Reliability Report

AOS Semiconductor
Product Reliability Report
AOL1432/AOL1432L,
rev B
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
495 Mercury Drive
Sunnyvale, CA 94085
U.S.
Tel: (408) 830-9742
www.aosmd.com
Oct 17, 2007
1
This AOS product reliability report summarizes the qualification result for AOL1432. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOL1432 passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
V.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
Quality Assurance Information
I. Product Description:
The AOL1432 uses advanced trench technology and design to provide excellent RDS(ON) with low
gate charge. This device is suitable for use in PWM, load switching and general purpose
applications. Standard product AOL1432 is Pb-free (meets ROHS & Sony 259 specifications).
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Maximum
Units
Drain-Source Voltage
VDS
25
V
Gate-Source Voltage
VGS
±20
V
Continuous Drain
Current
TA=25°C
TA=100°C
Pulsed Drain Current
Continuous Drain
Current
ID
31
IDM
100
TA=25°C
TA=70°C
Avalanche Current
Repetitive avalanche energy
L=0.3mH
TA=25°C
Power Dissipation
44
TA=100°C
TA=25°C
Power Dissipation
TA=70°C
Junction and Storage
Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-toAmbient
Maximum Junction-toAmbient
Maximum Junction-to-Lead
A
21
IDSM
17
IAR
25
EAR
94
mJ
30
PD
W
15
6
PDSM
W
4
TJ, TSTG
-55 to 175
Symbol
T ≤ 10s
SteadyState
SteadyState
A
RθJA
RθJL
°C
Typ
Max
Units
14.2
20
°C/W
48
60
°C/W
3.5
5
°C/W
2
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bond wire
Mold Material
Filler % (Spherical/Flake)
Flammability Rating
Backside Metallization
Moisture Level
AOL1432
Standard sub-micron
Low voltage N channel process
Ultra SO-8TM
Copper
Soft solder
S: AL, 12mils; G: Au 1.3mils
Epoxy resin with silica filler
90/10
UL-94 V-0
Ti / Ni / Ag
Up to Level 1 *
AOL1432L (Green Compound)
Standard sub-micron
Low voltage N channel process
Ultra SO-8TM
Copper
Soft solder
S: AL, 12mils; G: Au 1.3mils
Epoxy resin with silica filler
100/0
UL-94 V-0
Ti / Ni / Ag
Up to Level 1*
Note * based on info provided by assembler and mold compound supplier
III. Result of Reliability Stress for AOL1432 (Standard) & AOL1432L (Green)
Test Item
Test Condition
Time
Point
Lot Attribution
Total
Sample
size
Solder
Reflow
Precondition
Standard: 1hr PCT+3
cycle reflow@260°c
Green: 168hr 85°c
/85%RH +3 cycle
reflow@260°c
Temp = 150°c ,
Vgs=100% of Vgsmax
0hr
Standard: 10 lots
1540 pcs
0
168 / 500
hrs
8 lots
656 pcs
0
1000 hrs
(Note A*)
168 / 500
hrs
8 lots
1000 hrs
(Note A*)
130 +/- 2°c , 85%RH,
33.3 psi, Vgs = 80% of
Vgs max
100 hrs
Standard: 10 lots
121°c , 29.7psi,
RH=100%
96 hrs
HTGB
HTRB
HAST
Pressure Pot
Temp = 150°c ,
Vds=80% of Vdsmax
(Note B**)
Standard: 10 lots
(Note B**)
Temperature
Cycle
-65°c to 150°c ,
air to air,
High
Temperature
Storage
Temp = 150°c
250 / 500
cycles
Standard: 8 lots
(Note B**)
500/1000
hrs
Standard : 5 lots
(Note B**)
Number
of
Failures
77+5 pcs /
lot
656 pcs
0
77+5 pcs /
lot
550 pcs
0
50+5 pcs /
lot
550 pcs
0
50+5 pcs /
lot
440 pcs
0
50+5 pcs /
lot
410 pcs
0
77+5 pcs /
lot
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III. Result of Reliability Stress for AOL1432 (Standard) & AOL1432L (Green)
Continues
DPA
Internal Vision
Cross-section
X-ray
CSAM
NA
5
5
5
5
5
5
0
NA
5
5
0
Bond Integrity
Room Temp
150°c bake
150°c bake
0hr
250hr
500hr
40
40
40
40 wires
40 wires
40 wires
0
Solderability
245°c
5 sec
15
15 leads
0
Note A: The HTGB and HTRB reliability data presents total of available AOL1432 and AOL1432L
burn-in data up to the published date.
Note B: The pressure pot, temperature cycle and HAST reliability data for AOL1432 and
AOL1432L comes from the AOS generic package qualification data.
IV. Reliability Evaluation
FIT rate (per billion): 3
MTTF = 38051years
In general, 500 hrs of HTGB, 150 deg C accelerated stress testing is equivalent to 15 years of
lifetime at 55deg C operating conditions (by applying the Arrhenius equation with an activation
energy of 0.7eV and 60% of upper confidence level on the failure rate calculation). AOS reliability
group also routinely monitors the product reliability up to 1000 hr at and performs the necessary
failure analysis on the units failed for reliability test(s).
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOL1432). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)]
= 1.83 x 109 / [2 (2×164) (500) (258) + 2 (6×164) (1000) (258)] = 3
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MTTF = 10 / FIT =3.33 x 108hrs =38051years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10 -5eV / K
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V. Quality Assurance Information
Acceptable Quality Level for outgoing inspection: 0.1% for electrical and visual.
Guaranteed Outgoing Defect Rate: < 25 ppm
Quality Sample Plan: conform to Mil-Std-105D
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