CM1693 D

CM1693-04DE,
CM1693-06DE,
CM1693-08DE
L-C LCD and Camera EMI
Filter Array with ESD
Protection
http://onsemi.com
Product Description
The CM1693 is a family of pi−style EMI filter arrays with ESD
protection, which integrates four, six or eight filters (C−L−C) into
a small−form factor, uDFN 0.40 mm pitch package. Each EMI filter
channel is implemented as a 3−pole L−C filter, where the component
values are 10 pF−26 nH−12 pF. The CM1693’s roll−off frequency at
−6 dB attenuation is 300 MHz and can be used in applications where
the data rates are as high as 140 Mbps. The CM1693 also provides
greater than −30 dB attenuation over the 800 MHz to 6 GHz frequency
range. The device includes ESD diodes on every pin that provide
a very high level of protection for sensitive electronic components
against possible electrostatic discharge (ESD). The ESD protection
diodes connected to the filter ports are designed and characterized to
safely dissipate ESD strikes of ±18 kV, which is beyond the maximum
requirement of the IEC61000−4−2 international standard.
This device is particularly well suited for wireless handsets, mobile
LCD modules and PDAs because of its small package format and
easy−to−use pin assignments. In particular, the CM1693 is ideal for
EMI filtering and protecting data and control lines for the LCD display
and camera interface in mobile handsets.
The CM1693 is housed in space saving, low profile, 0.40 mm pitch
uDFN packages in a RoHS compliant, Pb−Free format.
Features
• 4, 6 or 8 Channels of EMI Filtering with Integrated ESD Protection
• Pi−Style EMI Filters in a Capacitor−Inductor−Capacitor (C−L−C)
•
•
•
•
•
•
Network
+18 kV ESD Protection on Each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
Greater than −35 dB Attenuation (Typical) at 1GHz
uDFN Lead−Free Package with 0.40 mm Lead Pitch:
♦ 4−Ch. = 8−Lead uDFN
♦ 6−Ch. = 12−Lead uDFN
♦ 8−Ch. = 16−Lead uDFN
uDFN Package size:
♦ 8−Lead: 1.70 mm x 1.35 mm
♦ 12−Lead: 2.50 mm x 1.35 mm
♦ 16−Lead: 3.30 mm x 1.35 mm
Increased Robustness Against Vertical Impacts During
Manufacturing Process
These Devices are Pb−Free and are RoHS Compliant
1
16
1
uDFN8
DE SUFFIX
CASE 517BC
1
uDFN12
DE SUFFIX
CASE 517BD
uDFN16
DE SUFFIX
CASE 517BE
ELECTRICAL SCHEMATIC
26 nH
Filter +
ESDn*
10 pF
Filter +
ESDn*
12 pF
GND
1 of 4, 6 or 8 EMI/RFI Filter Channels
with Integrated ESD protection
* See Package/Pinout Diagram for expanded pin information
MARKING DIAGRAM
P93 MG
G
1
P936 MG
G
P938 MG
G
1
1
XXXX = Specific Device Code
M
= Month Code
G
= Pb−Free Package
(*Note: Microdot may be in either location)
Package
Shipping†
CM1693−04DE
uDFN−8
(Pb−Free)
3000/Tape & Reel
CM1693−06DE
uDFN−12
(Pb−Free)
3000/Tape & Reel
CM1693−08DE
uDFN−16
(Pb−Free)
3000/Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
• Handheld PCs/PDAs
• LCD and Camera Modules
• EMI Filtering for Data Ports in Cell Phones, PDAs
• LCD and Camera Data Lines in Mobile Handsets
• I/O Port Protection for Mobile Handsets, Notebook
or Notebook Computers.
Computers, PDAs etc.
May, 2013 − Rev. 3
12
ORDERING INFORMATION
Applications
© Semiconductor Components Industries, LLC, 2013
8
• Wireless Handsets
1
Publication Order Number:
CM1693/D
CM1693−04DE, CM1693−06DE, CM1693−08DE
PACKAGE / PINOUT DIAGRAMS
Table 1. PIN DESCRIPTIONS
Device Pin(s)
TOP VIEW
(Pins Down View)
−04
−06
−08
Name
1; 8
1; 12
1; 16
FILTER1
Filter + ESD Channel 1
2; 7
2; 11
2; 15
FILTER2
Filter + ESD Channel 2
3; 6
3; 10
3; 14
FILTER3
Filter + ESD Channel 3
4; 5
4; 9
4; 13
FILTER4
Filter + ESD Channel 4
5; 8
5; 12
FILTER5
Filter + ESD Channel 5
6; 7
6; 11
FILTER6
Filter + ESD Channel 6
7; 10
FILTER7
Filter + ESD Channel 7
8; 9
FILTER8
Filter + ESD Channel 8
GND PAD
Description
GND
8
7
6
BOTTOM VIEW
(Pins Up View)
5
P93
(x)
Single Digit
Date Code
1
2
Pin 1
Marking
3
12 11 10 9
Single Digit
Date Code
8
4
8
CM1693−04DE
8−Lead uDFN Package
Bottom View
(Pins Up View)
1
7
P936(x)
1
2
3
4
2
3
4
5
6
8
7
GND PAD
5
6
12 11 10 9
Pin 1
Marking
CM1693−06DE
12−Lead uDFN Package
BOTTOM VIEW
(Pins Up View)
TOP VIEW
(Pins Down View)
Single Digit
Date Code
16 15 14
13 12 11
10
9
1
2
3
P938 (x)
Pin 1
Marking
1
2
3
4
5
6
4
5
6
7
8
13 12 11
10
9
GND PAD
7
16 15 14
8
CM1693−08DE
16−Lead uDFN Package
http://onsemi.com
2
3
4
GND PAD
Device Ground
Top View
(Pins Down View)
2
1
7
6
5
CM1693−04DE, CM1693−06DE, CM1693−08DE
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
–65 to +150
°C
Current per Inductor
30
mA
DC Package Power Rating
500
mW
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
Units
–40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Parameter
Symbol
L
Conditions
Min
Channel Inductance
Typ
CTOTAL
Total Channel Capacitance
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
17.6
VDIODE
5.5
pF
0.1
1.0
mA
6.8
–0.8
9.0
−0.4
IDIODE = 10 mA
Diode Leakage Current (reverse bias)
VDIODE = +3.3 V
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
ILOAD = –10 mA
VESD
In−system ESD Withstand Voltage
Contact Discharge per IEC 61000−4−2 Level 4
RDYN
Dynamic Resistance
Positive
Negative
2.3
0.9
Roll−off Frequency at −6 dB Attenuation
ZSOURCE = 50 W, ZLOAD = 50 W
300
(Notes 2, 3 and 4)
nH
26.4
Standoff Voltage
5.6
–1.5
Units
22
ILEAK
fR
Max
26
V
V
kV
±18
W
MHz
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin (i.e. if ESD is applied to pin A1 then clamping voltage is
measured at pin C1). Unused pins are left open.
4. These parameters are guaranteed by design and characterization.
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3
CM1693−04DE, CM1693−06DE, CM1693−08DE
PERFORMANCE INFORMATION
Typical Filter Performance (TA = 25°C, DC Bias = 0 V, 50 Ohm Environment)
Figure 1. Typical Filter Insertion Loss (CM1693)
Typical Diode Capacitance vs. Input Voltage
Figure 2. Filter Capacitance vs. Input Voltage
(Normalized to Capacitance at 0 VDC and 25°C)
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4
CM1693−04DE, CM1693−06DE, CM1693−08DE
MECHANICAL DETAILS
uDFN−08, uDFN−12 and uDFN−16 Mechanical Specifications, 0.4mm
The 8−lead, 12−lead and 16−lead, 0.4 mm pitch uDFN package dimensions are presented below.
Table 5. TAPE AND REEL SPECIFICATIONS
Pocket Size (mm)
Tape Width†
Package Size (mm)
B0 x A0 x K0
W
Reel
Diameter
Qty per
Reel
P0
P1
CM1693−04DE
1.70 x 1.35 x 0.50
1.95 x 1.60 x 0.60
8 mm
178 mm (7″)
3000
4 mm
4 mm
CM1693−06DE
2.50 x 1.35 x 0.50
2.75 x 1.60 x 0.60
8 mm
178 mm (7″)
3000
4 mm
4 mm
CM1693−08DE
3.30 x 1.35 x 0.50
3.50 x 1.55 x 0.70
12 mm
178 mm (7″)
3000
4 mm
4 mm
Part Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
10 Pitches Cumulative
P0
Top
Î
Î
Î
Î
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Tolerance On Tape
±0.2 mm
Cover
Tape
K0
For Tape Feeder Reference
Only Including Draft
Concentric Around B
A0
W
B0
Embossment
P1
User Direction of Feed
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5
Center Lines
of Cavity
CM1693−04DE, CM1693−06DE, CM1693−08DE
PACKAGE DIMENSIONS
UDFN8, 1.7x1.35, 0.4P
CASE 517BC−01
ISSUE O
A
B
D
2X
0.10 C
PIN ONE
REFERENCE
2X
0.10 C
ÉÉ
ÉÉ
ÇÇ
ÇÇ
ÉÉ
MOLD CMPD
EXPOSED Cu
A1
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A3
DETAIL B
ALTERNATE
CONSTRUCTIONS
TOP VIEW
A
DETAIL B
0.05 C
8X
L
L1
DETAIL A
0.05 C
NOTE 4
SIDE VIEW
DETAIL A
8X
L
(A3)
L
A1
C
SEATING
PLANE
ALTERNATE TERMINAL
CONSTRUCTIONS
D2
1
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
RECOMMENDED
SOLDERING FOOTPRINT*
E2
1.40
8X
8
K
e
e/2
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.70 BSC
1.10
1.30
1.35 BSC
0.30
0.50
0.40 BSC
0.15
−−−
0.20
0.30
−−−
0.05
8X
0.40
8X b
PACKAGE
OUTLINE
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
1.55
0.50
8X
0.25
1
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
CM1693−04DE, CM1693−06DE, CM1693−08DE
PACKAGE DIMENSIONS
UDFN12, 2.5x1.35, 0.4P
CASE 517BD−01
ISSUE O
A
B
D
2X
0.10 C
PIN ONE
REFERENCE
2X
L1
ÉÉÉ
ÉÉÉ
0.10 C
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
TOP VIEW
A
DETAIL B
(A3)
A1
0.05 C
NOTE 4
12X
A1
SIDE VIEW
6
1
C
SEATING
PLANE
A3
DETAIL B
OPTIONAL
CONSTRUCTION
12
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
2.50 BSC
1.90
2.10
1.35 BSC
0.30
0.50
0.40 BSC
0.15
−−−
0.20
0.30
−−−
0.05
RECOMMENDED
SOLDERING FOOTPRINT*
E2
PACKAGE
OUTLINE
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DETAIL A
D2
L
ÇÇ
ÇÇ
ÉÉ
MOLD CMPD
EXPOSED Cu
0.05 C
12X
L
L
7
e
BOTTOM VIEW
12X
2.20
12X
0.40
b
0.10 C A B
0.05 C
1.55
NOTE 3
0.50
12X
0.40
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
CM1693−04DE, CM1693−06DE, CM1693−08DE
PACKAGE DIMENSIONS
UDFN16, 3.3x1.35, 0.4P
CASE 517BE−01
ISSUE O
A
B
D
2X
0.10 C
PIN ONE
REFERENCE
2X
0.10 C
ÉÉÉ
ÉÉÉ
L1
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
TOP VIEW
EXPOSED Cu
A
DETAIL B
0.05 C
(A3)
16X
A1
0.05 C
NOTE 4
16X
A1
SIDE VIEW
8
1
K
16
9
e
C
ÇÇ
ÉÉ
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MOLD CMPD
A3
DETAIL B
SEATING
PLANE
OPTIONAL
CONSTRUCTION
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
3.30 BSC
2.70
2.90
1.35 BSC
0.30
0.50
0.40 BSC
0.15
−−−
0.20
0.30
−−−
0.05
DETAIL A
D2
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L
RECOMMENDED
SOLDERING FOOTPRINT*
E2
16X
PACKAGE
OUTLINE
b
BOTTOM VIEW
3.00
16X
0.40
0.10 C A B
0.05 C
1.55
NOTE 3
0.50
16X
0.40
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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CM1693/D
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