05-08-1886

BGA Package
221-Lead (15mm × 11.25mm × 2.82mm)
(Reference LTC DWG# 05-08-1886 Rev A)
Z
A
aaa Z
E
Y
A2
X
SEE NOTES
DETAIL A
SEE NOTES
13
12
11
10
9
8
7
6
5
4
3
2
7
1
PIN 1
3
A
A1
PIN “A1”
CORNER
B
ccc Z
C
4
b
D
E
b1
MOLD
CAP
F
SUBSTRATE
// bbb Z
H
F
Z
H2
D
G
H1
J
DETAIL B
K
L
M
e
Øb (221 PLACES)
N
ddd M Z X Y
eee M Z
P
Q
R
S
aaa Z
4.80
4.00
3.20
2.40
1.60
0.80
0.00
0.80
1.60
2.40
3.75
4.80
4.00
3.20
2.40
1.60
0.80
0.00
0.80
1.60
2.40
3.20
4.00
4.80
5.60
6.40
2. ALL DIMENSIONS ARE IN MILLIMETERS
DIMENSIONS
5.60
SUGGESTED PCB LAYOUT
TOP VIEW
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
6.40
0.50 ±0.025 Ø 221x
b
G
DETAIL B
PACKAGE SIDE VIEW
3.20
4.25
4.00
4.80
e
DETAIL A
PACKAGE TOP VIEW
5.35
5.85
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
2.67
0.35
2.32
0.45
0.45
0.37
1.95
NOM
2.82
0.40
2.42
0.50
0.50
15.0
11.25
0.80
12.80
9.60
0.42
2.00
MAX
2.97
0.45
2.52
0.55
0.55
0.47
2.05
0.15
0.10
0.12
0.15
0.08
TOTAL NUMBER OF BALLS: 221
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
OR Sn Pb EUTECTIC
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 221 1112 REV A
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