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DM(R)、NDI(R)、DL(R)、DJ
SPECIFICATION
文 件 編 號 : E-B-AD05
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1.Style:
This specification describes "DUAL IN-LINE PACKAGE SWITCHES" mainly
used as signal switch of electric devices with the general requirements of
mechanical and electrical characteristics.
1.1 Operating Temperature Range : -20℃ ~ +85℃
1.2 Storage Temperature Range : -40℃ ~ +85℃
2. Current Range :
2.1 Non-Switching : 100mA, 50V DC
2.2 Switching
: 25mA , 24V DC
3. Type of Actuation: Actuated by sliding
4. Test Sequence
:
ELECTRIC PERFORMANCE
ITEM DESCRIPTION
1
2
3
4
MECHANICAL
PERFORMANCE
5
6
TEST CONDITIONS
Visual
By visual examination check without
Examination any out pressure & testing.
REQUIREMENTS
There shall be no
defects that affect the
serviceability of the
product.
cTo be measured between the two
terminals associated with each
Contact
switch pole.
50mΩ max. (initial)
Resistance dMeasurements shall be made with a
1kHz shall current contact resistance
meter.
Insulation
500V DC, 1 minute ± 5 sec.
100MΩ min.
Resistance
500V AC (50Hz or 60 Hz) shall be
Dielectric
There shall be no
applied between all the adjacent
withstandbreakdown or
terminals and between the terminal
ing Voltage
flashover.
and the frame for 1 minute.
Capacitance 1 MHz ± 10 kHz
5 pF max.
Applied in the direction of operation.
ON→OFF
1000gf max
Operation OFF→ON
Force
(9.8N max)
文 件 編 號 : E-B-AD05
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DM(R)、NDI(R)、DL(R)、DJ
SPECIFICATION
7
Stop
Strength
A static load of 1 kgf is applied in the
operating direction and pulling direction
operated for a period of 15 seconds.
There shall be no sign of
damage mechanically.
MECHANICAL PERFORMANCE
1.Soldering Temperature :
Soldering
Heat
8
Resistance
9
Vibration
10
Shock
11
Solderability
PROD SERIES
TEMP
TIME
THROUGH HOLE
TYPE
NDI(R)
260℃±5℃
5±1 sec.
SMT TYPE
SEE PAGE 4/4
DM(R)、DL(R)
2.Duration of Solder Immersion:
5±1 sec.
3.Frequency of Soldering Process:
2 times max.
(PCB is 1.6mm in thickness.)
Shall be vibrated in accordance with
Method 201A of MIL-STD-202F
cFrequency: 10-55-10 Hz 1 min/cycle.
dDirection: 3 vertical directions including
the direction of operation.
eTest Time: 2 hours each direction.
Shall be shocked in accordance with
Method 213B condition A of
MIL-STD-202F
cAcceleration: 50G.
dAction Time : 11 ± 1 m sec.
eTesting Direction: 6 sides.
fTest cycle : 3 times in each direction
cNDI(R)Soldering Temperature:230±5℃
dDM(R)、DL(R)Soldering Temperature:
SEE PAGE 4/4
eSoldering Temperature: SEE PAGE 4/4
fFlux: 5-10 seconds.
gDuration of solder Immersion:3±0.5 sec.
As shown in item 2~6
As shown in item 2~6
As shown in item 2~6
No anti-soldering and the
coverage of dipping into
solder must more than 75%
was requested.
DURABILITY
DM(R)、NDI(R)、DL(R)、DJ
SPECIFICATION
Measurements shall be made following
the test set forth below:
Operation c25 mA, 24V DC resistive load
12
dRate of Operation: 15~20 cycles/
Life
minute
eCycle of Operation: 2000 cycles.
Resistance
Low
13
Temperature
WEATHER-PROOF
文 件 編 號 : E-B-AD05
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Resistance
High
14
Temperatur
e
15
Resistance
Humidity
Following the test set forth below the
sample shall be left in normal temperature
and humidity conditions for an hour
before measurements are made :
cTemperature : -40℃±3℃
dTime: 96 hours
Following the test set forth below the
sample shall be left in normal temperature
and humidity conditions for an hour
before measurements are made :
cTemperature : 85℃±2℃
dTime: 96 hours
Following the test set forth below the
sample shall be left in normal temperature
and humidity conditions for an hour
before measurements are made :
cTemperature : 85℃±2℃
dRelative Humidity :90~95%
eTime: 96 hours
cAs show in item 3,4
dContact Resistance:
100mΩ max.
(final-after test)
As shown in item 2~6
1.As shown in item 3~6
2.Contact Resistance:
100mΩ max.
1.As shown in item 4,6
2.Contact Resistance:
100mΩ max.
3.Insulation Resistance:
10MΩ min.
文 件 編 號 : E-B-AD05
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DM(R)、NDI(R)、DL(R)、DJ
SPECIFICATION
5. SOLDERING CONDITIONS:
■ Condition for Soldering –DM(R)、DL(R) Series
■ The condition mentioned above is the temperature on the Cu foil of the
P.C.B surface.
There are cases where board’s temperature greatly differs from switch’s
surface temperature depending on board’s material, size, thickness, etc.
Care, therefore, should be used not to allow switch’s surface temperature
to exceed 240℃.
■ Manual Soldering
Soldering Temperature
Max.350℃
Continuous Soldering Time
Max. 3 seconds
■ Precautions in Handling
1. Care should be exercised so that flux from the upper part of the printed
circuit board does not adhere to the switch.
2. Don’t clean the switch body except with top tape sealed type, which can
only spray of cleaning method from top of s/w.
3. Please make sure that there is no flux rose over the surface of the PCB
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