Application Note AN 2007-06 V1.2, June 2010 AN2007-06 MA300E12 / MA300E17 – Module Adapter Board for PrimePACKTM IGBT Modules IFAG IMM INP M AE N 2010-03 r 2009 Application Note AN 2007-06 V1.2, June 2010 Edition 2010-05-07 Published by Infineon Technologies AG 59568 Warstein, Germany © Infineon Technologies AG 2010. All Rights Reserved. Attention please! THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND (INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN IN THIS APPLICATION NOTE. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. AN2007-06 Revision History: 2010-06, V1.2 Previous Version: 1.1 major changes since last revision Extended main features with: "Base plate temperature monitoring by internal NTC resistor" Author: Piotr Luniewski(IFAG IMM INP M AE), Alain Siani(IFAG IMM INP M AE) We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [mailto:[email protected]] 2 N 2010-03 r 2009 Module Adapter Board for PrimePACKTM IGBT Modules Application Note AN 2007-06 V1.2, June 2010 Table of contents 1 INTRODUCTION.............................................................................................................................. 4 2 DESIGN FEATURES ....................................................................................................................... 5 2.1 2.2 2.3 2.4 3 APPLICATION NOTE ...................................................................................................................... 9 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 4 Functionality on board ........................................................................................................ 9 Gate resistors ....................................................................................................................... 9 Gate signal amplifier.......................................................................................................... 10 VCE monitoring for short circuit detection ....................................................................... 11 Active voltage clamping – boosted version .................................................................... 11 Maximum switching frequency......................................................................................... 12 Base plate temperature monitoring by internal NTC resistor ....................................... 14 Parallel operation ............................................................................................................... 15 SCHEMATIC AND LAYOUT OF MA300EXX ............................................................................... 15 4.1 4.2 4.3 4.4 4.5 5 Main features ........................................................................................................................ 5 Key data ................................................................................................................................ 6 Mechanical dimensions and mounting procedure ........................................................... 6 Pin assignment..................................................................................................................... 7 Schematic ........................................................................................................................... 16 Assembly drawing ............................................................................................................. 18 Layout.................................................................................................................................. 19 Bill of Material - MA300E12 ............................................................................................... 20 Bill of Material - MA300E17 ............................................................................................... 21 HOW TO ORDER EVALUATION DRIVER BOARDS................................................................... 22 Part number explanation: MA 300 Exx E12 or E17 – Suitable for 1200V or 1700V PrimePACK™ 300 – 30 A output driver current MA – Module Adapter board 3 N 2010-03 r 2009 Module Adapter Board for PrimePACKTM IGBT Modules 1 Application Note AN 2007-06 V1.2, June 2010 Introduction The MA300E12 and MA300E17 are developed for 1200V and 1700V PrimePACK™ modules. Used together with the 2ED300E17-SFO evaluation adapter board and 2ED300C17-S /-ST EiceDRIVER™ makes the ‘Flexible driver Starter Kit’ easy to use (Fig. 2). The ‘Flexible Starter Kit’ is dedicated for single module operation and simple PrimePACK™ paralleling. In all cases one 2ED300E17-SFO adapter board and one 2ED300C17-S driver is required. Up to three modules can be paralleled, each equipped with one MA300Exx board. The MA300Exx module adapter boards are available from Infineon in small quantities. Functions and properties of these parts are described in the datasheet chapter of this document whereas the remaining paragraphs provide information intended to enable the customer to copy, modify and qualify the design for their own specific application. Environmental conditions were considered in the design of the MA300Exx. The requirements for leadfree reflow soldering have been considered when components were selected. However the design was only tested as described in this document but not qualified regarding manufacturing and operation over the whole operating ambient temperature range or lifetime. The boards provided by Infineon are subjected to functional testing only. Due to their purpose evaluation boards are not subjected to the same procedures regarding Returned Material Analysis (RMA), Process Change Notification (PCN) and Product Withdraw (PWD) as regular products. See Legal Disclaimer and Warnings for further restrictions on Infineon warranty and liability. IFX order number: 30259 IFX order number: 30276 1a Figure 1 1b The PrimePACK™ Module Adapter boards, MA300E12 - 1a, MA300E17 – 1b 4 N 2010-03 r 2009 Module Adapter Board for PrimePACKTM IGBT Modules Figure 2 2 Application Note AN 2007-06 V1.2, June 2010 The ‘Flexible driver Starter Kit’ for PrimePACK™ module Design features Electrical features of the evaluation board and mechanical dimensions including necessary interface connections are presented in the following sections. 2.1 Main features The MA300Exx module adapter board offers the following features: • • • • • • • • • Dual channel IGBT driver together with 2ED300E17-SFO (detailed description in AN2007-05) and 2ED300C17-S /-ST EiceDRIVER™ Electrically and mechanically suitable for PrimePACK™ modules family Operating temperature (design target) from -55°C to 85°C Different gate resistor values for turning-on and -off are possible IGBTs are protected against temporary VCE overvoltages during turn-off (Active Clamping) Diodes for IGBT desaturation monitoring implemented (short circuit protection) Base plate temperature monitoring by internal NTC resistor All components, except connectors, are surface mount devices (SMD) with lead free 260°C soldering profile PCB is designed to fulfill the requirements of IEC61800-5-1, pollution degree 2, overvoltage category III (creepage – 11mm) When the MA300Exx is not used with 2ED300E17-SFO adapter board and 2ED300C17-S /-ST EiceDRIVER™ these additional features might be useful: • Gate-emitter amplifier input resistance is 37Ω • Can be used with max. ±20V isolated power supply (due to IGBT short circuit performance a max. VGE of +15V is suggested) • Asymmetric power supply is also allowed e.g. -8V and +15V • Input PWM voltage level should be selected according to the power supply voltage level. If an asymmetrical supply voltage of -8V/+15V is applied, the PWM signal should not be higher than +15V and should not be lower than -8V 5 N 2010-03 r 2009 Application Note AN 2007-06 V1.2, June 2010 Module Adapter Board for PrimePACKTM IGBT Modules 2.2 Key data All values given in the table below are typical values, measured at TA = 25 °C. Table 1 Parameter VDC IG RGmin PDC/DC fS Top Tsto INTC 2.3 General key data and characteristic values Description max. DC voltage supply max. peak output current minimum gate resistor value when VDC=±15V (internal module resistor RINT + external REXT) max DC/DC output power per one channel1 max. PWM signal frequency for channel A and B2 operating temperature (design target) 3 storage temperature (design target) max. NTC current according to AN2009-104 Value ±20 ±30 Unit V A 1 Ω 4 60 -55…+85 -55…+85 3.74 W kHz °C °C mA Mechanical dimensions and mounting procedure The MA300Exx should be screwed to the PrimePACK™ auxiliary terminals according to AN2006-095. In that way necessary connections between module adapter and module itself are done correctly (Figure 3). PCB outline and relevant dimensions needed for better system integration are shown in Figure 4. Figure 3 The MA300Exx correctly mounted on PrimePACK™ module 1 Only when MA300Exx is used together with 2ED300E17-SFO adapter board and 2ED300C17-S EiceDRIVER™ 2 Switching frequency is limited by 2ED300C17-S EiceDRIVER™ capabilities. The maximum switching frequency for every PrimePACK™ module type should be calculated separately. Limitation factors are: max. DC/DC output power of 4 W per channel and max. PCB board temperature measured around gate resistors placed on separated board closed to IGBT module. For detailed information see chapter 3.6. 3 Max. ambient temperature strictly depends on MA300Exx load conditions. 4 The AN2009-10: ‘Using the NTC inside a power electronic module’, is available on Infineon website. The AN2006-09: ‘Mounting process PrimePACK modules’, is available on Infineon website. 5 6 N 2010-03 r 2009 Application Note AN 2007-06 V1.2, June 2010 Module Adapter Board for PrimePACKTM IGBT Modules 132mm 93mm X1 X 5 1 5 1 62mm 89mm max. 12mm max. Figure 4 Dimensions of the MA300Exx module adapter board 2.4 Pin assignment After the module adapter has been correctly mounted to the PrimePACK™ module all external electrical control signals should be applied to connector X1 and X2 as shown on Fig. 6 and listed in Table 2. When MA300Exx is used together with 2ED300E17-SFO the necessary connections to module adapter are depicted in Figure 5. Control signals required for module driving should be connected to Input Interface of 2ED300E17-SFO as described in AN2007-05. In that way no additional connections between module and IGBT driver are needed. The setup ready to use is shown in Fig. 2. 7 N 2010-03 r 2009 Application Note AN 2007-06 V1.2, June 2010 Module Adapter Board for PrimePACKTM IGBT Modules X3 X7 X9 X2 1 5 VA+ COMA VASENSEA VCESATA 1 5 2ED300E17-SFO MA300Exx 1 VB+ COMB VBSENSEB VCESATB X4 Figure 5 X8 X10 5 5 1 Cable Connection X1 Connections between 2ED300E17-SFO and MA300Exx X2 5 VDCA+ COMA VDCAVGEA VCESATA 1 MA300Exx VDCB+ COMB VDCBVGEB VCESATB 5 1 X1 Figure 6 MA300 Module Adapter board and external electrical connections Table 2 MA300Exx and the external electrical signals description Pin X2.5 X2.4 X2.3 X2.2 X2.1 X1.5 X1.4 X1.3 X1.2 X1.1 Label VDC A+ COM A VDC AVGE A VCESAT A VDC B+ COM B VDC BVGE B VCESAT B Function Isolated DC/DC positive voltage supply channel A Auxiliary emitter – channel A Isolated DC/DC negative voltage supply channel A Gate-emitter signal source – channel A Desaturation voltage monitoring output – channel A Isolated DC/DC positive voltage supply channel B Auxiliary emitter – channel B Isolated DC/DC negative voltage supply channel B Gate-emitter signal source – channel B Desaturation voltage monitoring output – channel B 8 N 2010-03 r 2009 Application Note AN 2007-06 V1.2, June 2010 Module Adapter Board for PrimePACKTM IGBT Modules 3 Application Note 3.1 Functionality on board The MA300Exx basically supports already existing IGBT driver in half-bridge configuration and provides additional functions separately for both channels (top and bottom IGBT): • Gate resistors • Gate signal amplifier / emitter follower - booster • VCE monitoring for short circuit detection • Active voltage clamping Picture below depicts the MA300E12 with already mentioned functions and shows their physical location. Figure 7 The MA300E12 with marked functions 3.2 Gate resistors MA300E12 and MA300E17 are assembled and delivered as shown on Fig. 7. The correct gate resistors should be soldered by the customer. Values for 1200V modules are given in Table 3. Table 4 shows values for 1700V IGBTs. All of them are in the 2512 package size (EIA). Table 3 External gate resistor suggested values for 1200V PrimePACK™ IGBT modules Module R5, R6, R25, R26 R1, R2, R3, R4, Resulting RGon R21, R22, R23, R24 Resulting RGoff FF600R12IE4 / IP4 1.5 Ω 5.6 Ω 2.15 Ω 2.15 Ω FF900R12IP4 0.82 Ω 4.7 Ω 1.58 Ω 1.58 Ω FF1400R12IP4 0.33 Ω 3.3 Ω 1Ω 1Ω 9 N 2010-03 r 2009 Application Note AN 2007-06 V1.2, June 2010 Module Adapter Board for PrimePACKTM IGBT Modules The values of RGon and RGoff for 1200V module types are the same and therefore assembly of diodes D5, D25, D6, D26 are not needed. External gate resistor suggested values for 1700V PrimePACK™ IGBT modules Module R5, R6, R25, R26 R1, R2, R3, R4, R21, R22, R23, R24 Resulting RGon Resulting RGoff FF650R17IE4 1.8 Ω 6.8 Ω 1.7 Ω 2.6 Ω FF1000R17IE4 1.2 Ω 4.7 Ω 1.18 Ω 1.78 Ω FF1400R17IP4 0.47 Ω 1.8 Ω 0.47 Ω 0.68 Ω In 1700V PrimePACK™ module types the RGoff is higher than RGon and therefore diodes D5 and D25 must be fitted as shown on Figure 8. Figure 8 The MA300E17 with mounting direction for D5 and D25 3.3 Gate signal amplifier6 When the IGBT transistor switches -on and –off, a high peak of the gate current must be delivered from a driver. Usually there is no technical problem when one module is driven. If one IGBT driver is used for modules connected in parallel the driver’s amplifier must deliver the cumulative gate current. This switching condition leads to the gate power loss being concentrated in one relatively small physical area and may result in thermal problems. The high peak currents also require a high current gain driver. Overcoming gain limitation becomes possible when the module adapter includes a dedicated gate signal amplifier (Fig. 8, Fig. 13 and Fig. 14). MA300Exx have an emitter follower or booster stage already implemented. With four complementary bipolar transistors connected in parallel the minimum gain @IG=30A is not smaller than 1007. Due to the fact that every PrimePACK™ has its own module adapter the driving conditions are equal. Input resistance of the module adapter is not smaller than 37Ω. Benefits provided by booster: • • Fast control of gate-emitter voltage for every PrimePACK™ module Simple module paralleling 6 More information EPE07 paper ‘Benefits of System-oriented Module Design for High Power Inverters’, or PELINCEC2005 paper ‘Dynamic Voltage Rise Control – the Most Efficient Way to Control Turn-off Switching Behavior of IGBT Transistors’. 7 Based on ZXTN2010Z and ZXTP2012Z bipolar transistors datasheets. www.zetex.com 10 N 2010-03 r 2009 Application Note AN 2007-06 V1.2, June 2010 Module Adapter Board for PrimePACKTM IGBT Modules 3.4 VCE monitoring for short circuit detection If the IGBT transistor conducts a current a few times higher than the nominal value, the transistor desaturates and the VCE voltage increases. This behavior can be used for short circuit detection and switching-off an IGBT transistor. The short circuit withstand time for Infineon high power IGBT modules is ≤ 10µs. During this time the short circuit should be detected and the IGBT should be switched off without exceeding VCES. When MA300Exx is used together with 2ED300E17-SFO the RSSD resistors (Soft Shut Down) must be chosen correctly in order to insure proper short circuit protection. The detailed procedure is described in AN2007-05 chapter 3.5. Figure 9a shows three FF1000R17IE4 PrimePACK™ modules under short circuit operation where short circuit protection on the 2ED300E17-SFO was disabled. High dIC/dt during switching off creates a large overvoltage spike which is limited by active voltage clamping. Figure 9b depicts how a properly selected RSSD resistor limits the short circuit time (<10µs) and slows down the collector current when is turning off. VCE 200V/div VCE 200V/div 2µs/div IC1, IC2, IC3 1kAV/div IC1, IC2, IC3 2µs/div 9a 1kAV/div 9b Figure 9 Switching behavior of three paralleled FF1000R17IE4 PrimePACK™ modules under short circuit where system with the 2ED300E17-SFO and MA300E17 applied: short circuit protection disabled 9a and enabled 9b 3.5 Active voltage clamping – boosted version Active voltage clamping is a technique which keeps transient VCE overvoltages below VCES when the IGBT switches off. The standard approach to active clamping is to use a chain of avalanche diodes connected between the auxiliary collector and the gate of an IGBT module. When the VCE voltage exceeds the diodes breakdown voltage the diodes current sums with the current from the driver output. Due to increased gate-emitter voltage the transistor is held in an active mode and the turn off process is extended. The dIC/dt slows down to a value which results in limited VCE overshoot. Avalanche diodes conduct high peak currents during time period in which VCE overvoltage is limited. Overvoltage protection of the MA300EXX is based on an improved variant of the active clamping as described above. The clamping diodes are connected directly to the IGBTs gate but also to the input of the amplifier located on the MA300EXX. Therefore the major amount of current for recharging the gate is derived from the gate driver power supply instead of via the clamping diodes. This provides more consistent clamping voltage due to operating the clamping diodes at a lower current level and furthermore enables the clamping circuit to be designed independently from the selected external gate resistor. Finally the same circuit for 1200V and 1700V modules using different diodes types has been realized and is shown in Fig. 1. 11 N 2010-03 r 2009 Application Note AN 2007-06 V1.2, June 2010 Module Adapter Board for PrimePACKTM IGBT Modules 0.2µs/div vdriver(t) 5V/div iAVCdiodes(t) 5A/div vGE(t) 5V/div Igate(t) 5A/div Figure 10 Switching off behavior of the FF1000R17IE4 PrimePACK™ module with boosted active clamping where: VDC=900V, IC=2500A, RGoff=1,5Ω and TJ=25°C 3.6 Maximum switching frequency The switching frequency of an IGBT is limited either by the maximal power of the driver voltage supply or by the maximal temperature of the PCB due to the power losses in the external gate resistors. These power losses in the gate resistors depend on the IGBT gate charge, gate voltage magnitude and on the switching frequency of the IGBT. Due to the power losses in the external gate resistors, the heat will be generated, which leads to increase of the PCB temperature in the neighborhood of these resistors. This temperature must not be higher than the melting temperature of the PCB, i.e. 105°C for a standard FR4 material. The calculation of the power losses in the gate resistors can be done by utilizing Equation 1: Pdis = P ( REXT ) + P( RINT ) = ∆Vout ⋅ f s ⋅ QG (1) where: Pdis = dissipated power, ∆Vout = voltage step at the driver output fs = switching frequency, QG = IGBT gate charge (for the given gate voltage range) The complete gate resistor consists of the internal gate resistor RGINT together with an external gate resistor RGEXT and due to that, a part of the IGBT power losses will be dissipated directly through the DCB into the base plate, whereas the other part of the power losses will be dissipated externally in the ambient air and in the PCB. The ratio of the losses dissipated internally P(RGINT) and externally P(RGEXT) corresponds directly to the ratio of the mentioned RGINT and RGEXT resistors. Figure 11 presents a measurement result showing the external gate resistor temperature in dependency on the power transformed in that resistor. It can be read from the graph, that for the ambient temperature of 25°C and the base plate temperature of 125°C the maximal temperature of the PCB reaches 105°C with power losses in RGEXT equal to 1.1W. In that case, the limiting factor for the switching frequency is not the DC-DC converter, with its available power of 4W pro channel, but the maximal temperature of the PCB. Higher switching frequency can be only obtained by utilizing a PCB with higher melting temperature. 12 Application Note AN 2007-06 V1.2, June 2010 Module Adapter Board for PrimePACKTM IGBT Modules Board Temperature vs External Gate Resistor Losses @ Tbaseplate=125°C 110 105 105°C on board (FR4) 100 95 T [°C] N 2010-03 r 2009 90 85 80 75 70 65 60 0 0,2 0,4 0,6 0,8 1 1,1W 1,2 P RG_ext [W] TPCB @TA=25°C Figure 11 PCB temperature vs. gate resistor power losses Table 4 Calculated max. IGBT switching frequencies for 2ED300E17-SFO with MA300Exx and single PrimePACKTM module Module REXT/Ω RINT/Ω fS@Ta=25°C and Tbaseplate=125°C fS Limted by FF600R12IE4 2.2 1.8 10.8 kHz RG power dissipation FF600R12IP4 2.2 1.8 10.8 kHz RG power dissipation FF900R12IP4 1.6 1.2 7 kHz RG power dissipation FF1400R12IP4 1.0 0.8 4.7 kHz RG power dissipation FF650R17IE4 2.78 2.3 8 kHz RG power dissipation FF1000R17IE4 9 1.8 1.5 5.6 kHz RG power dissipation FF1400R17IP4 0.68 1.6 7.5kHz RG power dissipation In order to calculate allowed power losses P(REXT) when base plate and ambient temperatures differ from the example shown above the formula (2) can be used. P ( REXT ) (105 − Tbaseplate / °C ) (105°C − Tambient / °C ) = + W 71 58 (2) Finally, the suggested IGBT maximum switching frequency for given Tbase MA300Exx used together with 2ED300E17-SFO is given by formula (3) P( REXT ) RINT REXT ) ∗( + fs W Ω Ω = fs[Hz ] Qg Hz R 30 ∗ k ∗ EXT ∗ µC Ω (3) Where the tolerance factor k=1.2 9 Based on highest external gate resistor value 13 plate and Tambient for N 2010-03 r 2009 Module Adapter Board for PrimePACKTM IGBT Modules Application Note AN 2007-06 V1.2, June 2010 The driving power increases accordingly to the number of paralleled modules and their switching frequency. The maximum switching frequency in this case is determined by the PCB temperature and the available driving power (4W when used with 2ED300E17-SFO). Table 5 shows switching frequencies where two modules are connected in parallel and Table 6 when the number is three. Both limitation factors are considered. Table 5 Calculated max. IGBT switching frequencies for 2ED300E17-SFO with MA300Exx and two PrimePACKTM modules in parallel Module REXT/Ω RINT/Ω fS@Ta=25°C and Tbase plate=125°C fS limited by FF600R12IE4 2.2 1.8 10.8 kHz RG power dissipation FF600R12IP4 2.2 1.8 10.8 kHz RG power dissipation FF900R12IP4 1.6 1.2 7 kHz RG power dissipation FF1400R12IP4 1.0 0.8 4.7 kHz RG power dissipation FF650R17IE4 2.7 2.3 8 kHz RG power dissipation FF1000R17IE4 1.8 1.5 5.6 kHz RG power dissipation FF1400R17IP4 0.68 1.6 4.1 kHz DC/DC power capability Table 6 Calculated max. IGBT switching frequencies for 2ED300E17-SFO with MA300Exx and three PrimePACKTM modules in parallel Module REXT/Ω RINT/Ω fS@Ta=25°C and Tbase plate=125°C fS limited by FF600R12IE4 2.2 1.8 7.4 kHz DC/DC power capability FF600R12IP4 2.2 1.8 7.4 kHz DC/DC power capability FF900R12IP4 1.6 1.2 4.8 kHz DC/DC power capability FF1400R12IP4 1.0 0.8 3.2 kHz DC/DC power capability FF650R17IE4 2.7 2.3 5.2 kHz DC/DC power capability FF1000R17IE4 1.8 1.5 3.7 kHz DC/DC power capability FF1400R17IP4 0.68 1.6 2.7 kHz DC/DC power capability 3.7 Base plate temperature monitoring by internal NTC resistor The IGBT module base plate temperature can be monitored by proper usage of the NTC resistor built into the module. Electronic acquisition of the NTC temperature requires an external circuit and some examples of circuits and details of the NTC characteristics are described in the application note: AN2009-10. Notice: This temperature measurement is not suitable for short circuit detection or short term overload and may be used to protect the module from long term overload conditions or malfunction of the cooling system. An electrical isolation must be assured between the NTC input signal (IGBT side) and the NTC output control signal. 14 N 2010-03 r 2009 Module Adapter Board for PrimePACKTM IGBT Modules 3.8 Application Note AN 2007-06 V1.2, June 2010 Parallel operation The Flexible Starter Kit9 can be used for driving one PrimePACK™ module as shown on Fig. 2 or up to three paralleled PrimePACK™ modules. In this case all the PrimePACK™ modules should have dedicated MA300Exx boards connected to the 2ED300E17-SFO adapter board as shown on Figure 12. It must be noted that RSSD resistor in every case should be selected accordingly to AN2007-05 chapter 3.5. Figure 12 Connections between MA300Exx and 2ED300E17-SFO with three PrimePACK™ modules in parallel 4 Schematic and Layout of MA300Exx To meet the individual customer requirements and to make the evaluation board simple for further development or modification, all necessary technical data including schematics, PCB layout and components are included in this chapter. 9 consisting of one 2ED300E17-SFO, one 2ED300E17-S /-ST driver board and MA300Exx module adapter board 15 N 2010-03 r 2009 Module Adapter Board for PrimePACKTM IGBT Modules 4.1 Schematic Figure 13 The MA300Exx – top IGBT Figure 14 The MA300Exx – bottom IGBT 16 Application Note AN 2007-06 V1.2, June 2010 N 2010-03 r 2009 Module Adapter Board for PrimePACKTM IGBT Modules Figure 15 The MA300Exx – main connectors Figure 16 The MA300Exx – external connectors 17 Application Note AN 2007-06 V1.2, June 2010 N 2010-03 r 2009 Application Note AN 2007-06 V1.2, June 2010 Module Adapter Board for PrimePACKTM IGBT Modules 4.2 Assembly drawing Basic circuit and layout for the MA300E12 and MA300E17 are similar. The only differences are the transil diodes: ZD1, ZD2, ZD3, ZD4, ZD21, ZD22, ZD23, ZD24 types and assembly. Gate resistors should be assembled accordingly to Table 3 and active clamping diodes should be assembled accordingly to Table 7. Table 7 Assembly Active clamping diodes on the MA300Exx board Board Names Assembled diodes Types of assembled diodes MA300E12_EVAL ZD1, ZD2, ZD3, ZD4 ZD21, ZD22, ZD23, ZD24 SMJC188A ZD1, ZD2, ZD3, ZD21, ZD22, ZD23 1.5SMC440A ZD4, ZD24 Shorted by wire or 0R resistor MA300E17_EVAL Figure 17 The MA300Exx – assembly drawing 18 N 2010-03 r 2009 Module Adapter Board for PrimePACKTM IGBT Modules 4.3 Layout Figure 18 The MA300Exx – Top layer Figure 19 The MA300Exx – Bottom layer 19 Application Note AN 2007-06 V1.2, June 2010 N 2010-03 r 2009 Application Note AN 2007-06 V1.2, June 2010 Module Adapter Board for PrimePACKTM IGBT Modules 4.4 Bill of Material - MA300E12 The bill of material includes a part list as well as assembly notes. The tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to ±5 % and for capacitors of the type X7R less or equal to ±10 %. Table 8 Bill of Material for MA300E12 adapter board Package Type Value / Type size QTY Name Part imperial Resistor see chapter 3.2* 2512 12 Recommended Manufacturer Assembly R1, R2, R3, R4, R5, R6, R21, R22, R23, special pulse R24, R25, R26 resistors R12, R13, R14, R20, R30, R212, R213, special pulse R214 resistors R19, R219 no special yes no special yes no Resistor 1R 1206 6 Resistor 10R 1206 2 Resistor 10R 0603 8 Resistor 27R 0603 8 R8, R9, R10, R11, R28, R29, R210, R211, no special yes Resistor 2k2 0805 2 R7, R27 no special yes Capacitor variable 0805 2 C17, C217 no special no Murata yes R15, R16, R17, R18, R215, R216, R217, R218, yes C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, Capacitor 4µ7/25V/X7R 1206 32 C11, C12, C13, C14, C15, C16, C21, C22, C23, C24, C25, C26, C27, C28, C29, C210, C211, C212, C213, C214, C215, C216, Semiconductor ZXTN2010Z SOT89 8 T1, T2, T3, T4, T21, T22, T23, T24, Zetex yes Semiconductor ZXTP2012Z SOT89 8 T5, T6, T7, T8, T25, T26, T27, T28 Zetex yes DO214AC 4 D5, D6, D25, D26 Vishay no D1, D2, D3, D21, D22, D23 Vishay yes D4, D24 STM yes Vishay yes Semiconductor ES1B (see chapter 3.2) Semiconductor ES1B DO214AC 6 Semiconductor STTH112U SMB 2 SMC 8 ZD1, ZD2, ZD3, ZD4, ZD21, ZD22, ZD23, Semiconductor SMCJ188A Connector 6410-5A 2 X1, X2 Connector 6373-4A 1 X3 ZD24 *Pulse power rated types 20 Moelex (22-27-2051) Molex (22112022) yes yes N 2010-03 r 2009 Application Note AN 2007-06 V1.2, June 2010 Module Adapter Board for PrimePACKTM IGBT Modules 4.5 Bill of Material - MA300E17 The bill of material includes a part list as well as assembly notes. The tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to ±5 % and for capacitors of the type X7R less or equal to ±10 %. Table 9 Bill of Material for MA300E17 adapter board Package Type Value / Type size QTY Name Part imperial Resistor see chapter 3.2* 2512 12 Recommended Manufacturer Assembly R1, R2, R3, R4, R5, R6, R21, R22, R23, special pulse R24, R25, R26 resistors R12, R13, R14, R20, R30, R212, R213, special pulse R214 resistors R19, R219 no special yes no special yes no Resistor 1R 1206 6 Resistor 10R 1206 2 Resistor 10R 0603 8 Resistor 27R 0603 8 R8, R9, R10, R11, R28, R29, R210, R211, no special yes Resistor 2k2 0805 2 R7, R27 no special yes Capacitor variable 0805 2 C17, C217 no special no Murata yes R15, R16, R17, R18, R215, R216, R217, R218, yes C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, Capacitor 4µ7/25V/X7R 1206 32 C11, C12, C13, C14, C15, C16, C21, C22, C23, C24, C25, C26, C27, C28, C29, C210, C211, C212, C213, C214, C215, C216, Semiconductor ZXTN2010Z SOT89 8 T1, T2, T3, T4, T21, T22, T23, T24, Zetex yes Semiconductor ZXTP2012Z SOT89 8 T5, T6, T7, T8, T25, T26, T27, T28 Zetex yes DO214AC 4 D5, D6, D25, D26 Vishay no DO214AC 6 D1, D2, D3, D21, D22, D23 Vishay yes Semiconductor Semiconductor ES1B (see chapter 3.2) ES1B Semiconductor STTH112U SMB 2 D4, D24 STM yes Semiconductor 1.5SMC440A SMC 6 ZD1, ZD2, ZD3, ZD21, ZD22, ZD23, Vishay yes Semiconductor 0R 2 ZD4, ZD24 Vishay yes Connector 6410-5A 2 X1, X2 Connector 6373-4A 1 X3 *Pulse power rated types 21 Molex (22-27-2051) Molex (22112022) Yes yes N 2010-03 r 2009 Module Adapter Board for PrimePACKTM IGBT Modules 5 Application Note AN 2007-06 V1.2, June 2010 How to order Evaluation Driver Boards Every Evaluation Driver Board has its own IFX order number and can be ordered via your Infineon Sales Partner. Information can also be found at the Infineons Web Page: www.infineon.com CAD-data for the board described here are available on request. The use of this data is subjected to the disclaimer given in this AN. Please contact: [email protected] IFX order number for MA300E12: 30259 IFX order number for MA300E17: 30276 IFX order number for 2ED300E17-SFO: 30272 IFX order number for 2ED300C17-S: 29831 IFX order number for 2ED300C17-ST: 29832 22