Full power in half the footprint - First bipolar transistors in LFPAK / Power-SO8

NXP transistors in
LFPAK56 – the true
power package for
smart efficiency
AEC-Q101
(175°C)
Full power in half the footprint
First bipolar transistors in LFPAK/Power-SO8
These high-power bipolar transistors, housed in LFPAK56 (Power-SO8) packages, deliver
DPAK-like thermal and electrical performance in just half the footprint. Offering reliable,
energy-efficient performance, they are AEC-Q101 qualified and support high-temperature
operation (175 °C).
FEATURES AND BENEFITS
`` 25 types up to 100 V and 15 A in single and double
configurations
`` High power dissipation (P tot)
`` Suitable for high-temperature applications (175 °C)
`` Space-saving 5 x 6 mm package outline is half the size of
equivalent transistors in DPAK, SOT223, and other packages
`` Low profile (1 mm)
`` High reliability and mechanical ruggedness thanks to solidcopper clip (no wires)
`` High energy efficiency due to less heat generation
`` AEC-Q101 qualified
`` Future-proof, growing portfolio
APPLICATIONS
`` Power management
`` Motor drives
`` Loadswitches
`` Linear mode voltage regulators
`` LED backlighting applications
`` LED lighting
`` Relay replacement
Cutaway view of LFPAK56
Solid Source
Clip
Mold
Silicon DIE
Solder paste
Gate Clip
Copper Drain Tab
APPLICATION EXAMPLES
Car radio (PHPT60603NY)
Motor drive (2x PHPT60603NY/PY) or a double LFPAK56D
External pass transistor, linear regulator
(PHPT610030NK/PK)
IVN – System Basis Chip (PHPT60603PY)
External pass transistor, linear regulator
Backlight unit (PHPT61002NYC/PYC)
Dimming transistor in matrix headlamp (PHPT60603PY)
Daytime running light (PHPT60603NY)
PHPT60603NY
PHPT60603NY
High-power transistors: single
LFPAK56 Power SO8
(SOT669)
Package
Size (mm)
5x6x1
VCEO
(V)
IC
(A)
ICM
(A)
60
3
8
3
8
2
6
100
hFE
typ
@ IC
(A)
@ VCE
(V)
RCESat typ.
(at) IC/IB =10
VCESat typ (mV);
IC = 0.5 A;
IB=0.05 A
200/400
200/400
150/250
150/250
150/250
150/250
0.5
0.5
0.5
0.5
0.5
0.5
2
2
10
10
10
10
60
80
75
110
80
125
50
70
50
70
50
70
VCESat
max
(mV)
@ IC
(A)
@ IB
(A)
Polarity
270
360
330
360
300
400
3
3
3
2
2
2
0.3
0.3
0.3
0.2
0.2
0.2
NPN
PNP
NPN
NPN
NPN
PNP
PHPT60603NY
PHPT60603PY
PHPT61003NY
PHPT61003PY
PHPT61002NYC
PHPT61002PYC
High-power transistors: double
LFPAK56D Power SO8
(SOT1205)
Package
Size (mm)
5x6x1
VCEO
(V)
IC
(A)
ICM
(A)
hFE
typ
@ IC
(A)
@ VCE
(V)
RCESat typ.
(at) IC/IB =10
VCESat typ (mV);
IC = 0.5 A;
IB=0.05 A
100
100
100
100
3
3
3
3
8
8
8
8
0.5
0.5
0.5
0.5
10
10
10
10
100
3
8
150/250
150/250
150/220
150/220
NPN: 150/250
PNP: 150/220
0.5
10
75
75
110
110
NPN: 75
PNP: 110
50
50
70
70
50
70
VCESat
max
(mV)
@ IC
(A)
@ IB
(A)
330
330
360
360
330
360
3
3
2
2
3
2
0.3
0.3
0.2
0.2
0.3
0.2
Polarity
hFE
matching
2xNPN
2xNPN
2xPNP
2xPNP
0.95
0.95
PHPT610030NK
PHPT610035NK
PHPT610030PK
PHPT610035PK
NPN/PNP
-
PHTP610030NPK
High-current, high-power transistors
LFPAK56 Power SO8
(SOT669)
Package
Size (mm)
5x6x1
VCEO
(V)
IC
(A)
hFE
typ/max
@ IC
(A)
@ VCE
(V)
Polarity
40
40
40
40
40
40
60
60
60
60
100
100
100
100
6
6
10
10
15
15
6
6
10
10
6
6
10
10
230/350
210/300
230/370
240/350
250/410
200/340
240/390
120/200
210/410
120/215
140/260
170/305
150/275
180/330
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
2
2
2
2
2
2
2
2
2
2
2
2
2
2
NPN
PNP
NPN
PNP
NPN
PNP
NPN
PNP
NPN
PNP
NPN
PNP
NPN
PNP
PHPT60406NY
PHPT60406PY
PHPT60410NY
PHPT60410PY
PHPT60415NY
PHPT60415PY
PHPT60606NY
PHPT60606PY
PHPT60610NY
PHPT60610PY
PHPT61006NY
PHPT61006PY
PHPT61010NY
PHPT61010PY
LFPAK56 - DPAK COMPARISON
Parameter
LFPAK56
DPAK
Reliability/mechanical
ruggedness
Designed for reliability:
solid copper clip,
wire-free
Wire bonding prone
to breakage
Outline
5 x 6 mm²
10 x 7 mm²
Height
1 mm
2.3 mm
Occupied area on PCB
30 mm²
70 mm²
Max. temperature
of complete portfolio
175 °C
Image shows
result from thermal
simulation
150 °C
PACKAGE DETAILS
5 mm
5 mm
6 mm
6 mm
LFPAK56 (SOT669)
LFPAK56D (SOT1205)
All package information, including outline and soldering
All package information, including outline and soldering
footprint at www.nxp.com/packages/SOT669.html
footprint at www.nxp.com/packages/SOT1205.html
Product Series Page
www.nxp.com/group/12466
`` Portfolio overview with parametric search
`` Datasheets and supporting documentation
`` Spice models/application notes/thermal design guides
`` Order products online (via distribution partners)
www.nxp.com
© 2015 NXP Semiconductors N.V.
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Date of release: February 2015
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