567MK

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP29 2.05x1.74
CASE 567MK
ISSUE O
DATE 09 OCT 2015
SCALE 4:1
E
PIN A1
REFERENCE
A
ÈÈÈ
ÈÈÈ
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF SOLDER BALLS.
4. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF SOLDER BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO DATUM C.
B
D
DIM
A
A1
A2
b
D
D2
E
E2
e
e1
BACKSIDE
COATING
0.10 C
2X
2X
0.10 C
TOP VIEW
DETAIL A
A2
A
DETAIL A
0.10 C
MILLIMETERS
MIN
MAX
−−−
0.46
0.09
0.15
0.29 REF
0.12
0.18
2.05 BSC
0.185 BSC
1.74 BSC
0.27 BSC
0.30 BSC
0.40 BSC
GENERIC
MARKING DIAGRAM*
0.08 C
A1
NOTE 3
C
SIDE VIEW
SEATING
PLANE
AWLYYWW
E2
e1
A
WL
YY
WW
e
F
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
e
E
D
C
D2
B
29X
A
b
0.05 C A B
1
2
3
4
5
= Assembly Location
= Wafer Lot
= Year
= Work Week
0.03 C
RECOMMENDED
SOLDERING FOOTPRINT*
0.40
PITCH
BOTTOM VIEW
0.30
PITCH
A1
0.30
PITCH
PACKAGE
OUTLINE
29X
0.12
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON05280G
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP29 2.05X1.74
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON05280G
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY J. STEFFLER.
DATE
09 OCT 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2015
October, 2015 − Rev. O
Case Outline Number:
567MK
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