011. All Rights Reserved. Attention please! THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. 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Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. AN 2013-02 Revision History: date (2014-06), V1.1 Previous Version: V1.0 Subjects: Email address updated Authors: Alain Siani We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [[email protected]] 2 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules Application Note AN 2013-02 V1.1 June 2014 1 Introduction .................................................................................................................................................. 4 1.1 Part Number explanation ................................................................................................................... 4 2 Design features ............................................................................................................................................ 5 2.1 Main features ..................................................................................................................................... 5 2.2 Key Data ............................................................................................................................................ 5 2.3 Mechanical dimensions ...................................................................................................................... 6 3 Pin assignments .......................................................................................................................................... 7 4 Functionality of the board .......................................................................................................................... 8 4.1 Power supply...................................................................................................................................... 8 4.2 Booster ............................................................................................................................................... 9 4.3 VCE monitoring for short circuit detection .......................................................................................10 4.4 Active clamping function ..................................................................................................................10 4.5 Maximum switching frequency .........................................................................................................11 5 Paralleling...................................................................................................................................................12 5.1 Static current imbalance ..................................................................................................................12 5.2 Dynamic current imbalance .............................................................................................................12 5.3 Paralleling with MA3L120E12_EVAL ...............................................................................................12 6 Schematics and Layouts ..........................................................................................................................14 6.1 Schematics.......................................................................................................................................14 6.2 Layouts .............................................................................................................................................16 7 Bill of Material of MA3L120E12_EVAL .....................................................................................................19 8 How to order the Evaluation Adapter Board ...........................................................................................20 9 Literature ....................................................................................................................................................20 The board described is an evaluation board dedicated for laboratory environment only. It operates at high voltages. This board must be operated by qualified and skilled personnel familiar with all applicable safety standards. 3 Application Note AN 2013-02 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules 1 V1.1 June 2014 Introduction TM The evaluation adapter board MA3L120E12_EVAL for 3-level NPC2 EconoPACK 4 modules as shown in Figure 1 was developed to support customers during their first steps designing applications with TM EconoPACK 4 3-level NPC2 modules. This evaluation board was designed in addition to the module driver 1 board F3L2020E12-F-P_EVAL [1] or could be a complementary part for an existing customer driver solution. For more details about the 3-level topology, please refer to [2]. The board is available from Infineon in small quantities. The properties of this part are described in the design features chapter of this document, whereas the remaining paragraphs provide information to enable the customers to copy, modify and qualify the design for production, according to their own specific requirements. Environmental conditions were considered in the design of the MA3L120E12_EVAL. Components qualified for a lead-free reflow soldering process were selected. The design was tested as described in this document but not qualified regarding manufacturing and operation over the whole operating temperature range or lifetime. The boards provided by Infineon are subject to functional testing only. Due to their purpose evaluation boards are not subject to the same procedures regarding Returned Material Analysis (RMA), Process Change Notification (PCN) and Product Discontinuation (PD) as regular products. See Legal Disclaimer and Warnings for further restrictions on Infineon’s warranty and liability. Figure 1: The evaluation adapter board MA3L120E12_EVAL for EconoPACK 1.1 1 Part Number explanation TM Evaluation Driver Board for 3-Level EconoPACK 4 AN2012-03 [2] 4 TM 4 3-level modules Application Note AN 2013-02 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules 2 V1.1 June 2014 Design features Electrical features of the evaluation board and mechanical dimensions including necessary interface connections are presented in the following sections. 2.1 Main features 2 The evaluation board is developed to work in combination with the F3L2020E12-F-P_EVAL driver board . The MA3L120E12 adapter board provides following features: TM Electrically and mechanically suitable for 3-level NPC2 EconoPACK 4 module family Different gate resistor values for turning-on and -off are possible Active clamping protection for all IGBTs Desaturation output signals for short circuit monitoring 3 Suitable for -8V/+15V or up to ±20V 2.2 Key Data All values given in Table 1 are typical values, measured at an ambient temperature of Tamb = 25 °C. Table 1: General key data and characteristic values Parameter Description Value Unit VDC maximum DC supply voltage ±20 V IG continuous output current ±12 A fS maximum PWM signal frequency 60 kHz Top operating temperature (design target) -40…+85 °C Tstg storage temperature (design target) -40…+85 °C TM The EconoPACK 4 3-level IGBT module has two vertically and two horizontally aligned IGBTs. The nomenclature of transistors and diodes inside Infineon’s 3-Level NPC2 IGBT modules are defined as shown in Figure 2. Figure 2: IGBT module with the designation of each IGBT 2 3 Evaluation Driver Board for 3-Level NPC2 EconoPACKTM4 (AN2012-03) IGBT short circuit performance is specified for a value of VGE ~15V 5 Application Note AN 2013-02 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules V1.1 June 2014 Figure 3 shows the functional groups of the MA3L120E12 evaluation board top side. 1: 2: 3: 4: Booster for high side IGBT Booster for inner right side IGBT Booster for inner left side IGBT Booster for low side IGBT Figure 3: Functional groups of the evaluation board MA3L120E12_EVAL top side 2.3 Mechanical dimensions The dimensions of the MA3L120E12 adapter board are given in Figure 4. Figure 4: Mechanical dimensions of the MA3L120E12_EVAL 6 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules 3 Application Note AN 2013-02 V1.1 June 2014 Pin assignments All PWM, logic signals and voltage supplies have to be applied as listed in the following tables. Table 2: Pin assignment of the connector X100 of the high side IGBT Pin name Pin function X100-1 +15V_T1 X100-2 GND_T1 X100-3 -8V_T1 X100-4 PWM_T1 X100-5 DESAT1 Table 3: Pin assignment of the connector X200 of the inner right side IGBT Pin name Pin function X200-1 +15V_T2 X200-2 GND_T2 X200-3 -8V_T2 X200-4 PWM_T2 X200-5 DESAT2 Table 4: Pin assignment of the connector X300 of the inner left side IGBT Pin name Pin function X300-1 +15V_T3 X300-2 GND_T3 X300-3 -8V_T3 X300-4 PWM_T3 X300-5 DESAT3 Table 5: Pin assignment of the connector X400 of the low side IGBT Pin name Pin function X400-1 +15V_T4 X400-2 GND_T4 X400-3 -8V_T4 X400-4 PWM_T4 X400-5 DESAT4 7 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules 4 Application Note AN 2013-02 V1.1 June 2014 Functionality of the board The MA3L120E12_EVAL adapter board is a complementary part of the evaluation kit to drive one 3-level TM IGBT module as shown in Figure 5. The adapter board should be pressed onto the EconoPACK 4 as described in the AN2010-06. F3L2020E12-F-P_EVAL MA3L120E12_EVAL F3L400R12PT4_B26 Figure 5: Mounting sequence of the Evaluation Kit The IGBT module is not a part of this evaluation kit. The IGBT module needed can be purchased separately. 4.1 Power supply The evaluation kit as shown in Figure 5 needs four external isolated power supplies of -8V/+15V. The 4 magnitude of each power supply should not exceed the maximum allowed supply voltage of 28V . The power supply of the evaluation kit with four isolated -8V/+15 V voltage sources can be done using a 5 MA040E12_EVAL evaluation board. If the MA3L120E12 adapter board is not used in conjunction with the F3L2020E12-F-P_EVAL driver board, it can be supplied with isolated power supplies providing up to maximum ±20V. The input PWM voltage level should be selected according to the power supply voltage level. If an asymmetrical supply voltage of -8V/+15V is applied, the PWM signal should not exceed +15V and should not be lower than -8V. The voltage sources are applied to the corresponding driver channels using the connectors X100, X200, X300 and X400. TM Figure 6: Principle diagram of the MA3L120E12_ EVAL and 3-level EconoPACK 4 4 5 Maximum power supply voltage output side of the EiceDRIVER™ 1ED020I12-F2 AN2010-04 MA040E12_EVAL Isolated Gate Driver Power Supply and Logic Interface for MIPAQTM Serve 8 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules Application Note AN 2013-02 V1.1 June 2014 Figure 7 gives hints about the power consumption of one IGBT gate driver channel on the MA3L120E12_EVAL, as a function of the switching frequency. The whole power demand of the board is the summation of the power demand of the four gate driver channels. The conditions during the measurement were Tcase = 125°, Tamb = 25°C. The adapter board is supplied with -8V/+15V. Figure 7: Power consumption of one gate driver channel on the MA3L120E12_EVAL board vs. the switching frequency 4.2 Booster Figure 8 depicts the booster circuit where three complementary pairs of transistors are used to amplify the input PWM signal. This allows to drive IGBTs that need more current than the driver IC can deliver. Three NPN transistors are used for turning-on the IGBT and three PNP transistors for turning-off the IGBT. The transistors are dimensioned to provide enough peak current to drive all EconoPACK™4 3-level IGBT modules. Figure 8: Schematic details of the output stage for a single IGBT driver Gate resistors are connected between the booster stage and the IGBT module’s gate terminals. These resistors should have a suitable rating for repetitive pulse power to avoid degradation. 9 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules 4.3 Application Note AN 2013-02 V1.1 June 2014 VCE monitoring for short circuit detection The short circuit protection of the four IGBTs is based on the monitoring of the collector emitter voltage for the corresponding IGBT, using the active clamping feature as represented in Figure 9. If the IGBT conducts a current several times higher than the nominal value, the transistor desaturates and the voltage across the device increases. This behavior can be used for short circuit detection and to turn-off of the IGBT. The short circuit needs to be detected and the IGBT has to be turned off without exceeding its maximum blocking voltage, within 10µs. When the MA3L120E12_EVAL is connected to a F3L2020E12-F-P_EVAL driver board, each 1ED020I12-F Coreless Transformer driver IC of the four IGBTs detects and handles the short circuit separately. Figure 9: Desaturation protection and active clamping diodes 4.4 Active clamping function Active clamping is a technique which keeps transient overvoltage below the critical limits when the IGBT turns off. The standard approach for active clamping is to use a TVS diode connected between the auxiliary collector and the gate of an IGBT module. When the Collector-Emitter voltage exceeds the diode breakdown voltage the diode current sums up with the current from the driver output. Due to the increased Gate-Emitter voltage, the transistor is held in an active mode and the turn-off process is prolonged. The dIC/dt slows down which results in a limited voltage overshoot. Avalanche diodes conduct high peak currents during the time in which the clamping is actively limiting the overvoltage. A typical turn-off waveform of a F3L400R12PT4_B26 module at room temperature without overvoltage limiting function can be seen in Figure 10a. Figure 10b shows the waveform with the same load conditions as Figure 10a but with active clamping function. a) b) Figure 10: turn-off a) without active clamping 10 b) with active clamping function Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules 4.5 Application Note AN 2013-02 V1.1 June 2014 Maximum switching frequency The switching frequency on the adapter board is limited either by the maximum output power of the driver power supply or by the maximum temperature of the PCB due to the power losses in the external gate resistors. These power losses in the gate resistors depend on the IGBT gate charge, gate voltage magnitude and on the switching frequency of the IGBT. Due to the power losses in the external gate resistors, heat will be generated, which leads to an increase of the PCB temperature in the neighborhood of these resistors. This temperature must not be higher than the maximum working temperature of the PCB, i.e. 105°C for a standard FR4 material. The calculation of the power losses in the gate resistors can be done by utilizing equation (1): Pdis P( REXT ) P( RINT ) Vout f s QG (1) where: Pdis = dissipated power P(REXT) = dissipated power of the external gate resistors P(RINT) = dissipated power of the IGBT module internal gate resistor ΔVout = voltage magnitude at the driver output fs = switching frequency QG = IGBT gate charge for the given gate voltage range The complete gate resistor consists of the internal gate resistor together with an external gate resistor and due to that, a part of the IGBT drive power losses will be dissipated directly to the PCB, whereas the other part of the losses will be dissipated to the ambient air. The ratio of the losses dissipated internally P(RINT) and externally P(REXT) corresponds directly to the ratio of the mentioned RINT and REXT resistors. According to -8/+15V operation, the datasheet value of QGE needs to be reduced by 20%. Due to the PCB temperature criteria, the power dissipated in external gate resistors P(REXT) has to be considered for the thermal design. Figure 11 illustrates the PCB board temperature around the gate resistors depending on the switching frequency. Measurement was done at Tcase = 100°C, Tamb = 25°C, VGE = -8V/+15V. The high IGBT module case temperature leads elevated temperature level at the PCB. This results in a temperature rise event at a switching frequency of 0 Herz. Figure 11: Local temperature development of the MA3L120E12_EVAL adapter board 11 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules 5 Application Note AN 2013-02 V1.1 June 2014 Paralleling In contrast to the operation of one single IGBT, where the operating point is relatively simple to set up, the switching of paralleled IGBT modules on the same operation point is not trivial. This can be explained by the fact that the IGBTs have a certain variation in their characteristics. A direct consequence of this is a slight current imbalance between the IGBTs. The biggest challenge is to minimize the deviation of the leg current to achieve highly efficient systems and an improved reliability. Two main factors have a dominant role in the current maldistribution: - the difference between the impedance of each leg of the paralleled setup - the difference in the output voltages of the individual leg of the paralleled setup 5.1 Static current imbalance The static current imbalance can be caused due to: - the variation of the Collector-Emitter voltage of each leg of the paralleled setup - the variation of the resistance of the main current path 5.2 Dynamic current imbalance The dynamic current imbalance can be caused by - the variation of the transmission characteristics caused by the different VGEth of each IGBT - the variation of the impedance of the main current path - the stray inductance of the internal and external commutation path of the IGBT module - the IGBT driver output resistance in the paralleled legs - the transfer characteristic IC = f(VGE) 5.3 Paralleling with MA3L120E12_EVAL The MA3L120E12_EVAL was designed primarily to work with the evaluation driver board F3L2020E12-F-P_EVAL, which allows the parallel connection of up to three modules, each equipped with one MA3L120E12_EVAL adapter board as represented in Figure 12a. In case of paralleling, the driver board does not need to be plugged into the complementary adapter board. The connection from the driver to the adapter boards is done utilizing the connectors on the top side of the driver board as shown in Figure 12b. a) b) Figure 12: a) Principle of parallel connection, b) Photo of the setup Figure 12b shows a parallel connection of three 3-level IGBT modules. The wires to connect the driver to the adapter boards should have the same length to avoid differences in signal run time between the gates of the three legs. Star connection of the IGBTs improves the reduction of cross flow in the auxiliary emitter paths during the switching sequence. The MA3L120E12_EVAL boards are equipped with 4.7 resistors in the auxiliary emitter path and other power supply lines (-8V / +15V) to reduce the current cross flow between the units of the paralleled circuits. The MA3L120E12 adapter board is equipped with 4.7 decoupling resistors in the power supply lines by default. This avoids currents in the emitter path between the paralleled modules. 12 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules Application Note AN 2013-02 V1.1 June 2014 Figure 13a gives a hint about the balancing current flowing in the emitter paths when MA3L120E12_EVAL is equipped with 0 instead of 4.7. Balancing currents of up to 4A can be measured after the turn-on of the IGBT. With a standard equipped adapter board, the balancing current is reduced to a few mA as depicted in Figure 13b. a) b) Figure 13: Current distribution in the auxiliary emitter paths a) With 0 as decoupling resistor b) With 4.7 as decoupling resistor Figure 14 shows the turn-on and turn-off behavior of 3 IGBT modules in parallel and their current sharing on the AC terminals. a) b) Figure 14: Current distribution on the AC terminals of 3 parallel F3L400R12PT4_B26 modules a) Turn-on b) Turn-off The Eon and Eoff values measured with a gate resistance Rgon = Rgoff = 1.5 and at an ambient temperature of 25°C are listed in Table 6. Datasheet values of Eon and Eoff for F3L400R07PT4_B26: Eon = 8.75 mJ; Eoff = 18 mJ Table 6: Overview of Eon and Eoff of three paralleled F3L400R12PT4_B26 modules Device under Test DUT1 DUT2 Eon [mJ] 12.27 12.15 Eoff [mJ] 19.2 23 DUT3 12.2 20 Compared to the datasheet values, the measured Eoff values are similar. The variation in Eon is higher and in general higher than the datasheet values. Nevertheless the influence of Eoff is dominating. 13 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules 6 Application Note AN 2013-02 V1.1 June 2014 Schematics and Layouts To meet the individual customer requirements and to make the evaluation adapter board simple for development or modification, all necessary technical data like schematic, layout and components are included in this chapter. 6.1 Schematics Figure 15 to Figure 19 depict the driving circuit of the IGBTs. Figure 15: Control circuit of the high side IGBT Figure 16: Control circuit of the inner right side IGBT 14 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules Application Note AN 2013-02 Figure 17: Control circuit of the inner left side IGBT Figure 18: Control circuit of the low side IGBT Figure 19: Configuration of the connectors of the MA3L120E12_EVAL 15 V1.1 June 2014 Application Note AN 2013-02 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules 6.2 V1.1 June 2014 Layouts The MA3L120E12_EVAL adapter board was designed, following the rules for the copper thickness and the space between different layers as shown in Figure 20. Layers: Copper Isolation 1: 35 µm 1-2: 0.5 mm 2: 35 µm 2-3: 0.5 mm 3: 35 µm 3-4: 0.5 mm 4: 35 µm Figure 20: PCB - stack of the MA3L120E12_EVAL Figure 21: Component placement, top side Figure 22: Component placement, bottom side 16 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules Figure 23: Top-Layer Figure 24: Layer 2 Figure 25: Layer 3 17 Application Note AN 2013-02 V1.1 June 2014 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules Figure 26: Bottom-Layer 18 Application Note AN 2013-02 V1.1 June 2014 Application Note AN 2013-02 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules 7 V1.1 June 2014 Bill of Material of MA3L120E12_EVAL The bill of material includes a part list as well as assembly notes. The tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to ±5 % and for capacitors of the type X7R less or equal to ±10 %. Type Value Package QTY Name Part Manufacturer Resistor 1.8 R-EU_1206 4 R112, R212, R312, R412 - - - Resistor Puls resistors optional R-EU_1206 24 R106,R107, R108, R109, R110, R111, R206, R207, R208, R209, R210, R211, R306, R307,R308, R309, R310, R311, R406, R407, R408, R409, R410, R411 Resistor 4.7 R-EU_1206 12 R114, R115, R116, R214, R215, R216, R314, R315, R316, R414, R415, R416 Resistor 1k R-EU_0805 4 R101, R201, R301, R401 Resistor 39 R-EU_0805 12 R103, R104, R105, R203, R204, R205, R303, R304, R305, R403, R404, R405 - Resistor 10k R-EU_0805 4 R113, R213, R313, R413 - Murata Capacitor 4µ7/25V/X7R C1206 24 C101, C102, C103, C104, C105, C106, C201, C202, C203, C204, C205, C206, C301, C302, C303, C304, C305, C306, C401, C402, C403, C404, C405, C406 Diode ES1D DO214AC 8 D102, D106, D202, D206, D302, D306, D402, D406 Diode P6SMB400A SMB 2 D107, D407 Diotec Diode P6SMB300A SMB 4 D105, D207, D307, D405 Diotec Diode P6SMB220A SMB 2 D205, D305 Diotec Diode STTH112U SOD6 4 D101, D201, D301, D401 - Diode BAT165 SOD323R 8 D103, D104, D203, D204, D303, D304, D403, D404 Infineon Bipolar transistor ZXTN2010Z SOT89 12 T101, T102, T103, T201, T202, T203, T301, T302, T303, T401, T402, T403 Diodes Bipolar transistor ZXTP2012Z SOT89 12 T104, T105, T106, T204, T205, T206, T304, T305, T306, T404, T405, T406 Diodes Connector MOLEX 2223-2051 PITCH KK 4 X100, X200, X300, X400 Molex 19 Evaluation Adapter Board for EconoPACKTM 4 3-Level NPC2 Modules 8 Application Note AN 2013-02 V1.1 June 2014 How to order the Evaluation Adapter Board Every Evaluation Adapter Board has its own IFX order number and can be ordered via your Infineon Sales Partner. Information can also be found at the Infineon’s Web Page: www.infineon.com CAD-data for the board described here are available on request. The use of this data is subjected to the disclaimer given in this AN. Please contact: [email protected] IFX order number for MA3L120E12_EVAL: SP001072010 IFX order number for F3L2020E12-F-P_EVAL: SP001000644 9 Literature [1] AN2012-03 Evaluation Driver Board for EconoPACKTM 4 3-level Modules in NPC2-Topology with 1ED020I12-F gate driver IC [2] Zhang Xi, Uwe Jansen, Holger Rüthing: ‘IGBT power modules utilizing new 650V IGBT3 and Emitter Controlled Diode3 chips for 3-level converter’ ISBN: 978-3-8007-3158-9 Proceedings PCIM Europe 2009 Conference 20