05-08-1818

UH Package
20-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1818 Rev Ø)
0.70 ±0.05
5.50 ± 0.05
4.10 ± 0.05
2.60 REF
2.70 ± 0.05
2.70 ± 0.05
PACKAGE
OUTLINE
0.25 ±0.05
0.65 BSC
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 × 45°
CHAMFER
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 ± 0.10
0.75 ± 0.05
R = 0.05
TYP
R = 0.125
TYP
19 20
0.40 ± 0.10
PIN 1
TOP MARK
(NOTE 6)
5.00 ± 0.10
1
2.60 REF
2
2.70 ± 0.10
2.70 ± 0.10
(UH20) QFN 0208 REV Ø
0.200 REF
0.00 – 0.05
0.25 ± 0.05
0.65 BSC
NOTE:
BOTTOM VIEW—EXPOSED PAD
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
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