BAS16P2 D

BAS16P2T5G
Switching Diode
The BAS16P2T5G Switching Diode is a spin−off of our popular
SOT−23 three−leaded device. It is designed for switching applications
and is housed in the SOD−923 surface mount package. This device is
ideal for low−power surface mount applications, where board space is
at a premium.
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Features
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
1
CATHODE
Compliant
2
ANODE
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Continuous Reverse Voltage
VR
100
Vdc
Peak Forward Current
IF
200
mAdc
IFM(surge)
500
mAdc
Peak Forward Surge Current
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
MARKING
DIAGRAM
2
1
A6M
SOD−923
CASE 514AA
PLASTIC
1
2
A6 = Specific Device Code
M = Month Code
THERMAL CHARACTERISTICS
Symbol
Max
Unit
Thermal Resistance,
Junction−to−Ambient (Note 1)
Total Power Dissipation @
TA = 25°C
Characteristic
RqJA
PD
520
240
°C/W
mW
Thermal Resistance,
Junction−to−Ambient (Note 2)
Total Power Dissipation @
TA = 25°C
RqJA
PD
175
710
°C/W
mW
TJ, Tstg
−55 to
+150
°C
Junction and Storage
Temperature Range
ORDERING INFORMATION
Device
BAS16P2T5G
Package
Shipping†
SOD−923
(Pb−Free)
8000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. Mounted onto a 4 in square FR−4 board 10 mm sq. 1 oz. Cu 0.06″ thick single
sided. Operating to steady state.
2. Mounted onto a 4 in square FR−4 board 1 in sq. 1 oz. Cu 0.06″ thick single
sided. Operating to steady state.
© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 1
1
Publication Order Number:
BAS16P2/D
BAS16P2T5G
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Characteristic
Min
Max
−
−
−
−
1.0
100
50
30
100
−
−
−
−
−
715
855
1000
1250
Unit
OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(VR = 75 Vdc)
(VR = 100 Vdc)
(VR = 75 Vdc, TJ = 150°C)
(VR = 25 Vdc, TJ = 150°C)
IR
Reverse Breakdown Voltage
(IBR = 100 mAdc)
V(BR)
mAdc
Vdc
Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 150 mAdc)
VF
Diode Capacitance
(VR = 0, f = 1.0 MHz)
CD
−
2.0
pF
Forward Recovery Voltage
(IF = 10 mAdc, tr = 20 ns)
VFR
−
1.75
Vdc
Reverse Recovery Time
(IF = IR = 10 mAdc, RL = 50 W)
trr
−
6.0
ns
Stored Charge
(IF = 10 mAdc to VR = 5.0 Vdc,
RL = 500 W)
QS
−
45
pC
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2
mV
BAS16P2T5G
820 W
+10 V
2.0 k
IF
100 mH
tp
tr
0.1 mF
IF
t
trr
10%
t
0.1 mF
90%
D.U.T.
50 W INPUT
SAMPLING
OSCILLOSCOPE
50 W OUTPUT
PULSE
GENERATOR
iR(REC) = 1.0 mA
IR
VR
OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)
INPUT SIGNAL
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
10
100
IR , REVERSE CURRENT (μA)
TA = 85°C
10
TA = -40°C
1.0
TA = 25°C
TA = 125°C
1.0
TA = 85°C
0.1
TA = 55°C
0.01
TA = 25°C
0.001
0.1
0.2
0.4
0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)
0
1.2
10
Figure 2. Forward Voltage
20
30
40
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Leakage Current
0.68
CD, DIODE CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
TA = 150°C
0.64
0.60
0.56
0.52
0
2
4
6
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
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3
8
50
BAS16P2T5G
PACKAGE DIMENSIONS
SOD−923
CASE 514AA
ISSUE E
D
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
1
2X b
0.08 X Y
2
TOP VIEW
DIM
A
b
c
D
E
HE
L
L2
A
c
HE
SIDE VIEW
MILLIMETERS
MIN
NOM MAX
0.34
0.39
0.43
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.19 REF
0.05
0.10
0.15
INCHES
MIN
NOM MAX
0.013 0.015 0.017
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.007 REF
0.002 0.004 0.006
SOLDERING FOOTPRINT*
2X
L
2X
0.36
2X
L2
PACKAGE
OUTLINE
BOTTOM VIEW
1.20
2X
0.25
DIMENSIONS: MILLIMETERS
See Application Note AND8455/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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4
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Sales Representative
BAS16P2/D
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