NUF2450 D

NUF2450
2 Line EMI Filter with
ESD Protection
This device is a 2 line EMI filter array for audio applications.
Greater than −30 dB attenuation is obtained at frequencies from
800 MHz to 5.0 GHz. The NUF2450MU has a cut−off frequency of
20 MHz and minimal line resistance, making it ideal for applications
requiring low bandpass attenuation. This UDFN package is
specifically designed to enhance EMI filtering for low−profile or slim
design electronics especially where space and height is a premium. It
also offers ESD protection−clamping transients from static discharges.
ESD protection is provided across all capacitors.
Features
•
L
1
Cd
8
Cd
L
4
• EMI Filtering and ESD Protection
• Integration of 10 Discrete Components
• Compliance with IEC61000−4−2 (Level 4)
•
•
•
http://onsemi.com
Cd
5
Cd
(Top View)
20 kV (Contact)
UDFN Package, 1.2 x 1.8 mm
Moisture Sensitivity Level 1
ESD Ratings:
Machine Model = C
Human Body Model = 3B
This is a Pb−Free Device*
8
MARKING
DIAGRAM
1
UDFN8
CASE 517AD
24 MG
G
1
Benefits
• Reduces EMI/RFI Emissions on Audio Lines
• Low Profile Package; Typical Height of 0.5 mm
• Design−Friendly and Easy−to−Use Pin Configurations,
•
•
•
•
Particularly for Portable Electronics
Integrated Solution Offers Cost and Space Savings in UDFN Package
Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
Integrated Solution Improves System Reliability
Excellent ESD Performance with Large GND Pad
24 = Specific Device Code
M = Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
1
4
GND
Applications
• Headsets, MP3 Players, and PDAs
• Portable DVDs
• Hands−Free Interface
8
October, 2011 − Rev. 0
5
ORDERING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2011
(Bottom View)
1
Device
Package
Shipping†
NUF2450MUT2G
UDFN8
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NUF2450/D
NUF2450
MAXIMUM RATINGS
Parameter
Symbol
ESD Discharge IEC61000−4−2
Value
VPP
Contact Discharge
Machine Model
Human Body Model
Unit
kV
20
1.6
16
Operating Temperature Range
TOP
−40 to 85
°C
Storage Temperature Range
TSTG
−55 to 150
°C
TL
260
°C
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Maximum Reverse Working Voltage
VRWM
Breakdown Voltage
Test Conditions
Min
Typ
Max
Unit
−
−
5.0
V
VBR
IR = 1.0 mA
6.0
7.0
8.0
V
Leakage Current
IR
VRWM = 3.3 V
−
−
100
nA
Inductance
L
−
2.3
−
nH
Series Resistance
0.9
1.3
1.7
Capacitance (Note 1)
Cline
RS
VR = 0 V, f = 1.0 MHz
190
240
290
pF
Cut−Off Frequency (Note 2)
f3dB
Above this frequency,
Appreciable Attenuation Occurs
−
20
−
MHz
1. Measured at 25°C.
2. 50 source and 50 load termination.
0
0
−5
−10
−10
−20
−20
S41 (dB)
S21 (dB)
−15
−25
−30
−35
−30
−40
−50
−40
−60
−45
−50
1.00E+06
1.00E+07
1.00E+08
1.00E+09
1.00E+10
−70
1.E+06
1.E+07
1.E+08
1.E+09
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 1. Typical Insertion Loss
Characteristics (S21 Measurement)
Figure 2. Analog Crosstalk Curve (S41
Measurement)
http://onsemi.com
2
1.E+10
NUF2450
PACKAGE DIMENSIONS
UDFN8, 1.8x1.2, 0.4P
CASE 517AD
ISSUE C
A
B
D
2X
0.10 C
PIN ONE
REFERENCE
2X
ÉÉÉ
ÉÉÉ
ÇÇ
ÉÉ
ÉÉ
MOLD CMPD
EXPOSED Cu
A3
A1
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DETAIL B
ALTERNATE
CONSTRUCTIONS
0.10 C
DIM
A
A1
A3
b
D
E
e
D2
E2
J
K
L
L1
TOP VIEW
A
DETAIL B
0.05 C
8X
0.05 MIN
(A3)
(0.10)
0.05 C
NOTE 4
SIDE VIEW
L
C
L
L1
D2
1
DETAIL A
SEATING
PLANE
J
DETAIL A
8X
A1
E2
SOLDERING FOOTPRINT*
DETAIL A
OPTIONAL
CONSTRUCTION
8X
K
8
e
e/2
1.10
7X
8X b
0.25
8X
0.45
PACKAGE
OUTLINE
0.10 C A B
0.05 C
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.80 BSC
1.20 BSC
0.40 BSC
0.90
1.10
0.20
0.30
0.19 REF
0.20
−−−
0.20
0.30
−−−
0.10
NOTE 3
BOTTOM VIEW
1.50
0.35
1
0.35
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
3
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NUF2450/D