User Guide 030 ISL8117EVAL1Z Evaluation Board User Guide Description Key Features The ISL8117EVAL1Z evaluation board (shown in Figure 1) features the ISL8117. The ISL8117 is a 60V high voltage synchronous buck controller that offers external soft-start, independent enable functions and integrates UV/OV/OC/OT protection. Its current mode control architecture and internal compensation network keep peripheral component count minimal. Programmable switching frequency ranging from 100kHz to 2MHz helps to optimize inductor size while the strong gate driver delivers up to 30A for the buck output. • Small, compact design Specifications • PGOOD indicator The ISL8117EVAL1Z evaluation board is designed for high current applications. The current rating of the ISL8117EVAL1Z is limited by the FETs and inductor selected. The electrical ratings of ISL8117EVAL1Z are shown in Table 1. TABLE 1. ELECTRICAL RATINGS PARAMETER Input Voltage • High light-load efficiency in pulse skipping DEM operation • Programmable soft-start • Optional DEM/CCM operation • Supports prebias output with SR soft-start • External frequency sync • OCP, OVP, OTP, UVP protection References • ISL8117 datasheet Ordering Information RATING 4.5V to 60V PART NUMBER Switching Frequency 600kHz ISL8117EVAL1Z Output Voltage 3.3V Output Current 6A OCP Set Point Minimum 8A at ambient room temperature FIGURE 1. ISL8117EVAL1Z TOP SIDE May 20, 2015 UG030.0 • Wide input range: 4.5V to 60V 1 DESCRIPTION High Voltage PWM Step-down Synchronous Buck Controller FIGURE 2. ISL8117EVAL1Z BOTTOM SIDE CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2015. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. User Guide 030 Recommended Testing Equipment The following materials are recommended to perform testing: • 0V to 60V power supply with at least 10A source current capability • Electronic loads capable of sinking current up to 10A • Digital Multimeters (DMMs) • 100MHz quad-trace oscilloscope Quick Test Guide 2. Turn on the power supply. 3. Adjust input voltage VIN within the specified range and observe output voltage. The output voltage variation should be within 3%. 4. Adjust load current within the specified range and observe output voltage. The output voltage variation should be within 3%. 5. Use an oscilloscope to observe output voltage ripple and phase node ringing. For accurate measurement, please refer to Figure 3 for proper test setup. TABLE 2. OPERATING OPTIONS J7 J6 POSITION The ISL8117EVAL1Z is a compact design with high efficiency and high power density. As shown in Figure 4 on page 3, 4.5V to 60V VIN is supplied to J1 (+) and J2 (-). The regulated 12V output on J3 (+) and J5 (-) can supply up to 6A to the load. As shown in Table 2, connector J7 provides selection of either CCM mode (shorting pin 1 and pin 2) or DEM mode (shorting pin 2 and pin 3). Connector J6 provides an option to disable the converter by shorting its pin 1 and pin 2. Operating Range 1. Jumper J7 provides the option to select CCM or DEM. Please refer to Table 2 for the desired operating option. Ensure that the circuit is correctly connected to the supply and electronic loads prior to applying any power. Please refer to Figure 4 for proper setup. JUMPER # Functional Description FUNCTION CCM (pins 1-2) Continuous current mode DEM (pins 2-3) Diode emulation mode (Pins 1-2) Disable the PWM OUTPUT CAP OUTPUT OUTPUT CAP CAP OR ORMOSFET MOSFET The input voltage range is from 4.5V to 60V for an output voltage of 3.3V. The rated load current is 6A with the OCP point set at minimum 8A at room temperature ambient conditions. The temperature operating range of ISL8117 is -40°C to +125°C. Please note that airflow is needed for higher temperature ambient conditions. PCB Layout Guidelines Careful attention to layout requirements is necessary for successful implementation of an ISL8117 based DC/DC converter. The ISL8117 switches at a very high frequency and therefore the switching times are very short. At these switching frequencies, even the shortest trace has significant impedance. Also, the peak gate drive current rises significantly in an extremely short time. Transition speed of the current from one device to another causes voltage spikes across the interconnecting impedances and parasitic circuit elements. These voltage spikes can degrade efficiency, generate EMI, and increase device overvoltage stress and ringing. Careful component selection and proper PC board layout minimizes the magnitude of these voltage spikes. There are three sets of critical components in a DC/DC converter using the ISL8117: the controller, the switching power components and the small signal components. The switching power components are the most critical from a layout point of view because they switch a large amount of energy, which tends to generate a large amount of noise. The critical small signal components are those connected to sensitive nodes or those supplying critical bias currents. A multilayer printed circuit board is recommended. FIGURE 3. PROPER PROBE SETUP TO MEASURE OUTPUT RIPPLE AND PHASE NODE RINGING Submit Document Feedback 2 UG030.0 May 20, 2015 User Guide 030 1. The input capacitors, upper FET, lower FET, inductor and output capacitor should be placed first. Isolate these power components on dedicated areas of the board with their ground terminals adjacent to one another. Place the input high frequency decoupling ceramic capacitors very close to the MOSFETs. 2. If signal components and the IC are placed in a separate area to the power train, it is recommended to use full ground planes in the internal layers with shared SGND and PGND to simplify the layout design. Otherwise, use separate ground planes for power ground and small signal ground. Connect the SGND and PGND together close to the IC. DO NOT connect them together anywhere else. 3. The loop formed by the input capacitor, the top FET and the bottom FET must be kept as small as possible. 4. Ensure the current paths from the input capacitor to the MOSFET, to the output inductor and the output capacitor are as short as possible with maximum allowable trace widths. 5. Place the PWM controller IC close to the lower FET. The LGATE connection should be short and wide. The IC can be best placed over a quiet ground area. Avoid switching ground loop currents in this area. 6. Place VCC5V bypass capacitor very close to the VCC5V pin of the IC and connect its ground to the PGND plane. 7. Place the gate drive components - optional BOOT diode and BOOT capacitors - together near the controller IC. 8. The output capacitors should be placed as close to the load as possible. Use short wide copper regions to connect output capacitors to load to avoid inductance and resistances. 9. Use copper filled polygons or wide but short trace to connect the junction of the upper FET, lower FET and output inductor. Also keep the PHASE node connection to the IC short. DO NOT unnecessarily oversize the copper islands for the PHASE node. Since the phase nodes are subjected to very high dv/dt voltages, the stray capacitor formed between these islands and the surrounding circuitry will tend to couple switching noise. 10. Route all high speed switching nodes away from the control circuitry. 11. Create a separate small analog ground plane near the IC. Connect the SGND pin to this plane. All small signal grounding paths including feedback resistors, current limit setting resistor, soft-starting capacitor and EN pull-down resistor should be connected to this SGND plane. 12. Separate the current sensing trace from the PHASE node connection. 13. Ensure the feedback connection to the output capacitor is short and direct. A + + - LOAD Layout Considerations V VIN + - A - FIGURE 4. PROPER TEST SETUP Submit Document Feedback 3 UG030.0 May 20, 2015 User Guide 030 Typical Evaluation Board Performance Curves VIN = 24V, VOUT = 3.3V, unless otherwise noted. 3.55 100 90 VIN = 60V 3.50 3.45 70 60 50 VIN = 8V 40 VOUT (V) EFFICIENCY (%) 80 VIN = 24V VIN = 12V VIN = 48V 3.40 3.35 VIN = 60V 30 3.30 20 3.25 10 0 0 1 2 3 4 IOUT (A) 5 6 3.20 7 VIN = 12V 0 FIGURE 5. CCM EFFICIENCY 1 2 3 IOUT (A) 5 6 3.55 90 VIN = 60V 3.50 80 3.45 70 60 VIN = 24V VIN = 12V VIN = 8V 50 40 VOUT (V) EFFICIENCY (%) 4 VIN = 48V FIGURE 6. CCM LOAD REGULATION 100 VIN = 48V 3.40 3.35 VIN = 60V 30 VIN = 12V 3.30 VIN = 24V VIN = 48V 20 VIN = 8V 3.25 10 0 VIN = 24V VIN = 8V 0 1 2 3 4 5 6 IOUT (A) FIGURE 7. DEM EFFICIENCY 7 3.20 0 1 2 3 4 IOUT (A) 5 6 7 FIGURE 8. DEM LOAD REGULATION PHASE 20V/DIV IO = 0A 10mV/DIV CLKOUT 5V/DIV LGATE 5V/DIV IO = 6A 10mV/DIV IL 5A/DIV 1µs/DIV FIGURE 9. PHASE, LGATE, CLKOUT AND INDUCTOR CURRENT WAVEFORMS, IO = 6A Submit Document Feedback 4 4µs/DIV FIGURE 10. OUTPUT RIPPLE, MODE = CCM UG030.0 May 20, 2015 User Guide 030 Typical Evaluation Board Performance Curves VIN = 24V, VOUT = 3.3V, unless otherwise noted. VOUT 2V/DIV IO = 0A 10mV/DIV 2ms/DIV CLKOUT 5V/DIV 10mV/DIV LGATE 5V/DIV IO = 6A 10mV/DIV 4µs/DIV IL 2A/DIV 4ms/DIV FIGURE 11. OUTPUT RIPPLE, MODE = DEM FIGURE 12. CCM START-UP WAVEFORMS: VOUT, LGATE, CLKOUT, IL, IO = 0A VOUT 2V/DIV VOUT 2V/DIV SS 2V/DIV CLKOUT 5V/DIV EN 5V/DIV LGATE 5V/DIV PGOOD 5V/DIV IL 2A/DIV 20ms/DIV 4ms/DIV FIGURE 13. DEM START-UP WAVEFORMS: VOUT, LGATE, CLKOUT, IL, IO = 0A FIGURE 14. CCM START-UP WAVEFORMS: VOUT, SS, EN, PGOOD, IO = 0A VOUT 2V/DIV SS 2V/DIV SS 1V/DIV EN 5V/DIV PGOOD 5V/DIV VOUT 5V/DIV PGOOD 5V/DIV 20ms/DIV 4ms/DIV FIGURE 15. DEM START-UP WAVEFORMS: VOUT, SS, EN, PGOOD, IO = 0A FIGURE 16. TRACKING WAVEFORMS, IO = 0A Submit Document Feedback 5 UG030.0 May 20, 2015 User Guide 030 Typical Evaluation Board Performance Curves VIN = 24V, VOUT = 3.3V, unless otherwise noted. LGATE 5V/DIV VOUT 100mV/DIV CLKOUT 5V/DIV SYNC 5V/DIV IOUT 5A/DIV IL 1A/DIV 1µs/DIV 800µs/DIV FIGURE 17. FREQUENCY SYNCHRONIZATION WAVEFORMS, IO = 0A FIGURE 18. LOAD TRANSIENT, IO = 0A TO 6A, 1A/µs, CCM VOUT 2V/DIV SS 2V/DIV PGOOD 5V/DIV IL 10A/DIV 200ms/DIV FIGURE 19. SHORT CIRCUIT WAVEFORMS Submit Document Feedback 6 UG030.0 May 20, 2015 Submit Document Feedback Schematic J1 0.1u/100V C22 C28 C29 4.7u/100v 4.7u/100v 1 C23 C24 C13 C21 C16 1u/100V 1u/100V 4.7u/100V4.7u/100V 100u/100V VIN J2 C4 0.1u/100V R9 2 R25 0 GND U1 vin 7 DNP R4 1 DNP C5 exbi 1 en 2 DNP R5 EXTBIAS VIN EN BOOT 16 R26 5.1 15 boot D1 DNP R18 1 2 J6SPST 3 clk CLKOUT UGATE 14 C2 0.22u/25V 0 J7 4 mod MOD/SYNC PHASE 13 5 PGOOD ISEN L1 ph C9 1u/6.3V 7 ss 8 R22 0 TP20 CON1 C3 R6 DNP 0.1u/25V C30 fb VCC5 SS/TRK FB ISL8117 0.047u/25V LGATE/OCS SGND SYNC R16 100k RT PGND 11 vcc5 10 lg 20 R3 11k C10 C20 DNP TP3 C31 DNP R8 2.2 R20 0 100u/16V J5 R1 49.9k GND vout C26 DNP R24 DNP C32 DNP C27 TP5 CON1 TP6 TP7 TP8 TP9 TP10 TP11 TP12 TP13 TP14 CON1 CON1 CON1 CON1 CON1 CON1 CON1 CON1 CON1 1 TP4 CON1 TP16 TP17 TP18 CON1 CON1 CON1 UG030.0 May 20, 2015 FIGURE 20. ISL8117EVAL1Z SCHEMATIC d DNP R2 11K clk 1 TP19 CON1 mod 1 vcc5 1 fb 1 lg 1 ph 1 ug 1 boot 1 exbi 1 1 vin 1 en 1 ss 1 pg 1 rt 1u/6.3V 1 CON1 DNP R23 C8 1 C6 120p/50V R21 10 vcc5 1 C11 R15 C7 470p/100v 9 17 6 rt 100uF/16V 3.3u/14A 12 C1 4.7u/10V JMP VOUT C25 0.1u/25V Q1 0 R7 3K pg 1 vout Title Size A Date: ISL8117AEVAL1Z VIn:4.5~60V Vout: 3.3V 6A 600K Document Number <Doc> Wednesday, May 06, 2015 Rev B Sheet 1 of 1 User Guide 030 3 2 1 J3 CON1 1 BUK9K17-60EX ug R19 TP2 User Guide 030 ISL8117EVAL1Z Bill of Materials MANUFACTURER PART REFERENCE DESIGNATOR QTY UNIT ISL8117EVAL1ZREVBPCB 1 ea GRM32EC70J107ME15L 2 ea C0603X7R101-104KNE 2 GRM39X7R104K025AD DESCRIPTION MANUFACTURER PWB-PCB, ISL8117EVAL1Z, REVB, ROHS SHENZHEN MULTILAYER PCB TECHNOLOGY CO., LTD C10, C11 CAP, SMD, 1210, 100µF, 6.3V, 20%, X7S, ROHS MURATA ea C4, C22 CAP, SMD, 0603, 0.1µF, 100V, 10%, X7R, ROHS VENKEL 2 ea C25, C30 CAP, SMD, 0603, 0.1µF, 25V, 10%, X7R, ROHS MURATA ECJ1VB0J105K 2 ea C8, C9 CAP, SMD, 0603, 1µF, 6.3V, 10%, X5R, ROHS PANASONIC C1608C0G1H121J080AA 1 ea C6 CAP, SMD, 0603, 120pF, 50V, 5%, C0G, ROHS TDK C1608X7R1E224K 1 ea C2 CAP, SMD, 0603, 0.22µF, 25V, 10%, X7R, ROHS TDK VJ0603Y471KXBA 1 ea C7 CAP, SMD, 0603, 470pF, 100V, 10%, X7R, ROHS VISHAY GRM188R71E473KA01D 1 ea C3 CAP, SMD, 0603, 0.047µF, 25V, 10%, X7R, ROHS MURATA 0805ZD475MAT2A 1 ea C1 CAP, SMD, 0805, 4.7µF, 10V, 20%, X5R, ROHS AVX C1206X7R101-105KNE 2 ea C23, C24 CAP, SMD, 1206, 1µF, 100V, 10%, X7R, ROHS VENKEL CGA6M3X7S2A475K200AB 4 ea C13, C21, C28, C29 CAP, SMD, 1210, 4.7µF, 100V, 10%, X7S, ROHS TDK 0 ea C20 CAP, SMD, 1210, DNP-PLACE HOLDER, ROHS 7443340330 1 ea L1 COIL-PWR INDUCTOR, SMD, 8.4x7.9, 3.3µH, 20%, 14A, ROHS Wurth Electronics EMVH101GDA101MLH0S 1 ea C16 CAP, SMD, 16x16.5mm, 100µF, 100V, 20%, ALUM.ELEC., ROHS UNITED CHEMI-CON 1514-2 4 ea J1, J2, J3, J5 CONN-TURRET, TERMINAL POST, TH, ROHS KEYSTONE 5007 18 ea TP2-TP14, TP16-TP20 CONN-COMPACT TEST PT, VERTICAL, WHT, ROHS KEYSTONE 68000-236HLF 1 ea J7 CONN-HEADER, 1x3, BREAKAWY 1x36, 2.54mm, ROHS BERG/FCI 69190-202HLF 1 ea J6 CONN-HEADER, 1x2, RETENTIVE, 2.54mm, 0.230x0.120, ROHS BERG/FCI SPC02SYAN 2 ea J6, J7 CONN-JUMPER, SHORTING, 2P, BLACK, GOLD, ROHS SULLINS ISL8117FVEZ 1 ea U1 IC-55V SWITCHING CONTROLLER, 16P, HTSSOP, ROHS INTERSIL BUK9K17-60EX 1 ea Q1 TRANSIST-MOS, DUAL N-CHANNEL, SMD, 8P, 56LFPAK, 60V, 26A, ROHS NXP SEMICONDUCTOR RK73H1JT10R0F 1 ea R21 RES, SMD, 0603, 10Ω, 1/10W, 1%, TF, ROHS KOA ERJ-3EKF20R0V 1 ea R15 RES, SMD, 0603, 20Ω, 1/10W, 1%, TF, ROHS PANASONIC ERJ-3RQF2R2V 2 ea R8, R9 RES, SMD, 0603, 2.2Ω, 1/10W, 1%,TF, ROHS PANASONIC CR0603-10W-05R1FT 1 ea R26 RES, SMD, 0603, 5.1Ω, 1/10W, 1%, TF, ROHS VENKEL CR0603-10W-000T 5 ea R18, R19, R20, R22, R25 RES, SMD, 0603, 0Ω, 1/10W, TF, ROHS VENKEL CR0603-10W-1003FT 1 ea R16 RES, SMD, 0603, 100k, 1/10W, 1%, TF, ROHS VENKEL ERJ-3EKF1102V 2 ea R2, R3 RESISTOR, SMD, 0603, 11k, 1/10W, 1%, TF, ROHS PANASONIC RC0603FR-073KL 1 ea R7 RES, SMD, 0603, 3k, 1/10W, 1%, TF, ROHS YAGEO CR0603-10W-4992FT 1 ea R1 RES, SMD, 0603, 49.9k, 1/10W, 1%, TF, ROHS VENKEL 0 ea R4, R5, R6, R23, R24 RES, SMD, 0603, DNP-PLACE HOLDER, ROHS 0 ea C26, C27 RES, SMD, 1206, DNP, DNP, DNP, TF, ROHS 4 ea Four corners STANDOFF, M2.5, 10mm, METRIC, F/F, HEX, THREADED, ROHS R25-1001002 Submit Document Feedback 8 HARWIN INC UG030.0 May 20, 2015 User Guide 030 ISL8117EVAL1Z Bill of Materials (Continued) MANUFACTURER PART 29301 REFERENCE DESIGNATOR QTY UNIT DESCRIPTION MANUFACTURER 4 ea Four corners SCREW, M2.5, 6mm, METRIC, PANHEAD, SLOTTED, KEYSTONE STEEL, ROHS 0 ea C5, C31, C32 DO NOT POPULATE OR PURCHASE 0 ea D1 DO NOT POPULATE OR PURCHASE ISL8117EVAL1Z PCB Layout FIGURE 21. SILKSCREEN TOP FIGURE 22. TOP LAYER FIGURE 23. SECOND LAYER (SOLID GROUND) FIGURE 24. THIRD LAYER Submit Document Feedback 9 UG030.0 May 20, 2015 User Guide 030 ISL8117EVAL1Z PCB Layout (Continued) FIGURE 25. BOTTOM LAYER FIGURE 26. SILKSCREEN BOTTOM Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that the document is current before proceeding. For information regarding Intersil Corporation and its products, see www.intersil.com Submit Document Feedback 10 UG030.0 May 20, 2015