User Guide 021 ISL8117DEMO2Z Demonstration Board User Guide Description Key Features The ISL8117DEMO2Z demonstration board (shown in Figure 1) features the ISL8117. The ISL8117 is a 60V high voltage synchronous buck controller that offers external soft-start, independent enable functions and integrates UV/OV/OC/OT protection. Its current mode control architecture and internal compensation network keep peripheral component count minimal. Programmable switching frequency ranging from 100kHz to 2MHz helps to optimize inductor size while the strong gate driver delivers up to 30A for the buck output. • Small, compact design Specifications • PGOOD indicator The ISL8117DEMO2Z demonstration board is designed for high current applications. The current rating of the ISL8117DEMO2Z is limited by the FETs and inductor selected. The ISL8117 gate driver is capable of delivering up to 20A for the buck output as long as the proper FETs and inductor are provided. The electrical ratings of ISL8117DEMO2Z are shown in Table 1. Input Voltage • High light-load efficiency in pulse skipping DEM operation • Programmable soft-start • Optional DEM/CCM operation • Supports prebias output with SR soft-start • External frequency sync • OCP, OVP, OTP, UVP protection References • The ISL8117 datasheet Ordering Information PART NUMBER TABLE 1. ELECTRICAL RATINGS PARAMETER • Wide input range: 18V to 60V ISL8117DEMO2Z RATING 18V to 60V DESCRIPTION High Voltage PWM Step-Down Synchronous Buck Controller Recommended Testing Equipment Switching Frequency 200kHz Output Voltage 12V Output Current 20A OCP Set Point Minimum 25A at ambient room temperature The following materials are recommended to perform testing: • 0V to 60V power supply with at least 30A source current capability • Electronic loads capable of sinking current up to 30A • Digital Multimeters (DMMs) • 100MHz quad-trace oscilloscope FIGURE 1. ISL8117DEMO2Z DEMONSTRATION BOARD TOP April 20, 2015 UG021.0 1 FIGURE 2. ISL8117DEMO2Z DEMONSTRATION BOARD BOTTOM CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2015. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. User Guide 021 Quick Test Guide The rated load current is 20A with the OCP point set at minimum 25A at room temperature ambient conditions. 1. Jumper J5 provides the option to select CCM or DEM. Please refer to Table 2 for the desired operating option. Ensure that the circuit is correctly connected to the supply and electronic loads prior to applying any power. Please refer to Figure 4 for proper set-up. 2. Turn on the power supply. 3. Adjust input voltage VIN within the specified range and observe output voltage. The output voltage variation should be within 3%. 4. Adjust load current within the specified range and observe output voltage. The output voltage variation should be within 3%. 5. Use an oscilloscope to observe output voltage ripple and phase node ringing. For accurate measurement, please refer to Figure 3 for proper test set-up. TABLE 2. JUMPER # J5 J6 POSITION FUNCTION CCM (pins 1-2) Continuous current mode DEM (pins 2-3) Diode emulation mode (Pins 1-2) Disable the PWM The temperature operating range is -40°C to +125°C. Please note that air flow is needed for higher temperature ambient conditions. Evaluating the Other Output Voltages The ISL8117DEMO2Z kit output is preset to 12V, however, the output can be adjusted from 5V to 24V. The output voltage programming resistor, R2 , will depend on the desired output voltage of the regulator and the value of the feedback resistor R1, as shown in Equation 1. 0.6 R 2 = R 1 ------------------------------ V OUT – 0.6 (EQ. 1) Table 3 shows the component selection that should be used for the respective VOUT of 5V, 12V and 24V. TABLE 3. EXTERNAL COMPONENT SELECTION VOUT R2 5V 5.9k R4 R7 L1 C6 36k 7.5k IHLP6767GZER3R3M11, 150pF 3.3µH/35A VIN MAX RANGE IOUT 8V~60V 20A 12V 2.26k 90.9k 7.5k IHLP6767GZER5R6M11, 220pF 18V~60V 20A 5.6µH/28A 24V 1.1k 150k 3.3k IHLP6767GZER100M11, 470pF 28V~60V 10A 10µH/19A OUTPUT CAP OUTPUT OUTPUT CAP CAP OR ORMOSFET MOSFET FIGURE 3. PROPER PROBE SET-UP TO MEASURE OUTPUT RIPPLE AND PHASE NODE RINGING Functional Description The ISL8117DEMO2Z is a compact design with high efficiency and high power density. As shown in Figure 4 on page 3, 18V to 60V VIN is supplied to J1 (+) and J2 (-). The regulated 12V output on J3 (+) and J4 (-) can supply up to 20A to the load. Due to high thermal efficiency, the demonstration board can run at 20A continuously without air flow in room temperature ambient condition. As shown in Table 2, connector J5 provides selection of either CCM mode (shorting pin 1 and pin 2) or DEM mode (shorting pin 2 and pin 3). Connector J6 provides an option to disable the converter by shorting its pin 1 and pin 2. Operating Range The input voltage range is from 18V to 60V for an output voltage of 12V. If the output voltage is set to a lower value, the minimum VIN can be reset to a lower value by changing the ratio of R4 and R5. The minimum EN threshold that VIN can be set to is 4.5V. Submit Document Feedback 2 Layout Guidelines Careful attention to layout requirements is necessary for successful implementation of an ISL8117 based DC/DC converter. The ISL8117 switches at a very high frequency and therefore the switching times are very short. At these switching frequencies, even the shortest trace has significant impedance. Also, the peak gate drive current rises significantly in an extremely short time. Transition speed of the current from one device to another causes voltage spikes across the interconnecting impedances and parasitic circuit elements. These voltage spikes can degrade efficiency, generate EMI and increase device overvoltage stress and ringing. Careful component selection and proper PC board layout minimizes the magnitude of these voltage spikes. There are three sets of critical components in a DC/DC converter using the ISL8117: the controller, the switching power components and the small signal components. The switching power components are the most critical from a layout point of view because they switch a large amount of energy which tends to generate a large amount of noise. The critical small signal components are those connected to sensitive nodes or those supplying critical bias currents. A multilayer printed circuit board is recommended. UG021.0 April 20, 2015 User Guide 021 Layout Considerations 1. The input capacitors, upper FET, lower FET, inductor and output capacitor should be placed first. Isolate these power components on dedicated areas of the board with their ground terminals adjacent to one another. Place the input high frequency decoupling ceramic capacitors very close to the MOSFETs. 2. If signal components and the IC are placed in a separate area to the power train, it is recommend to use full ground planes in the internal layers with shared SGND and PGND to simplify the layout design. Otherwise, use separate ground planes for power ground and small signal ground. Connect the SGND and PGND together close to the IC. DO NOT connect them together anywhere else. 3. The loop formed by the input capacitor, the top FET and the bottom FET must be kept as small as possible. 4. Ensure the current paths from the input capacitor to the MOSFET, to the output inductor and the output capacitor are as short as possible with maximum allowable trace widths. 5. Place the PWM controller IC close to the lower FET. The LGATE connection should be short and wide. The IC can be best placed over a quiet ground area. Avoid switching ground loop currents in this area. 6. Place VCC5V bypass capacitor very close to the VCC5V pin of the IC and connect its ground to the PGND plane. 7. Place the gate drive components - optional BOOT diode and BOOT capacitors - together near the controller IC. 8. The output capacitors should be placed as close to the load as possible. Use short wide copper regions to connect output capacitors to load to avoid inductance and resistances. 9. Use copper filled polygons or wide but short trace to connect the junction of upper FET, lower FET and output inductor. Also keep the PHASE node connection to the IC short. DO NOT unnecessarily oversize the copper islands for the PHASE node. Since the phase nodes are subjected to very high dv/dt voltages, the stray capacitor formed between these islands and the surrounding circuitry will tend to couple switching noise. 10. Route all high speed switching nodes away from the control circuitry. 11. Create a separate small analog ground plane near the IC. Connect the SGND pin to this plane. All small signal grounding paths including feedback resistors, current limit setting resistor, soft starting capacitor and EN pull-down resistor should be connected to this SGND plane. 12. Separate the current sensing trace from the PHASE node connection. 13. Ensure the feedback connection to the output capacitor is short and direct. VO + + LOAD A VIN - V + - A - FIGURE 4. PROPER TEST SET-UP . Submit Document Feedback 3 UG021.0 April 20, 2015 User Guide 021 Typical Demonstration Board Performance Curves VIN = 48V, VOUT = 12V, unless 100 100 95 95 90 90 EFFICIENCY (%) EFFICIENCY (%) otherwise noted. VIN = 24V 85 80 VIN = 48V 75 80 70 65 65 0 2 4 6 8 10 12 14 16 18 60 20 VIN = 48V 75 70 60 VIN = 24V 85 0 2 4 6 8 IOUT (A) 10 12 14 16 18 20 IOUT (A) FIGURE 5. CCM EFFICIENCY vs LOAD, VOUT = 5V FIGURE 6. DEM EFFICIENCY vs LOAD, VOUT = 5V 5.090 5.085 VOUT (V) 5.080 VIN = 24V 5.075 5.070 5.065 VIN = 48V 5.060 5.055 5.050 0 2 4 6 8 10 12 14 16 18 20 IOUT (A) FIGURE 7. LOAD REGULATION, VOUT = 5V 1.00 1.00 0.95 0.95 VIN = 48V 0.85 VIN = 24V 0.80 VIN = 18V 0.75 VIN = 18V 0.80 0.75 0.70 0.65 0.65 0 2 4 6 8 10 12 14 IOUT (A) FIGURE 8. CCM EFFICIENCY vs LOAD Submit Document Feedback 4 16 18 20 VIN = 60V VIN = 24V 0.85 0.70 0.60 VIN = 48V VIN = 36V 0.90 VIN = 36V EFFICIENCY EFFICIENCY 0.90 VIN = 60V 0.60 0 2 4 6 8 10 12 14 16 18 20 IOUT (A) FIGURE 9. DEM EFFICIENCY vs LOAD UG021.0 April 20, 2015 User Guide 021 Typical Demonstration Board Performance Curves VIN = 48V, VOUT = 12V, unless otherwise noted. (Continued) 12.29 12.29 12.27 12.27 VOUT (V) 12.25 12.23 VIN = 36V IO = 10A VIN = 48V VIN = 60V 12.21 12.23 IO = 20A 12.21 12.19 12.19 12.17 12.17 12.15 2 4 6 8 10 12 14 IO = 0A 12.25 VOUT (V) VIN = 24V VIN = 18V 16 18 20 IOUT (A) 12.15 18 23 28 33 38 43 48 53 58 VIN (V) FIGURE 10. CCM MODE LOAD REGULATION FIGURE 11. CCM MODE LINE REGULATION 10.00 PHASE 50V/DIV LGATE 5V/DIV IIN (A) 1.00 CLKOUT 5V/DIV CCM 0.10 IL 5A/DIV DEM 0.01 0.01 0.1 1 10 2µs/DIV IOUT (A) FIGURE 12. INPUT CURRENT COMPARISON WITH MODE = CCM/DEM VOUT 50mV/DIV, VIN = 48V, IO = 0A FIGURE 13. PHASE, LGATE, CLKOUT AND INDUCTOR CURRENT WAVEFORMS, VIN = 48V, IO = 0A VOUT 50mV/DIV, VIN = 48V, IO = 0A 1ms/DIV VOUT 50mV/DIV, VIN = 48V, IO = 20A VOUT 50mV/DIV, VIN = 48V, IO = 20A 4µs/DIV 4µs/DIV FIGURE 14. OUTPUT RIPPLE, CCM MODE FIGURE 15. OUTPUT RIPPLE, DEM MODE Submit Document Feedback 5 UG021.0 April 20, 2015 User Guide 021 Typical Demonstration Board Performance Curves VIN = 48V, VOUT = 12V, unless otherwise noted. (Continued) VOUT 5V/DIV VOUT 5V/DIV LGATE 5V/DIV LGATE 5V/DIV CLKOUT 5V/DIV CLKOUT 5V/DIV IL 10A/DIV 4ms/DIV IL 10A/DIV 4ms/DIV FIGURE 16. CCM START-UP WAVEFORMS: VIN = 48V, IO = 0A FIGURE 17. DEM START-UP WAVEFORMS: VIN = 48V, IO = 0A VOUT 5V/DIV VOUT 5V/DIV SS 1V/DIV SS 1V/DIV EN 5V/DIV EN 5V/DIV PGOOD 5V/DIV PGOOD 5V/DIV 20ms/DIV 20ms/DIV FIGURE 18. CCM START-UP WAVEFORMS: VIN = 48V, IO = 0A FIGURE 19. DEM START-UP WAVEFORMS: VIN = 48V, IO = 0A SYNC 5V/DIV SS 500mV/DIV LGATE 5V/DIV CLKOUT 5V/DIV VOUT 10V/DIV IL 5A/DIV PGOOD 5V/DIV 1ms/DIV FIGURE 20. TRACKING WAVEFORMS, VIN = 48V, IO = 0A Submit Document Feedback 6 2µs/DIV FIGURE 21. FREQUENCY SYNCHRONIZATION WAVEFORMS, VIN = 48V, IO = 0A UG021.0 April 20, 2015 User Guide 021 Typical Demonstration Board Performance Curves VIN = 48V, VOUT = 12V, unless otherwise noted. (Continued) VOUT 500mV/DIV VOUT 10V/DIV SS 5V/DIV IOUT 10A/DIV PGOOD 5V/DIV IL 20A/DIV 400µs/DIV 40ms/DIV FIGURE 22. LOAD TRANSIENT; VIN = 48V, IO = 0A TO 20A, 1A/µs, CCM MODE FIGURE 23. SHORT-CIRCUIT WAVEFORMS, VIN = 48V Submit Document Feedback 7 UG021.0 April 20, 2015 J1 4 3 2 1 1 SPST 0.1u/25V C5 R4 R5 J6 10k 90.9k 4.7u/100V 4.7u/100V C39 C40 10u/100V 10u/100V 10u/100V 10u/100V 10u/100V 10u/100V 10u/100V 10u/100V VIN 10u/10V C4 0.1u/100V C17 2 Submit Document Feedback Schematic C12 C23 C24 C25 C26 C27 C28 C29 J2 R9 20 U3 2 4 3 2 1 vin IN OUT 14 exbi exbi vcc5 D1 R23 R19 GND 1A/100V en R20 0 1 clk 13 14 15 CLKOUT Q2 NMOS C2 1u/50V UG 12 ug 11 ph J3 vout 22U/25V 2 mod MOD/SYNC PHASE R14 100k R7 7.5k R6 200K 7 5 SYNC FB RT 6 4 LGATE/OCS PGOOD SS/TRK rt 3 1u/50V 22U/25V VOUT 22U/25V 330u/35V ISL8117 pg JMP L1 10 ISEN 5.6u/28A isen C22 C8 C9 C10 C11 R15 9 VCC5V vcc5 10u/10V 20 Q3 NMOS Q4 NMOS J4 6 5 4 3 2 1 C1 8 3 2 1 PGND J5 6 5 4 3 2 1 lg GND ss C3 C6 R3 3.6k 0.047u/25V VCC5 220p/50V R1 43.2k fb R2 2.26k 22U/25V 22U/25V 22U/25V 22U/25V 22U/25V 22U/25V 22U/25V 22U/25V 22U/25V vout C30 C31 C32 C33 C34 C35 C36 C37 C38 UG021.0 April 20, 2015 Title <Title> FIGURE 24. ISL8117DEMO2Z SCHEMATIC d Size A ISL8117DEMO2Z Document Number <Doc> Vin:18V~55V Vout:12V 20A 200K Rev A User Guide 021 0.1u/25V Q1 DNP BOOT 10k ISL80138 U2 VIN 15 8 C20 16 R21 10k EN ADJ 17 EN 12 SGND en GND 30.9k 7 EXTBIAS 8 C21 0.1u/100V vout User Guide 021 ISL8117DEMO2Z Bill of Materials MANUFACTURER PART REFERENCE DESIGNATOR QTY UNITS DESCRIPTION ISL8117DEMO2ZREVAPCB 1 ea CGA9N3X7S2A106K230KB 8 ea C12, C23, C24, C25, C26, CAP, SMD, 2220, 10µF, 100V, 10%, X7S, AECC27, C28, C29 Q200, ROHS TDK GRM32ER71E226KE15L 12 ea a) C8, C9, C10, C30, C31, CAP, SMD, 1210, 22µF, 25V, 10%, X7R, ROHS C32, C33, C34, C35 MURATA GRM32ER71E226KE15L 0 ea b) C36, C37, C38 CAP, SMD, 1210, 22µF, 25V, 10%, X7R, ROHS MURATA C0603X7R101-104KNE 2 ea C4, C21 CAP, SMD, 0603, 0.1µF, 100V, 10%, X7R, ROHS VENKEL GRM39X7R104K025AD 2 ea C5, C20 CAP, SMD, 0603, 0.1µF, 25V, 10%, X7R, ROHS MURATA C1608X5R1H105K 2 ea C2, C22 CAP, SMD, 0603, 1µF, 50V, 10%, X5R, ROHS ECJ-1VB1A106M 2 ea C1, C17 CAP, SMD, 0603, 10µF, 10V, 20%, X5R, ROHS PANASONIC GRM188R71H221KA01D 1 ea C6 CAP, SMD, 0603, 220pF, 50V, 10%, X7R, ROHS MURATA GRM188R71E473KA01D 1 ea C3 CAP, SMD, 0603, 0.047µF, 25V, 10%, X7R, ROHS CGA6M3X7S2A475K200AB 2 ea C39, C40 CAP, SMD, 1210, 4.7µF, 100V, 10%, X7S, ROHS TDK EEE-FP1V331AP 1 ea C11 CAP, SMD, 10x10.2mm, 330µF, 35V, 20%, ALUM.ELEC., ROHS IHLP6767GZER5R6M11 1 ea L1 COIL-PWR INDUCTOR, SMD, 17.15mm2, 5.6µH, VISHAY 20%, 28A, ROHS 68000-236HLF 1 ea J5 CONN-HEADER, 1x3, BREAKAWY 1X36, 2.54mm, ROHS BERG/FCI 69190-202HLF 1 ea J6 CONN-HEADER, 1X2, RETENTIVE, 2.54mm, 0.230X 0.120, ROHS BERG/FCI SPC02SYAN 2 ea J5, J6 CONN-JUMPER, SHORTING, 2PIN, BLACK, GOLD, ROHS SULLINS MBR1H100SFT3G 1 ea D1 DIODE-RECTIFIER, SMD, 2P, S0D-123FL, 100V, ON SEMICONDUCTOR 1A, ROHS ISL80138IVEAJZ 1 ea U3 IC-40V LDO ADJ. LINEAR REGULATOR, 14P, HTSSOP, ROHS INTERSIL ISL8117FRZ 1 ea U2 IC-55V SWITCHING CONTROLLER, 16P, QFN, ROHS INTERSIL BSC067N06LS3G 3 ea Q2, Q3, Q4 TRANSISTOR-MOS, N-CHANNEL, 8P, PG-TDSON-8, 60V, 50A, ROHS INFINEON TECHNOLOGY ERJ-3EKF20R0V 2 ea R9, R15 RES, SMD, 0603, 20Ω, 1/10W, 1%, TF, ROHS PANASONIC CR0603-10W-000T 1 ea R23 RES, SMD, 0603, 0Ω, 1/10W, TF, ROHS VENKEL RK73H1JT1002F 3 ea R5, R19, R21 RES, SMD, 0603, 10k, 1/10W, 1%, TF, ROHS KOA CR0603-10W-1003FT 1 ea R14 RES, SMD, 0603, 100k, 1/10W, 1%, TF, ROHS VENKEL CR0603-10W-2003FT 1 ea R6 RES, SMD, 0603, 200k, 1/10W, 1%, TF, ROHS VENKEL RC0603FR-072K26L 1 ea R2 RES, SMD, 0603, 2.26k, 1/10W, 1%, TF, ROHS YAGEO RC0603FR-0730K9L 1 ea R20 RES, SMD, 0603, 30.9k, 1/10W, 1%, TF, ROHS YAGEO CR0603-10W-3601FT 1 ea R3 RES, SMD, 0603, 3.6k, 1/10W, 1%, TF, ROHS RC0603FR-0743K2L(Pb-free) 1 ea R1 RES, SMD, 0603, 43.2k, 1/10W, 1%, TF, ROHS YAGEO CR0603-10W-7501FT 1 ea R7 RES, SMD, 0603, 7.5k, 1/10W, 1%, TF, ROHS Submit Document Feedback 9 PWB-PCB, ISL8117DEMO2Z, REVA, ROHS MANUFACTURER SHENZHEN MULTILAYER PCB TECHNOLOGY CO., LTD TDK MURATA PANASONIC VENKEL VENKEL UG021.0 April 20, 2015 User Guide 021 ISL8117DEMO2Z Bill of Materials MANUFACTURER PART REFERENCE DESIGNATOR QTY UNITS (Continued) DESCRIPTION MANUFACTURER ERJ-3EKF9092V 1 ea R4 RES, SMD, 0603, 90.9k, 1/10W, 1%, TF, ROHS PANASONIC 7795 2 ea J1, J2 HDWARE, TERMINAL, M4 METRIC SCREW, TH, KEYSTONE 4P, SNAP-FIT, ROHS 7798 2 ea J3, J4 HDWARE, TERMINAL, M4 METRIC SCREW, TH, KEYSTONE 6P, SNAP-FIT, ROHS SJ-5003SPBL 4 ea Bottom four corners BUMPONS, 0.44inW x 0.20inH, DOMETOP, BLACK 0 ea Q1 DO NOT POPULATE OR PURCHASE 3M Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that the document is current before proceeding. For information regarding Intersil Corporation and its products, see www.intersil.com Submit Document Feedback 10 UG021.0 April 20, 2015 Submit Document Feedback ISL8117DEMO2Z PCB Layout 11 FIGURE 26. SECOND LAYER (SOLID GROUND) FIGURE 27. THIRD LAYER FIGURE 28. BOTTOM LAYER User Guide 021 FIGURE 25. TOP LAYER UG021.0 April 20, 2015 Submit Document Feedback ISL8117DEMO2Z PCB Layout (Continued) 12 FIGURE 29. SILKSCREEN TOP FIGURE 30. SILKSCREEN BOTTOM User Guide 021 UG021.0 April 20, 2015