BM20 Evaluation Board User Guide

BM20 Bluetooth®
Evaluation Board User’s Guide
2015 Microchip Technology Inc.
Preliminary Edition
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BM20 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
Index
Preface........................................................................................................................................ 4
1 OVERVIEW .............................................................................................................................. 6
1.1 INTRODUCTION................................................................................................................................................ 6
1.2 BM20 EVALUATION BOARD FEATURES ........................................................................................................ 6
1.3 BM20 EVALUATION BOARD CONTENTS ........................................................................................................ 7
2. Getting Started ..................................................................................................................... 10
2.1 INTRODUCTION.............................................................................................................................................. 10
2.2 HARDWARE REQUIREMENTS ...................................................................................................................... 10
2.3 APPLICATION DEMONSTRATION ................................................................................................................. 10
2.4 SOFTWARE/UTILITY REQUIREMENTS ........................................................................................................ 13
2.5 MODULE CONFIGURATION........................................................................................................................... 25
APPENDIX A. BM20 AUDIO EVALUATION BOARD SCHEMATICS ....................................... 26
APPENDIX B. CLASS D AMPLIFIER DAUGHTER BOARD.................................................... 31
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TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at [email protected] We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
Abbreviations List:
HFP: Hands-free Profile
AVRCP: Audio Video Remote Control Profile
A2DP: Advanced Audio Distribution Profile
HSP: Headset Profile
NFC: Near Field Communication
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EVALUTATION BOARD USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools
and documentation are constantly evolving to meet customer needs, so some actual
dialogs and/or tool descriptions may differ from those in this document. Please refer to
our web site
(www.microchip.com) to obtain the latest documentation available.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
Product Name. Items discussed in this chapter include:

Document Layout

Recommended Reading

The Microchip Web Site

Customer Support

Document Revision History
DOCUMENT LAYOUT
This user’s guide describes how to use the BM20 Bluetooth Evaluation Board. The document is organized as
follows:

Chapter 1. “Overview” – This chapter introduces the BM20 Bluetooth Evaluation Board and provides an
overview of various features.


Chapter 2. “Getting Started” – This chapter describes

The hardware components and setup of the BM20 Bluetooth Evaluation Board.

The application demonstrations of the BM20 Bluetooth Evaluation Board.

Software/Utility Requirements of the BM20 Bluetooth Evaluation Board.
Appendix A. “BM20 Audio Evaluation Board Schematics” – This appendix includes a schematic of the
BM20 Bluetooth Evaluation Board.
RECOMMENDED READING
This user’s guide describes how to use the BM20 Bluetooth Evaluation Board. Other useful documents are
listed below. The following Microchip documents are available and recommended as supplemental reference
resources:
STEREO Module Data Sheet (DSxxxxxxxx)
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at http://www.microchip.com. This
web site is used as a means to make files and information easily available to
customers. Accessible by using your favorite Internet browser, the web site contains
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EVALUTATION BOARD USER’S GUIDE
the following information:

Product Support – Data sheets and errata, application notes and sample programs, design resources,
user’s guides and hardware support documents, latest software releases and archived software

General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online
discussion groups, Microchip consultant programmember listing

Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of
seminars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:

Distributor or Representative

Local Sales Office

Field Application Engineer (FAE)

Technical Support
Customers should contact their distributor, representative or Field Application Engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
DOCUMENT REVISION HISTORY
Revision A (Aug 2015)
This is the initial released version of this document.
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EVALUTATION BOARD USER’S GUIDE
1 OVERVIEW
1.1 INTRODUCTION
®
This user’s guide describes the hardware and software setup for the BM20 Bluetooth Evaluation Board.
This board contains the hardware needed to evaluate the BM20 Bluetooth module. The BM20 module is
mounted to an evaluation board that demonstrates the module’s key features. The evaluation board contains:

Stereo audio output

Easy access to IO pins

6 push buttons to control audio playback

Status LEDs

The BM20 supports the following Bluetooth profiles: A2DP, AVRCP, and HFP/HSP

A2DP stereo audio (Sink mode wi support for Sub-Band Coding (SBC),

AVRCP media player remote control

HFP/HSP for accepting a phone call support.
For data sheet and other details related to BM20 module, refer to the Microchip web
site at http://www.microchip.com.
This chapter discusses the following topics:

BM20 Evaluation Board Features

BM20 Evaluation Board Contents and Part Details
1.2 BM20 EVALUATION BOARD FEATURES
The BM20 Evaluation Board has the following features:

Fully qualified Bluetooth version 4.1 module, fully compatible with Bluetooth version 3.0, 2.0, 1.2
system.

Embedded BM20 module with postage-stamp size form factor of 15 x 29 x 2.5 mm (include shielding
case)

Embedded Bluetooth stack profiles: A2DP, AVRCP, and HFP/HSP

Stereo audio output for highest quality audio

Castellated SMT pads for easy and reliable PCB mounting

Environmentally friendly, RoHS compliant

Bluetooth SIG certified

On board external CDA for speaker demonstration.
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1.3 BM20 EVALUATION BOARD CONTENTS
BM20 Evaluation Board contains the following components as shown in Figure 1-1 which describes the
evaluation board’s interfaces and connectors. Table 1-1 describes the various components of the evaluation
board.
FIGURE 1-1: BM20 EVALUATION BOARD
Audio Output (JP23)
1
2
MIC (JP22)
3
1
2
NFC tag connector (JP3)
1
3
2
Pin
Description
Pin
Description
Pin
Description
1
AOHPL
1
MIC_P1
1
NFC_P
2
AOHPM
2
AGND
2
NFC_N
3
AOHPR
3
MIC_N1
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IO Connector (J1)
On Board External CDA Interface (J2)
7
5
3
1
12 10 8
6
4
2
11
9
Pin
Description
Pin
Description
Pin
Description
1
P0_0
7
P2_4
1
External AMP enable
2
P3_0
8
P0_2
2
control(P1_5)
3
P2_0
9
P0_3
3
R channel signal to external
4
P1_5
10
P0_5
4
AMP.
5
P0_4
11
P2_7
5
L channel signal to external
6
P0_1
12
P2_4
6
AMP.
7
5V power for external AMP
8
from USB.
External AMP Connector (JP26)
Battery connector (JP20) and Jack (JP19)
(Alternative for BAT_IN)
1
2
3
4
5
2
1
+
Pin
Description
Pin
Description
1
EXT_AMP_EN
1
BAT_IN
2
SPKR
2
GND
3
AGND
4
SPKL
5
AMP_POWER
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TABLE 1-1:BM20 EVALUATION BOARD HARDWARE
Hardware Component
Description
®
BM20
Bluetooth 4.1 Module
USB Connector
DC 5V input, USB to UART for EEPROM R/W
BAT connector & Jack
JP20 and JP19 , alternative for BAT_IN
Audio 3.5 mm jack for audio playback(P6).
Audio Out
External AMP daughter board connector (JP26).
On Board external CDA output connector (J3/4).
Audio In
Audio 3.5 mm jack for Mono microphone input(P5) and AUX input(P7)
Status LEDs
Red and Blue LEDs show the pairing/connection status
MFB Button
Switch to turn on/off BM20 module (SW7; Button 0 in UI)
Play/Pause Button
Button to play or pause the audio playback (SW8; Button1 in UI)
Previous Track Button
Button to skip track backwards (SW4; Button 5 in UI)
Next Track Button
Button to skip track forwards(SW5; Button 4 in UI)
Volume Up Button
Button to increase volume (SW9; Button 2 in UI)
Volume Down Button
Button to decrease volume (SW10; Button 3 in UI)
Reset Button
Reset system (SW11)
NFC Tag Connector
NFC Tag connector.(For NFC tag without Rectifier Circuit)(JP3)
MP Tool Interface
Interfaces connect to VICTORIA board when use MP Tool
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2. Getting Started
2.1 INTRODUCTION
This chapter describes how the BM20 Evaluation Board works. Certain hardware and utilities are essential to
support the evaluation/development of demo applications. This chapter discusses the following topics:

Hardware Requirements

Software/Utility Requirements

Module Configuration
2.2 HARDWARE REQUIREMENTS
2.2.1 HARDWARE SETUP
To setup the evaluation hardware, perform the following steps:
1. Make sure pin 1 / 2 / 3 of “SW12” in “Off / Off / On” state make .system in application mode.
2. Connect the portable mini-speaker 3.5 mm to the stereo audio out connector (P6).
2.2.2 USING THE EVALUATION BOARD
1. Connect Li-Ion batteries to JP20 or JP19.
2. Click MFB button to turn-on and enter pairing mode. The status LEDs will blink. Now the BM20 Evaluation
board should be discoverable.
3. Turn on Bluetooth device manager on a host device (PC or smartphone), the host device will display a list
of discoverable Bluetooth devices. The board display as “EDDY SHS”.
4. If the pairing with the device is successful, BM20 evaluation board can connect to the host device. Once
connected, BM20 evaluation board enables Advanced Audio Distribution Profile (A2DP) for audio
playback and Audio Video Remote Control Profile (AVRCP) for player control.
2.3 APPLICATION DEMONSTRATION
2.3.1 AUDIO DEMONSTRATION
In this demonstration, user can play an audio stream on both BM20 evaluation boards using a computer or
smartphone. The following are the steps to perform the demonstration.
1. Connect BM20 evaluation board to a host device (PC or smartphone) that has an audio source.
2. Connect headphones (or mini-speakers) to BM20 evaluation board P6.
3. Open the audio source on the host device. Microchip recommends using media player.(e.g. Microsoft
Media Player, iTunes, and Android).
4. Start the audio stream on the media player.
When BM20 evaluation board is connected to an audio source compatible with Bluetooth AVRCP, the audio
control buttons are use to:

Control the volume of audio output.

Go to the previous track.
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
Go to the next track.

Start / stop playing the current track.
FIGURE 1-2: BM20 EVALUATION BOARD AUDIO CONTROL BUTTONS
FIGURE 1-3: BM20 EVALUATION BOARD WITH EXTERNAL CLASS-D AMPLIFIER
(It need modify the setting in UI to support external amplifier)
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2.3.2 HSP/HFP DEMONSTRATION
In this demonstration, user can explore the hands-free profile setting to receive an incoming voice call from a
paired smartphone. This demonstration requires a microphone. It would be good to use a PC
headset/microphone (with two-plugs). The following are the steps to perform the demonstration.
1. Connect the headset/microphone to BM20 evaluation board’s audio out connector (P6) and MIC input
(P5) respectively.
2. Connect BM20 evaluation board to a smartphone that supports the A2DP and HFP/HSP Bluetooth
profiles.
3. From another one phone, initiate a call to the smartphone that is paired with BM20 evaluation board. The
A2DP stream pauses and the ringtone plays on the headset.
4. Click button “MFB” on BM20 evaluation board to accept the incoming call.
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2.4 SOFTWARE/UTILITY REQUIREMENTS
2.4.1 UI SETTING
Step1. Open UI tool
Step2. Firstly, you can load default UI setting or previous setting file.
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Step3. Click “Edit” to modify the settings meet your needs.
Step4. In the main settings, it can enable or disable supported profile or function which system need.
Click “Next” for other setting.
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Step5. You can do system and functional setting in these pages.
Click “Help” you can get more detail information.
Step6. After finish parameter set up, click “Finish” button and a message will remind you check EEPROM
size on your system.
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Step7. Click “Save” button to save these UI parameter as a “.txt” file
Step8. We will use MPET tool to merge it with EEPROM table and use EEPROM tool load these parameter
to system.
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2.4.2 DSP TOOL SETTING
Step1. Open DSP tool
Step2. Select IC version ““IS2020_XXX_SHS” (XXX is the version of chip, e.g. IS2020S-203)
Step3. You can setup all voice and audio function in these pages.
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Step4. Click “Save” button to save these DSP parameter as a “.txt” file after finish all DSP setting.
Then use MPET tool to merge it with EEPROM table and use EEPROM tool load these
parameter to system.
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2.4.3 MERGE TOOL SETTING
Step1. Open MPET tool, click “Next” to set up.
Step2. Select “UI Patch Only” to use full EEPROM table to merge UI and DSP parameter.
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Step3. Select the bin file (full EEPROM table) and click “Next”
Step4. If the bin file had included UI, DSP or patch code parameter, you can see them in block 1 as the
figure below. If you want keep the in your new system, you can select the item which you want to keep and
use “pull down” button to add them to merge list. If you want to add new parameter (e.g. UI and DSP
parameter), click “+” button to add these files into tool for merge with EEPROM table.
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Step5. Select an output path and create a name for the merged EEPROM table.
Step6. Click “Generate” button to generate the new EEPROM table.
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Step7. Select if you want use new setting of these parts.
Step8. Now you have a merged patch file (*.ipf file).
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2.4.4 Procedure to Update EEPROM Parameters
Step 1. Make sure SW12 in “ROM TEST” mode.
Step 2. Connect EVB “P1” port and PC by USB cable. LED1 & LED2 on EVB will keep lighting.
Step 3. Run the E2PROM_tool.exe program and a window will be come up as below
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Step 4. Specify the COM Port.
Step5. Press ”Browse” to choose the file where you want to write EEPROM table or patch file.
Step6. Press” Write” to write these setting to EEPROM
Step7. After finish data update, remove USB cable and make SW12 to “ROM APP” mode and reboot.
Now EVB can use the new setting after updated EEPROM parameter.
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2.5 MODULE CONFIGURATION
2.5.1 Mode Settings
Setting in Mode Switch:
For ROM chip application
Mode
SW12 Setting
Switch 12 PIN Definition
Test Mode
1: ON (P2_0: LOW)
2: OFF (P2_4: HIGH)
3: ON (EAN: HIGH)
Application Mode
1: OFF (P2_0: HIGH)
2: OFF (P2_4: HIGH)
3: ON (EAN: HIGH)
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APPENDIX A. BM20 AUDIO EVALUATION BOARD SCHEMATICS
EVB block diagram
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C54
4.7u/10V
MIC_BIAS
C59
10u/16V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
P0_0
EAN
P3_0
P2_0
P1_5
P0_4
SPKR
AOHPM
SPKL
VDDA
MIC1_P
MIC1_N
MIC_BIAS
AIR
GND
P2_4
P2_7
P0_5
HCI_RXD
HCI_TXD
P0_3
P0_2
P2_4
LED2
LED1
MFB
BK_OUT
SY S_PWR
P00
P27
P05
P04
P01
P02
P03
P20
P24
P30
Volume up
Volume down
NFC
FWD
Play/Pause
REV
System Configuration
System Configuration
Line-in detect
37
36
35
34
33
32
31
30
29
28
27
26
25
24
Slide Switch
GPIO Description
AIL
RST_N
VCC_RF
P0_1
VDD_IO
ADAP_IN
BAT_IN
AMB_DET
MIC_P1
MIC_N1
MIC_BIAS
AIR
P0_0
EAN
P3_0
P2_0
P1_5
P0_4
CODEC_VO
AOHPR
AOHPM
AOHPL
AIL
RST
VCC_RF
P0_1
VDD_IO
ADAP_IN
BAT_IN
NC
GND
15
16
17
18
19
20
21
22
23
P2_4
P2_7
P0_5
HCI_RXD
HCI_TXD
P0_3
P0_2
P2_4
LED2
LED2
LED1
LED1
MFB
BK_OUT
SY S_PWR
1
2
JP3
JP 1x2
Preliminary Edition
LED2
RED
3rd LED
LED1
P0_0
P2_0
P0_4
P2_4
P0_3
P2_7
R71
1M
BLUE
(NFC_N)
NFC_P
R93
1K
2
1
1
2
3
G
D
1
S
P2_4
J1
JP 2x6
2
4
6
8
10
12
2
2
2
LED3
LED-G
1
R39
1
1K
P3_0
P1_5
P0_1
P0_2
P0_5
P2_4
LED2 LED-HR
1
LED1 LED-B
1
LED
1
3
5
7
9
11
2
VDD_IO
C6
0.1u/10V
SY S_PWR
1
R70
270/1%
2
2
S
3
Wednesday , July 22, 2015
MODULE
Title
Date:
BM20 EVB
DP25
DP-4
BK_OUT
SY S_PWR
Size
R67
NP-0603
R66
NP-0603
DP24
DP-4
BAT_IN
AMB_DET
MFB
Board Name
C64
NP-0603
AMB_DET
SY S_PWR
Q6
STS2301
1 G
D
NFC trigger circuit
D11
D12
R56
CDSU400B CDSU400B
120/1%
2 1
2 1
2
Q3
STS2306
1
I/O TEST
1
2
2
P0_4
2
1
D6
1
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2
PCB1
FP-BM20
G691L293
RST
VCC
GND
U7
1
2
RST_N
Sheet
1
of
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
4
Rev
4.0
P/N
0355
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
3
BM20 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
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AT
ACK
4
7
8
6
VBUS
DD+
ID
GND
1
2
3
4
5
L2
FB-0603
L1
FB-0603
C132
0.1u/10V
DD+
C7
47u/16V
ADAP_IN
JP20
JP 1x2
SJP 1x2
3
BAT_IN
BAT
CONNECTOR
C13
0.1u/10V
C12
NP-0603
BATTERY CONNECTOR
2
2
USB_GND
USB_GND
1
1
9
1
2
P1
UCB02SB3021-99R
1
1
R92
3K
2
VDD
OSC1
OSC2
RST
GP7/TxLED
GP6/RxLED
GP5
GP4
GP3
TX
C62
0.1u/10V
HCI_RXD
HCI_TXD
1
20
19
18
17
16
15
14
13
12
11
R91
3K
VSS
D+
DVUSB
GP0/SSPND
GP1/USBCFG
GP2
CTS
RX
RTS
U10
MCP2200
2
TX
AOHPL
AOHPR
AIL
AIR
CODEC_VO
BK_OUT
VCC_RF
40
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
JP9
39
37
35
33
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
1
JP 2x20
MIC_N1
MIC_P1
C9
0.1u/10V
BAT_IN
ADAP_IN
C5
0.1u/10V
VDD_IO
HCI_TXD
HCI_RXD
MIC_BIAS
P2_0
P2_4
EAN
MFB
VICTORIA/EDGAR II INTERFACE
2
RX
1
2
3
4
5
6
7
8
9
10
1
ADAP_IN
C129
12p/50V
R90
470
R88
NP-0402
RST_N
R89
10K
C4
0.1u/10V
C128
0.1u/10V
3
2
X2
X4P-12MHZ
EXT_3V3
4
1
C130
12p/50V
1
D+
D-
C131
0.1u/10V
EXT_3V3
VDD_IO
1
R7
10
R95
4K7
1 6
5
4
SW12
SW-3BIT
Wednesday , July 22, 2015
Date:
Sheet
2
of
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
4
Rev
4.0
P/N
0355
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
EAN
P2_4
P2_0
POWER / UART HCI
BM20 EVB
Title
JP16
JP 1x2
3
2
1
Size
2
1
TEST GND
R8
4K7
2
Board Name
2
10
11
JP19
2
Preliminary Edition
1
2
2015 Microchip Technology Inc.
2
1
2
ON
DC POWER SOURCE
BM20 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
page 28
Preliminary Edition
P5
PJ-2001-5K
MIC1
3
5
4
2
1
AOHPR
C26
NP-0402
R12
1
JP22
JP 1x3
2K
R9 1K
2
2
C27
NP-0402
SPKR
JP23
JP 1x3
1
2
3
R10
1
AOHPR
AOHPM
1K
AOHPL
AOHPR
AOHPM
AOHPL
C25
0.1u/10V
C21
0.1u/10V
MIC_BIAS
C19
2.2u/6.3V
C31
NP-0402
C23
220p/50V
2
C30
NP-0402
C18
2.2u/6.3V
AOHPM
C78 1u/16V
1
2
3
C77 1u/16V
AOHPR
AOHPM
C28
NP-0402
MIC_N1
MIC_P1
C29
NP-0402
P7
TSH-3865D
10
2
4
1
3
R96
4K7
P1_5_AMP
P3_0
LINE_L
LINE_R
1
1
2
R31
0
R33
0
2
2
C17
10p/50V
R2
10K/1%
D7
CDBU0240
LINE INPUT
C16
39p/50V
SPKL_AMP
1
FB3
L4
GSMA201209 NP-1206
220p/50V
C8
L_IN
C24
0.1u/10V
FB2
L3
GSMA201209
NP-1206
220p/50V
C138
1
C139
100u/16V
FB1
2
C48
1u/16V
C37
1u/16V
C45
NP-0402
R4
82K/1%
2
C134
10u/6.3V
1
2
3
4
5
6
7
8
+
1
PVDDL
-OUTL
PGNDL
+OUTL
SHDN
VREF
INL
GND
U2
PAM8004
C3
100u/16V
AIL
AIR
AIL
AIR
ADAP_IN_AMP
GSMA201209
R35
C46
NP-0402 NP-0402
R34
NP-0402
C136
0.47u/50V
1
2
1
C133
10u/6.3V
+
ADAP_IN_AMP
1
2
1 2
L_OUT
1
AOHPL
L_VOP
2
1
L_VON
2
1
3
5
4
2
1
SPKL
1
P6
PJ-2001-5K
1
2
1
2
10
R3
2
PVDDR
-OUTR
PGNDR
+OUTR
NC
NC
INR
VDD
C137
0.47u/50V
C140
10p/50V
C141
39p/50V
R_IN
L6
NP-1206
SPKR_AMP
FB5
GSMA201209
C11
220p/50V
1
3
5
7
J2
JP 2x4
2
4
6
8
P1_5
SPKR
SPKL
Wednesday , July 22, 2015
Date:
Sheet
3
of
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
AUDIO TEST INTERFACE
Title
Size
(EXT AMP enable)
P1_5
ADAP_IN
ADAP_IN
4
Rev
4.0
P/N
0355
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
SPKR
SPKL
BM20 EVB
JP26
5
4
3
2
1
JP 1x5
EXT AMP CONNECTOR
P1_5_AMP
SPKR_AMP
SPKL_AMP
ON BOARD EXT AMP SWITCH
R5
82K/1%
2
ADAP_IN_AMP
1
Board Name
C15
1u/10V
16
15
14
13
12
11
10
9
2 1
J4
HDR 1x2
L5
FB4
NP-1206 GSMA201209
C135
10u/6.3V
C10
220p/50V
R_OUT
1
2
R_VON
2
1
R_VOP
2
1
SPK JACK
1
2
2015 Microchip Technology Inc.
2
1
2
J3
HDR 1x2
BM20 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
page 29
SW4
TS08M-PF
2
SW8
TS08M-PF
1
SW10
TS08M-PF
Btn3(VOL-)
1
2
Btn1(PLAY/PAU)
1
Btn5(REW)
2
C42
15p/50V
C40
15p/50V
C38
15p/50V
P0_5
P0_2
P0_3
1
1
SW9
TS08M-PF
2
Btn2(VOL+)
SW5
TS08M-PF
2
Btn4(FWD)
C41
15p/50V
C39
15p/50V
MUSIC CONTROL PUSH BUTTON
SW7
TS08M-PF
MFB
P2_7
P0_1
RST_N
1
Wednesday , July 22, 2015
100K
R37
G
S
Q10
STS2306
Sheet
4
of
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
PUSH BUTTON/SWITCH
Date:
2
D
P0_0
4
Rev
4.0
P/N
0355
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
100K
R21
SLIDE_SW
R36
10K
SY S_PWR
VDD_IO
SW6
SW-1BIT
BM20 EVB
C57
10u/16V
1
2
Title
3
Q9
STS2301
Size
Board Name
MFB
SW11
TS08M-PF
2
SLIDE SWITCH
1
2
1
1
1
2
3
2
2
1
1
SY S_PWR
RESET PUSH BUTTON
D
Preliminary Edition
2
G
2015 Microchip Technology Inc.
S
Btn0(MFB)
BM20 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
page 30
BM20 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
APPENDIX B. CLASS D AMPLIFIER DAUGHTER BOARD
BM20 EVB reserves an interface (JP26) to connect with an external class D amplifier daughter board for
speaker application demonstration.
Here is a daughter board example of NAU8223 3.1W class D amplifier.
Speaker Connector for
L/R channel
Amplifier
Gain Setting
BM20 EVB
Connector
On the daughter board, we reserve pin header for amplifier gain setting, L/R channel speaker connector and
BM20 EVB connector.
It can be connected with BM20 EVB to emulate a speaker application.
The schematics of the daughter board as below:
2015 Microchip Technology Inc.
Preliminary Edition
page 31
1
C7
L_VOP
2
+
FB1
AL
AP
2
JP4
JP 1x2
EN
AR
1
2
JP2
JP 1x2
1
2
AL
+ C3
100u/16V
VDD
C16
39p/50V
AL
EN
C17
R2
4K7
1
C12
1
2
JP8
JP 1x2
R5
10K
L_P N
0.47u/50V
D1
LL4148
2
1
OUTRP
VDD
NC
EN
INR
GS
C23
0.47u/50V
NAU8223
1
2
3
4
5
U3
C25
0.1u/16V
GS vs. Gain Setting
GAIN(dB)
GS
24
GND
18
100K to GND
12
VDD
6
100K to VDD
0
FLOATING
10p/50V
FB3
L2
GSMA201209 NP-1206
VDD
GSMA201209
1
0.1u/16V
C26
C8
1000p/16V
L_IN
10u/10V
C14
AP
C37
100u/16V
L_VOP
L_VON
2
4
6
1
3
5
1
1000p/16V
CN1
CONN1X5
1
2
3
4
5
2
1
2
L_VON
2
1
JP1
JP 2x3
1
2
R3
100K
VDD
VDD
15
14
13
12
11
JP6
JP 2x4
C28
0.1u/16V
R4
100K
C21
10u/10V
VDD
OUTLP
VDD
NC
NC
INL
VDD
C20
10u/10V
1
2
R_P N
C13
Date:
Size
A
AR
AR
1
2
1
2
JP5
JP 1x2
JP3
JP 1x2
R_IN
FB5
GSMA201209
1000p/16V
C11
JP7
JP 2x3
N P GND
1
L4
NP-1206
MAIN CIRCUIT
TEL.
Sheet
1
of
1
Rev
1.0
4F, No.8, Dusing Rd., Hsinchu Science Park,
Hsinchu City 30078, Taiwan
886-3-5778385
P/N
0130
NAU8223
ISSC Technologies Corp.
ADD.
AR
AL
C18
10p/50V
C19
39p/50V
10u/10V
0.1u/16V
C22
1000p/16V
L3
FB4
NP-1206 GSMA201209
Monday , October 15, 2012
Title
Board Name
P6
PJ-2001-5K
3
5
4
2
1
C27
0.47u/50V
C24
0.47u/50V
VDD
JP 1x2
JP9
C10
R_OUT
R_VON
2
1
L_OUT
1
FB2
L1
GSMA201209
NP-1206
1
2
1
2
page 32
2
2
21
20
19
18
17
16
VSS
VSS
OUTRN
VDD
OUTLN
VSS
IPR
GS
VDD
VSS
IPL
6
7
8
9
10
2
4
6
8
1
3
5
7
1
Preliminary Edition
2
1
2
R_VON
R_VOP
2
4
6
1
3
5
R_VOP
2
1
2015 Microchip Technology Inc.
2
P N GND
BM20 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Pforzheim
Tel: 49-7231-424750
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Poland - Warsaw
Tel: 48-22-3325737
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
2015 Microchip Technology Inc.
Advance Information
page 33
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