567MZ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP20 2.187x1.987
CASE 567MZ
ISSUE A
DATE 15 MAR 2016
SCALE 4:1
ÈÈ
ÈÈ
PIN A1
REFERENCE
E
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
D
DIM
A
A1
A2
b
D
D2
E
E2
e
0.05 C
2X
0.05 C
2X
TOP VIEW
A
0.10 C
A2
A1
GENERIC
MARKING DIAGRAM*
0.08 C
C
SIDE VIEW
NOTE 3
SEATING
PLANE
XXXXX
XXXXX
ALYW
G
e
20X
E2
b
0.05 C A B
0.03 C
MILLIMETERS
MIN
MAX
0.65
−−−
0.13
0.19
0.38 REF
0.17
0.23
2.187 BSC
0.058 BSC
1.987 BSC
0.112 BSC
0.35 BSC
e
E
D
C
B
A
D2
1 2 3 4
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
A1
0.35
PITCH
20X
0.35
PITCH
0.17
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON07057G
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP20 2.187X1.987
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON07057G
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY C. ENRIQUEZ.
03 DEC 2015
A
CHANGED PITCH FROM 0.40MM TO 0.35MM AND ADDED DIMENSIONS D2 AND
E2 FOR BUMP OFFSET FROM CENTER. REQ. BY C. ENRIQUEZ.
15 MAR 2016
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
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damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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© Semiconductor Components Industries, LLC, 2016
March, 2016 − Rev. A
Case Outline Number:
567MZ
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