Data Sheet

SO
T8
9
PXT2907A
60 V, 600 mA, PNP switching transistor
3 August 2015
Product data sheet
1. General description
PNP switching transistor in a medium power flat lead SOT89 (SC-62/TO-243) SurfaceMounted Device (SMD) plastic package.
NPN complement: PXT2222A
2. Features and benefits
•
•
•
High current: max. 600 mA
Low voltage: max. 60 V
AEC-Q101 qualified
3. Applications
•
Switching and linear amplification
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCEO
collector-emitter
voltage
open base
-
-
-60
V
IC
collector current
-
-
-600
mA
hFE
DC current gain
100
-
-
VCE = -1 V; IC = -10 mA; Tamb = 25 °C
5. Pinning information
Table 2.
Pinning information
Pin
Symbol Description
1
E
emitter
2
C
collector
3
B
base
Simplified outline
C
B
3
2
1
SOT89
Scan or click this QR code to view the latest information for this product
Graphic symbol
E
sym132
PXT2907A
NXP Semiconductors
60 V, 600 mA, PNP switching transistor
6. Ordering information
Table 3.
Ordering information
Type number
PXT2907A
Package
Name
Description
Version
SOT89
plastic surface-mounted package; die pad for good heat
transfer; 3 leads
SOT89
7. Marking
Table 4.
Marking codes
Type number
Marking code
[1]
PXT2907A
%2F
[1]
PXT2907A
Product data sheet
% = placeholder for manufacturing site code
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PXT2907A
NXP Semiconductors
60 V, 600 mA, PNP switching transistor
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCBO
collector-base voltage
open emitter
-
-60
V
VCEO
collector-emitter voltage
open base
-
-60
V
VEBO
emitter-base voltage
open collector
-
-5
V
IC
collector current
-
-600
mA
ICM
peak collector current
-
-800
mA
IBM
peak base current
-
-200
mA
Ptot
total power dissipation
[1]
-
0.5
W
[2]
-
0.8
W
[3]
-
1.1
W
single pulse; tp ≤ 1 ms
Tamb ≤ 25 °C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-65
150
°C
Tstg
storage temperature
-65
150
°C
[1]
[2]
[3]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
2
Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm .
2
Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm .
006aaa238
1600
Ptot
(mW)
1200
(1)
(2)
800
(3)
400
0
- 75
- 25
25
75
125
175
Tamb (°C)
2
(1) FR4 PCB; 6 cm mounting pad for collector.
2
(2) FR4 PCB; 1 cm mounting pad for collector.
(3) FR4 PCB; standard footprint.
Fig. 1.
Power derating curves
PXT2907A
Product data sheet
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PXT2907A
NXP Semiconductors
60 V, 600 mA, PNP switching transistor
9. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
Rth(j-sp)
Min
Typ
Max
Unit
[1]
-
-
250
K/W
[2]
-
-
156
K/W
[3]
-
-
113
K/W
-
-
30
K/W
thermal resistance
from junction to solder
point
[1]
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm .
2
006aaa235
103
Zth
(K/W)
2
Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm .
duty cycle = 1
0.75
102
0.5
0.33
0.2
0.1
0.05
10
0.02
0
1
10-5
0.01
10-4
10-3
10-2
10-1
1
10
102
tp (s)
103
Mounted on FR4 PCB; standard footprint.
Fig. 2.
Transient thermal impedance as a function of pulse time; typical values
PXT2907A
Product data sheet
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PXT2907A
NXP Semiconductors
60 V, 600 mA, PNP switching transistor
006aaa236
103
Zth
(K/W)
duty cycle = 1
102
0.75
0.33
0.5
0.2
0.1
10
0
1
10-5
0.05
0.02
0.01
10-4
10-3
10-2
10-1
1
10
102
tp (s)
103
2
Mounted on FR4 PCB; mounting pad for collector 1 cm .
Fig. 3.
Transient thermal impedance as a function of pulse time; typical values
006aaa237
103
Zth
(K/W)
102
duty cycle = 1
0.75
0.33
0.5
0.2
10
0.1
0.05
0.02
0
1
10-5
0.01
10-4
10-3
10-2
10-1
1
10
102
tp (s)
103
2
Mounted on FR4 PCB; mounting pad for collector 6 cm .
Fig. 4.
Transient thermal impedance as a function of pulse time; typical values
PXT2907A
Product data sheet
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PXT2907A
NXP Semiconductors
60 V, 600 mA, PNP switching transistor
10. Characteristics
Table 7.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
ICBO
collector-base cut-off
current
VCB = -50 V; IE = 0 A; Tamb = 25 °C
-
-
-10
nA
VCB = -50 V; IE = 0 A; Tj = 125 °C
-
-
-10
µA
IEBO
emitter-base cut-off
current
VEB = -5 V; IC = 0 A; Tamb = 25 °C
-
-
-50
nA
hFE
DC current gain
VCE = -1 V; IC = -0.1 mA; Tamb = 25 °C
75
-
-
VCE = -1 V; IC = -1 mA; Tamb = 25 °C
100
-
-
VCE = -1 V; IC = -10 mA; Tamb = 25 °C
100
-
-
VCE = -2 V; IC = -150 mA; Tamb = 25 °C
100
-
300
VCE = -10 V; IC = -500 mA;
50
-
-
-
-
-400
mV
-
-
-1.6
V
base-emitter saturation IC = -150 mA; IB = -15 mA;
voltage
Tamb = 25 °C
-
-
-1.3
V
IC = -500 mA; IB = -50 mA;
-
-
-2.6
V
Tamb = 25 °C
VCEsat
collector-emitter
saturation voltage
IC = -150 mA; IB = -15 mA;
Tamb = 25 °C
IC = -500 mA; IB = -50 mA;
Tamb = 25 °C
VBEsat
Tamb = 25 °C
td
delay time
IC = -150 mA; IBon = -15 mA;
-
-
12
ns
tr
rise time
IBoff = 15 mA; Tamb = 25 °C
-
-
30
ns
ton
turn-on time
-
-
40
ns
ts
storage time
-
-
300
ns
tf
fall time
-
-
65
ns
toff
turn-off time
-
-
365
ns
CC
collector capacitance
-
-
8
pF
-
-
35
pF
200
-
-
MHz
VCB = -10 V; IE = 0 A; ie = 0 A;
f = 1 MHz; Tamb = 25 °C
CE
emitter capacitance
VEB = -500 mV; IC = 0 A; ic = 0 A;
f = 1 MHz; Tamb = 25 °C
fT
transition frequency
VCE = -20 V; IC = -50 mA; f = 100 MHz;
Tamb = 25 °C
PXT2907A
Product data sheet
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PXT2907A
NXP Semiconductors
60 V, 600 mA, PNP switching transistor
aaa-013777
300
hFE
aaa-013778
-0.8
IB = -12 mA
-10.8
-9.6
-8.4
IC
(A)
(1)
-0.6
-7.2
-6.0
200
-4.8
(2)
-3.6
-0.4
-2.4
100
(3)
0
-10-1
-1
-0.2
-10
-102
IC (mA)
0
-103
VCE = -2 V
0
-2
-4
Fig. 6.
(2) Tamb = 25 °C
(3) Tamb = −55 °C
-8
-10
VCE (V)
Collector current as a function of collectoremitter voltage; typical values
DC current gain as a function of collector
current; typical values
aaa-013779
-1.2
aaa-013780
-1.2
VBE
(V)
VBEsat
(V)
-1.0
-1.0
(1)
(1)
-0.8
-0.8
(2)
(2)
-0.6
-0.6
(3)
-0.4
-0.2
-10-1
Fig. 7.
-6
Tamb = 25 °C
(1) Tamb = 100 °C
Fig. 5.
-1.2
(3)
-0.4
-1
-10
-102
IC (mA)
-0.2
-10-1
-103
-1
VCE = -2 V
IC/IB = 10
(1) Tamb = −55 °C
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
(3) Tamb = 100 °C
Base-emitter voltage as a function of collector
current; typical values
PXT2907A
Product data sheet
Fig. 8.
-102
IC (mA)
-103
Base-emitter saturation voltage as a function of
collector current; typical values
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PXT2907A
NXP Semiconductors
60 V, 600 mA, PNP switching transistor
aaa-013781
-1
VCEsat
(V)
VCEsat
(V)
-10-1
-10-1
(1)
-10-2
-10-1
Fig. 9.
(2)
-1
aaa-013782
-1
(1)
(2)
(3)
(3)
-10
-102
IC (mA)
-10-2
-10-1
-103
-1
IC/IB = 20
Tamb = 25 °C
(1) Tamb = 100 °C
(1) IC/IB = 100
(2) Tamb = 25 °C
(2) IC/IB = 50
(3) Tamb = −55 °C
(3) IC/IB = 10
Collector-emitter saturation voltage as a
function of collector current; typical values
PXT2907A
Product data sheet
-10
-102
IC (mA)
-103
Fig. 10. Collector-emitter saturation voltage as a
function of collector current; typical values
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PXT2907A
NXP Semiconductors
60 V, 600 mA, PNP switching transistor
11. Test information
- IB
input pulse
(idealized waveform)
90 %
- I Bon (100 %)
10 %
- I Boff
output pulse
(idealized waveform)
- IC
90 %
- I C (100 %)
10 %
t
td
ts
tr
t on
tf
t off
006aaa266
Fig. 11. BISS transistor switching time definition
VBB
RB
VCC
RC
Vo
(probe)
oscilloscope
450 Ω
(probe)
450 Ω
R2
VI
oscilloscope
DUT
R1
mgd624
Fig. 12. Test circuit for switching times
11.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PXT2907A
Product data sheet
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PXT2907A
NXP Semiconductors
60 V, 600 mA, PNP switching transistor
12. Package outline
Plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads
SOT89
B
D
A
bp3
E
1
2
HE
Lp
3
c
bp2
w M B
bp1
e1
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
bp1
bp2
bp3
c
D
E
e
e1
HE
Lp
w
mm
1.6
1.4
0.48
0.35
0.53
0.40
1.8
1.4
0.44
0.23
4.6
4.4
2.6
2.4
3.0
1.5
4.25
3.75
1.2
0.8
0.13
OUTLINE
VERSION
REFERENCES
IEC
SOT89
JEDEC
JEITA
TO-243
SC-62
EUROPEAN
PROJECTION
ISSUE DATE
06-03-16
06-08-29
Fig. 13. Package outline SOT89
PXT2907A
Product data sheet
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PXT2907A
NXP Semiconductors
60 V, 600 mA, PNP switching transistor
13. Soldering
4.75
2.25
2
1.9
1.2
0.2
0.85
solder lands
1.7
1.2
4.6
solder resist
0.5
1
(3×)
4.85
occupied area
1.1
(2×)
1.5
solder paste
Dimensions in mm
1.5
0.6
(3×)
0.7
(3×)
3.95
sot089_fr
Fig. 14. Reflow soldering footprint for SOT89
6.6
2.4
3.5
solder lands
7.6
0.5
solder resist
occupied area
1.8
(2×)
Dimensions in mm
preferred transport direction during soldering
1.9
1.5
(2×)
1.9
0.7
5.3
sot089_fw
Fig. 15. Wave soldering footprint for SOT89
PXT2907A
Product data sheet
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PXT2907A
NXP Semiconductors
60 V, 600 mA, PNP switching transistor
14. Revision history
Table 8.
Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
PXT2907A v.7
20150803
Product data sheet
-
PXT2907A v.6
Modifications:
•
PXT2907A v.6
20141010
Product data sheet
-
PXT2907A v.5
PXT2907A v.5
20041209
Product data sheet
-
PXT2907A v.4
PXT2907A v.4
20020320
Product data sheet
-
-
PXT2907A
Product data sheet
Marking code corrected
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PXT2907A
NXP Semiconductors
60 V, 600 mA, PNP switching transistor
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
15. Legal information
15.1 Data sheet status
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Document
status [1][2]
Product
status [3]
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification
This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Definition
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nxp.com.
15.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
PXT2907A
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their
applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
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PXT2907A
NXP Semiconductors
60 V, 600 mA, PNP switching transistor
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Bitsound, CoolFlux, CoReUse, DESFire, FabKey, GreenChip,
HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, MIFARE,
MIFARE Plus, MIFARE Ultralight, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP
Semiconductors N.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
PXT2907A
Product data sheet
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PXT2907A
NXP Semiconductors
60 V, 600 mA, PNP switching transistor
16. Contents
1
General description ............................................... 1
2
Features and benefits ............................................1
3
Applications ........................................................... 1
4
Quick reference data ............................................. 1
5
Pinning information ............................................... 1
6
Ordering information ............................................. 2
7
Marking ................................................................... 2
8
Limiting values .......................................................3
9
Thermal characteristics .........................................4
10
Characteristics ....................................................... 6
11
11.1
Test information ..................................................... 9
Quality information ............................................... 9
12
Package outline ................................................... 10
13
Soldering .............................................................. 11
14
Revision history ................................................... 12
15
15.1
15.2
15.3
15.4
Legal information .................................................13
Data sheet status ............................................... 13
Definitions ...........................................................13
Disclaimers .........................................................13
Trademarks ........................................................ 14
© NXP Semiconductors N.V. 2015. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 August 2015
PXT2907A
Product data sheet
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